| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/05/2009 | DE102007041852A1 High power LED module, has semicircular hollow portion extending into transparent carrier on side of LED and having evaporable cooling agent, and electrode structures provided in transparent carrier |
| 03/05/2009 | DE102004033401B4 Montageanordnung für eine elektronische Baueinheit und Baueinheit damit A mounting arrangement for an electronic assembly and assembly so that |
| 03/04/2009 | EP2031714A1 Optoelectronic circuit with a photoreceiver and a laser diode, and a module comprising the same |
| 03/04/2009 | EP2031657A1 Package structure for a high-luminance light source |
| 03/04/2009 | CN201204205Y High-power LED encapsulation structure |
| 03/04/2009 | CN201204204Y Ultra-high-power LED die set light source structure |
| 03/04/2009 | CN201204203Y Radiating device for high-power LED |
| 03/04/2009 | CN201204202Y Chip packaging structure |
| 03/04/2009 | CN201204201Y Ultra-high-power LED die set light source bracket |
| 03/04/2009 | CN101379612A Semiconductor apparatus |
| 03/04/2009 | CN101378624A Module structure integrating perimeter circuit and manufacturing method thereof |
| 03/04/2009 | CN101378086A Solar cell receiver having an insulated bypass diode |
| 03/04/2009 | CN101378053A High-side and low-side nmosfets composite package |
| 03/04/2009 | CN101378052A Integrated circuit package with passive component |
| 03/04/2009 | CN101378051A Semiconductor device and manufacturing method thereof |
| 03/04/2009 | CN101378050A Multi-substrate chunk type packaging piece and manufacturing method thereof |
| 03/04/2009 | CN101378049A Inner-burying type multifunctional integration type structure and preparation method thereof |
| 03/04/2009 | CN101378048A Packaging structure for stacking multiple chips |
| 03/04/2009 | CN101378044A Wiring board, method of designing the same, and electronic apparatus |
| 03/04/2009 | CN101377827A Ic卡 Ic Card |
| 03/04/2009 | CN101377826A Radio frequency and/or radio frequency identification electronic filemark/ apparatus with integration substrate, and manufacturing and using method thereof |
| 03/04/2009 | CN101377568A Double-light path imaging system of full-automatic LED lead bonding machine |
| 03/04/2009 | CN100466308C Linear light source and production method thereof and surface emission device |
| 03/04/2009 | CN100466306C Full-colour flexible light-emitting lamp-bar device |
| 03/04/2009 | CN100466250C Electronic elements with self-assembling microstructures |
| 03/04/2009 | CN100466244C The production method for producing semiconductor package |
| 03/04/2009 | CN100466235C Semiconductor package with two semiconductor tube cores arranged in a pubic clamps |
| 03/03/2009 | US7498839 Low power zones for programmable logic devices |
| 03/03/2009 | US7498675 Semiconductor component having plate, stacked dice and conductive vias |
| 03/03/2009 | US7498674 Semiconductor module having a coupling substrate, and methods for its production |
| 03/03/2009 | US7498661 Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus |
| 03/03/2009 | US7498249 Method of forming a connecting conductor and wirings of a semiconductor chip |
| 03/03/2009 | US7498201 Method of forming a multi-die semiconductor package |
| 03/03/2009 | US7498200 Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
| 03/03/2009 | US7498195 Multi-chip semiconductor connector assembly method |
| 03/03/2009 | US7498194 Semiconductor arrangement |
| 02/26/2009 | WO2009025078A1 Connection structure and connection method |
| 02/26/2009 | WO2008154255A3 Electrically interconnected stacked die assemblies |
| 02/26/2009 | WO2008005081A3 Method or providing a customer with increased integrated circuit performance |
| 02/26/2009 | US20090053854 Memory circuit arrangement and method for the production thereof |
| 02/26/2009 | US20090052219 Memory circuit arrangement and method for the production thereof |
| 02/26/2009 | US20090052178 Configuration of multiple LED modules |
| 02/26/2009 | US20090051029 Flip-chip type semiconductor device |
| 02/26/2009 | US20090051025 Fan out type wafer level package structure and method of the same |
| 02/26/2009 | US20090050806 Visible light and ir combined image camera with a laser pointer |
| 02/26/2009 | DE102008032953A1 Integrierte Schaltung, Schaltungssystem und Herstellungsverfahren An integrated circuit, circuit system and production method |
| 02/26/2009 | DE102008030348A1 Chipstapelstruktur und Verfahren zu ihrer Herstellung Stack structure and process for their preparation |
| 02/26/2009 | DE102008029318A1 Lichtemittierende Vorrichtungsgehäuse, die Lichtstreupartikel unterschiedlicher Grösse verwenden A light emitting device housing using light scattering particles of different size |
| 02/26/2009 | DE102008029194A1 Verfahren zum Ausbilden einer Metallelektrode eines Systems in einem Gehäuse A method of forming a metal electrode of a system in a housing |
| 02/26/2009 | DE102007039916A1 Aufbau- und Verbindungstechnik von Modulen mittels dreidimensional geformter Leadframes Packaging technology of modules using three-dimensional molded leadframe |
| 02/26/2009 | DE102007037798A1 Anordnung von Halbleiterchips mit integrierter Schaltung und Verfahren zum Fertigen derselben Arrangement of semiconductor integrated circuit chips and method of manufacturing the same |
| 02/26/2009 | DE102006033870B4 Elektronisches Bauteil mit mehreren Substraten sowie ein Verfahren zur Herstellung desselben The same electronic component having a plurality of substrates, and a process for preparing |
| 02/26/2009 | DE10191585B4 Halbleitervorrichtung Semiconductor device |
| 02/26/2009 | DE10063876B4 Aus einer Vielzahl von Leuchtdioden bestehende Lichtquelle For a variety of light-emitting diodes existing light source |
| 02/25/2009 | EP2028692A1 Semiconductor device |
| 02/25/2009 | EP2028690A2 Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same |
| 02/25/2009 | EP2028689A2 System and method for supporting one or more heat-generating electrical devices |
| 02/25/2009 | EP2027412A2 Lighting device |
| 02/25/2009 | EP1716602A4 Hydrogen generator photovoltaic electrolysis reactor system |
| 02/25/2009 | EP1573799A4 Three-dimensional device fabrication method |
| 02/25/2009 | CN201199521Y Combination type internal memory radiating device |
| 02/25/2009 | CN101375299A Memory card and memory card manufacturing method |
| 02/25/2009 | CN101373921A Generator-motor apparatus, drive system including generator-motor apparatus, and computer-readable recording medium |
| 02/25/2009 | CN101373764A 半导体器件 Semiconductor devices |
| 02/25/2009 | CN101373763A Led |
| 02/25/2009 | CN101373762A 功率半导体模块 Power semiconductor module |
| 02/25/2009 | CN101373761A Multi-chip module package |
| 02/25/2009 | CN101373760A High heat dissipation memory module structure |
| 02/25/2009 | CN101373759A Semiconductor-packaged stacking combination and used stacked semiconductor packaging piece thereof |
| 02/25/2009 | CN101373753A Switching assembly for an aircraft ignition system |
| 02/25/2009 | CN101373722A Semiconductor device and manufacturing method for the same |
| 02/25/2009 | CN101373719A Manufacturing method of semiconductor device having relay board |
| 02/25/2009 | CN100464439C LED package structure and method for manufacturing the same |
| 02/25/2009 | CN100464419C Laminated semiconductor device |
| 02/25/2009 | CN100464418C Semiconductor device and manufacturing method therefor |
| 02/25/2009 | CN100464414C Soft soldering method for semiconductor components and semiconductor device |
| 02/25/2009 | CN100464411C Encapsulation method and structure of light emitting diode |
| 02/25/2009 | CN100464400C Semiconductor package stacking structure and its preparing method |
| 02/24/2009 | US7496223 Imaging device including optimized imaging correction |
| 02/24/2009 | US7495344 Semiconductor apparatus |
| 02/24/2009 | US7495334 Stacking system and method |
| 02/24/2009 | US7495326 Stacked electronic structures including offset substrates |
| 02/24/2009 | US7495319 Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same |
| 02/24/2009 | US7495276 Radio frequency arrangement, method for producing a radio frequency arrangement and use of the radio frequency arrangement |
| 02/24/2009 | US7495179 Components with posts and pads |
| 02/24/2009 | US7494845 Method of forming a thin wafer stack for a wafer level package |
| 02/19/2009 | WO2009022441A1 Twin chip-mounted diode |
| 02/19/2009 | WO2009021633A1 Electrical device and drive |
| 02/19/2009 | WO2009005898A4 Die attachment, die stacking, and wire embedding using film |
| 02/19/2009 | US20090045446 Power semiconductor device |
| 02/19/2009 | DE112006003771T5 Auf Chipebene integrierte passive Hochfrequenzelemente, Verfahren zu ihrer Herstellung und Systeme, die diese enthalten At the chip level built-in passive radio frequency elements, to processes for their preparation and to systems incorporating these |
| 02/19/2009 | DE102008017569A1 Verfahren zur Herstellung eines organischen Substrats mit eingebetteten Aktivchips A process for producing an organic substrate with embedded active chips |
| 02/19/2009 | DE102007040149A1 Verfahren zur Herstellung eines Halbleiterchipmoduls und einer Halbleiterchipverpackung A process for producing a semiconductor chip module and a semiconductor chip packaging |
| 02/19/2009 | DE102007037490A1 Gestapelte Schaltungen Stacked circuits |
| 02/19/2009 | DE102007015731B4 Verfahren zur Herstellung einer Halbleitervorrichtung, sowie hiermit hergestellte Halbleitervorrichtung A process for producing a semiconductor device, and semiconductor device produced therewith |
| 02/18/2009 | EP2026381A2 Fully integrated RF transceiver integrated circuit |
| 02/18/2009 | EP2025995A2 Variable optics spot module |
| 02/18/2009 | EP2024997A2 Double-sided integrated circuit chips |
| 02/18/2009 | CN201196952Y Multi-work LED |
| 02/18/2009 | CN101371358A Package for a light emitting diode with integrated electrostatic discharge protection |