| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/18/2009 | CN101371353A Electronic device package, module and electronic device |
| 02/18/2009 | CN101371268A Memory card and method for manufacturing memory card |
| 02/18/2009 | CN101369611A Insertion type optical coupler array and application in preparation of hybrid integrated circuit |
| 02/18/2009 | CN101369575A Sheet type diode and preparation method thereof |
| 02/18/2009 | CN101369574A Cmos图像传感器封装 Cmos image sensor package |
| 02/18/2009 | CN101369566A Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same |
| 02/18/2009 | CN101369560A Packed electronic element |
| 02/18/2009 | CN100463336C Three-phase ac generator for vehicle |
| 02/18/2009 | CN100463171C Optical semiconductor device and method for manufacturing the same, electronic device, |
| 02/18/2009 | CN100463170C Multi-chip module integrated with RF property |
| 02/18/2009 | CN100463169C Mixed integrated circuit device and its manufacturing method |
| 02/18/2009 | CN100463168C Semiconductor luminous component |
| 02/18/2009 | CN100463167C Semiconductor package and method for forming the same |
| 02/18/2009 | CN100463147C Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device |
| 02/18/2009 | CN100463127C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 02/17/2009 | US7492188 Interconnection and input/output resources for programmable logic integrated circuit devices |
| 02/17/2009 | US7492043 Power module flip chip package |
| 02/17/2009 | US7492038 Semiconductor device |
| 02/17/2009 | US7491960 Radiographic apparatus and control method therefor |
| 02/17/2009 | US7491937 Two-wavelength image sensor picking up both visible and infrared images |
| 02/17/2009 | US7491894 Hybrid integrated circuit device |
| 02/12/2009 | WO2009020572A2 Stack packages using reconstituted wafers |
| 02/12/2009 | WO2009020061A1 High efficiency module |
| 02/12/2009 | WO2009000106A1 Led lighting device |
| 02/12/2009 | WO2008135142A4 Method for producing a circuit board having a cavity for the integration of components and circuit board and application |
| 02/12/2009 | US20090039918 Three dimensional integrated circuits |
| 02/12/2009 | US20090039498 Power semiconductor module |
| 02/12/2009 | US20090039457 Low crosstalk substrate for mixed-signal integrated circuits |
| 02/12/2009 | US20090039394 Semiconductor device |
| 02/12/2009 | DE112007000829T5 Kühler Cooler |
| 02/12/2009 | DE102004044166B4 Explosionsgeschützte Leuchte mit Leuchtdioden als Lichtquelle Explosion-proof lighting with LEDs as the light source |
| 02/11/2009 | EP2023407A1 Light-emitting device mounting substrate and method for producing same, light-emitting device module and method for manufacturing same, display, illuminating device, and traffic signal system |
| 02/11/2009 | EP2023391A2 Flexible LED screen |
| 02/11/2009 | EP2023390A1 Semiconductor device |
| 02/11/2009 | EP2022099A2 Solar collector arrangement with reflecting surface |
| 02/11/2009 | EP2021830A2 Deicing of radiation detectors in analytical instruments |
| 02/11/2009 | CN201194229Y Semiconductor package for integrated antenna |
| 02/11/2009 | CN101364622A High-power LED encapsulation construction |
| 02/11/2009 | CN101364593A Staggered offset stacking encapsulation construction having multistage omnibus bar in conductive wire support |
| 02/11/2009 | CN101364586A Construction for packaging substrate and preparation thereof |
| 02/11/2009 | CN101364585A Support, chip packaging construction having the support and manufacturing method therefor |
| 02/11/2009 | CN101364583A Capacitor embedded semi-conductor package substrate construction and preparation thereof |
| 02/11/2009 | CN101364580A Package and semiconductor device |
| 02/11/2009 | CN101364579A Semiconductor package, method of manufacturing the same and system containing the package |
| 02/11/2009 | CN101364550A Multi-chip stacking structure having silicon channel and preparation thereof |
| 02/11/2009 | CN101364549A Making method for white light LED |
| 02/11/2009 | CN101363923A Light collecting device |
| 02/11/2009 | CN100461490C Organic LED double panel module |
| 02/11/2009 | CN100461405C Semiconductor device |
| 02/11/2009 | CN100461404C 半导体器件 Semiconductor devices |
| 02/11/2009 | CN100461403C 半导体器件 Semiconductor devices |
| 02/11/2009 | CN100461402C Circuit device and method for manufacturing same |
| 02/11/2009 | CN100461401C Sesmiconductor device |
| 02/11/2009 | CN100461391C Semiconductor device |
| 02/11/2009 | CN100461388C Electronic power module comprising a rubber seal and corresponding production method |
| 02/11/2009 | CN100461383C 多层印刷线路板 Multilayer printed circuit boards |
| 02/11/2009 | CN100461371C Semiconductor chip, method for manufacturing semiconductor chip, semiconductor device and method for manufacturing semiconductor device |
| 02/11/2009 | CN100461356C Semiconductor component with at least one semiconductor chip on base chip serving as substrate and method for production thereof |
| 02/11/2009 | CN100461353C Method for manufacturing hybrid integrated circuit device |
| 02/11/2009 | CN100461338C Method of manufacturing optical devices and related improvements |
| 02/10/2009 | US7490271 Semiconductor device mounting chip having tracing function |
| 02/10/2009 | US7488973 High-heat-resistant semiconductor device |
| 02/10/2009 | US7488895 Method for manufacturing component built-in module, and component built-in module |
| 02/10/2009 | US7488674 Semiconductor device and manufacturing method thereof |
| 02/10/2009 | US7487585 Method of manufacturing a metal-ceramic circuit board |
| 02/10/2009 | US7487581 Method of manufacturing an inverter device |
| 02/05/2009 | WO2009017758A2 Reconstituted wafer stack packaging with after-applied pad extensions |
| 02/05/2009 | WO2009017132A1 Power conversion device and method for manufacturing the same |
| 02/05/2009 | WO2009017070A1 Multilayer semiconductor device |
| 02/05/2009 | WO2008141196A3 Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots |
| 02/05/2009 | US20090035896 High power mcm package with improved planarity and heat dissipation |
| 02/05/2009 | US20090034318 Switching device, rewritable logic integrated circuit, and memory device |
| 02/05/2009 | US20090032913 Component and assemblies with ends offset downwardly |
| 02/05/2009 | US20090032903 Multiple voltage integrated circuit and design method therefor |
| 02/05/2009 | US20090032684 Optical device and production method thereof |
| 02/05/2009 | US20090031563 Rearrangement sheet, semiconductor device and method of manufacturing thereof |
| 02/05/2009 | DE10322745B4 Leistungshalbleiter-Bauelement mit hoher Abstrahlungseffizienz Power semiconductor device having high radiation efficiency |
| 02/05/2009 | DE10236197B4 Harzversiegelte Halbleitervorrichtung The resin-sealed semiconductor device |
| 02/05/2009 | DE102008035708A1 LED-Lichtquelle mit erhöhter thermischer Leitfähigkeit LED light source with increased thermal conductivity |
| 02/05/2009 | DE102007036226A1 Anbringungsstruktur für LEDs, LED-Baugruppe, LED-Baugruppensockel, Verfahren zum Ausbilden einer Anbringungsstruktur The mounting structure for LEDs, LED module, LED module base, method for forming a mounting structure |
| 02/05/2009 | DE102007036048A1 Anordnung mit zumindest einem Halbleiterbauelement, insbesondere einem Leistungshalbleiterbauelement zur Leistungssteuerung hoher Ströme Assembly comprising at least one semiconductor component, in particular a power semiconductor device for power control of high currents |
| 02/05/2009 | DE102007035788A1 Waferfügeverfahren, Waferverbund sowie Chip Wafer bonding process, the wafer assembly and chip |
| 02/05/2009 | DE102007034949A1 Einheitlich normierte Leistungspackages Uniformly normalized power packages |
| 02/04/2009 | EP2020683A1 Semiconductor device and method for manufacturing same |
| 02/04/2009 | EP2020037A2 Light emitting diodes with improved light collimation |
| 02/04/2009 | EP2020028A2 Assembly, chip and method of operating |
| 02/04/2009 | EP1169735B1 Semiconductor radiation emitter package |
| 02/04/2009 | CN201191612Y Anti-static LED having protection function |
| 02/04/2009 | CN201191611Y Full-colored SMD |
| 02/04/2009 | CN201191610Y RGB LED construction |
| 02/04/2009 | CN201191609Y RGB LED construction |
| 02/04/2009 | CN101361182A Interposer with built-in passive part |
| 02/04/2009 | CN101360392A Circuit board construction embedded with passive component and stack connection construction |
| 02/04/2009 | CN101359661A Multi-die dc-dc boost power converter with efficient packaging |
| 02/04/2009 | CN101359660A Semiconductor apparatus with thin semiconductor film |
| 02/04/2009 | CN101359659A Semiconductor package, semiconductor module and device comprising the module |
| 02/04/2009 | CN101359658A Multi-chip encapsulation construction of large power |
| 02/04/2009 | CN101359657A Multi-die dc-dc boost power converter with efficient packaging |
| 02/04/2009 | CN101359656A Image sensor package and fabrication method thereof |
| 02/04/2009 | CN101359655A LED encapsulation construction using ceramic as substrate and preparation thereof |