Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2014
12/31/2014CN104253118A 半导体封装件 Semiconductor package
12/31/2014CN104253117A 半导体装置 Semiconductor device
12/31/2014CN104253116A 用于嵌入式管芯的封装组件及相关联的技术和配置 For embedded die package assembly and associated technologies and configurations
12/31/2014CN104253115A 用于半导体封装中减小的管芯到管芯间隔的底部填充材料流控制 Underfill material flow control is used to reduce the semiconductor die package to the die spaced
12/31/2014CN104253114A 嵌入式封装结构及其制造方法 Embedded package structure and manufacturing method
12/31/2014CN104253105A 半导体器件和形成低廓形3d扇出封装的方法 Semiconductor devices and form a low profile shape 3d fan-out package method
12/31/2014CN104253104A 管芯-管芯感应通信装置及方法 Die - die inductive communication device and method
12/31/2014CN104253102A 半导体器件和用于制造其的方法 The method of manufacturing a semiconductor device and means for its
12/31/2014CN104253101A 外部存储装置 An external storage device
12/31/2014CN104253056A 具有穿通电极的半导体封装及其制造方法 Having a semiconductor package and method of manufacturing the through electrodes
12/31/2014CN102832314B 封装载板及封装结构 Package substrate and package structure
12/31/2014CN102768995B 具有芯片外控制器的存储器装置及其制造方法 A memory device and manufacturing method of the controller chip
12/31/2014CN102693965B 封装堆迭结构 Stacked package structure
12/31/2014CN102593111B Igbt模块及其制作方法 Igbt module and its manufacturing method
12/31/2014CN102484186B 具有带有辐射出射侧和绝缘层的至少一个第一半导体本体的光电子模块及其制造方法 Optoelectronic module and its manufacturing method having a radiation exit side and with the insulating layer is at least one first semiconductor body
12/31/2014CN102208509B 发光器件、用于制造发光器件的方法以及发光器件封装 A light emitting device, a method of manufacturing the light emitting device and a light emitting device package
12/31/2014CN102194948B 发光器件和发光器件封装 The light emitting device and a light emitting device package
12/31/2014CN102054823B 半导体装置及其芯片选择方法 Semiconductor device and method of chip select
12/31/2014CN101996980B 功率半导体模块和用于装配功率半导体模块的方法 The power semiconductor module and a method for assembling a power semiconductor module
12/31/2014CN101989558B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/31/2014CN101859857B 一种led器件 One kind of led device
12/31/2014CN101471416B Led封装中有纹理的密封剂表面 Led package sealant textured surface
12/30/2014US8924903 Semiconductor device having plural memory chip
12/30/2014US8923782 Switching device with diode-biased field-effect transistor (FET)
12/30/2014US8923748 High frequency module and receiver
12/30/2014US8923008 Circuit board and method for manufacturing circuit board
12/30/2014US8923004 Microelectronic packages with small footprints and associated methods of manufacturing
12/30/2014US8922972 Integral module power conditioning system
12/30/2014US8922244 Three dimensional integrated circuit connection structure and method
12/30/2014US8922156 Solar power-generating equipment
12/30/2014US8922118 Light-emitting device
12/30/2014US8922101 Light-emitting device
12/30/2014US8922026 Chip package and fabrication method thereof
12/30/2014US8922024 Semiconductor packages including molding layers
12/30/2014US8922008 Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structure
12/30/2014US8922004 Copper bump structures having sidewall protection layers
12/30/2014US8922001 Semiconductor device
12/30/2014US8922000 Chip carriers, semiconductor devices including the same, semiconductor packages including the same, and methods of fabricating the same
12/30/2014US8921998 Semiconductor module
12/30/2014US8921991 Discrete three-dimensional memory
12/30/2014US8921983 Semiconductor package and method of forming similar structure for top and bottom bonding pads
12/30/2014US8921976 Using backside passive elements for multilevel 3D wafers alignment applications
12/30/2014US8921970 Semiconductor device and structure
12/30/2014US8921967 Integrated circuit combination of a target integrated circuit and a plurality of photovoltaic cells connected thereto using the top conductive layer
12/30/2014US8921879 Optical device and method for manufacturing same
12/30/2014US8921876 Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements
12/30/2014US8921874 Semiconductor light emitting device and method for manufacturing the same
12/30/2014US8921873 Light-emitting device
12/30/2014US8921870 Light emitting device
12/30/2014US8921161 Semiconductor device and method of forming EWLB package containing stacked semiconductor die electrically connected through conductive vias formed in encapsulant around die
12/30/2014US8921160 3D IC configuration with contactless communication
12/25/2014US20140377886 Method of manufacturing semiconductor device including grinding semiconductor wafer
12/25/2014US20140374924 Heterogeneous Integration Process Incorporating Layer Transfer in Epitaxy Level Packaging
12/25/2014US20140374923 Semiconductor apparatus and semiconductor system
12/25/2014US20140374922 Alignment in the Packaging of Integrated Circuits
12/25/2014US20140374917 Component in the form of a wafer level package and method for manufacturing same
12/25/2014US20140374913 Circuit arrangement and method for manufacturing the same
12/25/2014US20140374894 Package on package structrue and method for manufacturing same
12/25/2014US20140374889 Semiconductor device
12/25/2014US20140374856 Apparatus and Method for Preventing Stiction of MEMS Devices Encapsulated by Active Circuitry
12/25/2014US20140374801 Semiconductor device
12/25/2014US20140374794 Power semiconductor with a si chip and a wideband chip having matched loss and area ratios
12/25/2014US20140374779 Light-emitting device and light-emitting array
12/25/2014US20140374776 Optical-coupling semiconductor device
12/25/2014US20140374742 Light emitting display
12/24/2014CN204045628U 一种多碗杯结构的贴片led光源 SMD led light structure of a multi-cups
12/24/2014CN204045626U 多族阵列的发光二极管板上芯片封装结构 Light-emitting diode chip on board package multi-ethnic array
12/24/2014CN204045593U 一种红外遥控接收放大器的内屏蔽结构 Shield structure within a infrared remote control receiver amplifier
12/24/2014CN204045592U 一种红蓝双色发光二极管 One kind of red and blue color light-emitting diodes
12/24/2014CN204045591U 一种可增强发光效果的多彩灯珠 One kind can enhance the multi-colored lights glow beads
12/24/2014CN204045590U 一种侧入式大尺寸背光灯珠 A lateral-in large-size backlight lamp beads
12/24/2014CN204045589U 一种led-cob光源 One kind of led-cob light
12/24/2014CN204045588U 一种带端子的高导热cob模组光源 High thermal conductivity of a cob light module with terminal
12/24/2014CN204045587U 一种全角度发光封装模块 An all-angle light emitting package module
12/24/2014CN204045586U 一种超薄型高导热透明玻璃基板全周发光led灯丝模组 An ultra-thin transparent glass substrate with high thermal conductivity type full Zhoufa Guang led filament module
12/24/2014CN204045585U 一种新型led照明装置 A new led lighting device
12/24/2014CN204045584U 一种led cob光源 One kind of led cob light
12/24/2014CN204045583U 一种led发光条 One kind of led light bar
12/24/2014CN204045582U 芯片发光面积利用率高的交流高压的发光芯片 Chip light emitting area of ​​the AC high voltage, high utilization of light-emitting chips
12/24/2014CN204045581U 一种高温电源模块 A high-temperature power modules
12/24/2014CN104247578A 电路板组件 Circuit board assembly
12/24/2014CN104247247A 半导体模块 Semiconductor Modules
12/24/2014CN104247020A 可回流光电模块 Reflow photovoltaic modules
12/24/2014CN104247012A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/24/2014CN104241512A 发光装置 Light-emitting device
12/24/2014CN104241510A 发光装置 Light-emitting device
12/24/2014CN104241460A 光学组件 Optical Components
12/24/2014CN104241264A 电力用半导体装置 Power semiconductor device
12/24/2014CN104241263A 高低压隔离内埋功率模块 Buried within the high and low voltage power module isolation
12/24/2014CN104241262A 发光装置以及显示装置 A light emitting device and a display device
12/24/2014CN104241261A 一种led封装结构及方法 An encapsulation structure and method led
12/24/2014CN104241260A 具有高电子迁移率晶体管和单片集成半导体二极管的高压级联二极管 Having a high electron mobility transistor and the high voltage diode monolithically integrated semiconductor diode cascade
12/24/2014CN104241259A 半导体器件和电子器件 Semiconductor devices and electronic devices
12/24/2014CN104241258A 半导体器件 Semiconductor devices
12/24/2014CN104241257A 半导体器件 Semiconductor devices
12/24/2014CN104241256A 电子组件模块和制造该电子组件模块的方法 Electronic component modules and method of manufacturing the electronic component module
12/24/2014CN104241255A 电子组件模块及其制造方法 Module and method of manufacturing electronic components
12/24/2014CN104241240A 半导体封装件及其制法 Semiconductor package Jiqizhifa
12/24/2014CN104241226A 新型的高压晶闸管阀模块 The new high-voltage thyristor valve module
12/24/2014CN104241212A 柔性层叠封装体、包括其的电子系统及包括其的存储卡 Flexible laminate package, including its electronic system including a memory card and
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 ... 409