| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/19/2009 | US20090072389 Structure and method for forming a capacitively coupled chip-to-chip signaling interface |
| 03/19/2009 | US20090072356 High-Heat-Resistant Semiconductor Device |
| 03/19/2009 | DE202009000162U1 Elektronisches Bauteil mit einem programmierbaren Baustein Electronic component comprising a programmable module |
| 03/19/2009 | DE10221891B4 Leistungshalbleitervorrichtung Power semiconductor device |
| 03/19/2009 | DE102007054039A1 LED for use in e.g. chip array, has light converter provided with fluid for light conversion, converter material present in light converter, and semiconductor chip with emission surface on which light produced by chip is emitted |
| 03/19/2009 | DE102007044198A1 Opto-electronic component e.g. service mountable device, has diode chip and electrostatic discharge protection element arranged on sides of carrier, where sides are opposite to each other |
| 03/19/2009 | DE102007043355A1 LED-Modul, LED-Leuchtmittel und LED Leuchte für die energie-effiziente Wiedergabe von weißem Licht LED module, LED bulbs and LED light for energy-efficient reproduction of white light |
| 03/18/2009 | EP2037500A1 High performance semiconductor module |
| 03/18/2009 | EP2037497A1 Semiconductor package, its manufacturing method, semiconductor device, and electronic device |
| 03/18/2009 | EP2036137A2 Multicolor led assembly with improved color mixing |
| 03/18/2009 | EP2036127A1 Stackable ic package with top and bottom interconnect |
| 03/18/2009 | EP2036126A2 Method for achieving very high bandwidth between the levels of a cache hierarchy in 3-dimensional structures, and a 3-dimensional structure resulting therefrom |
| 03/18/2009 | CN201210492Y PNP type large current large power multiple chip Darlington transistor |
| 03/18/2009 | CN101388389A 半导体器件 Semiconductor devices |
| 03/18/2009 | CN101388388A 半导体装置 Semiconductor device |
| 03/18/2009 | CN101388387A Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip typ |
| 03/18/2009 | CN101388386A Automotive power inverter with reduced capacitive coupling |
| 03/18/2009 | CN101388385A Semiconductor device |
| 03/18/2009 | CN101388384A Semiconductor package with reduced volume and signal transfer path |
| 03/18/2009 | CN101388383A Semiconductor package and method for manufacturing the same |
| 03/18/2009 | CN101388382A Staggered offset stacking encapsulation construction having omnibus bar of metal welding pad in conductive wire support |
| 03/18/2009 | CN101388381A Multi-chip stacking construction having metal spacer |
| 03/18/2009 | CN101388380A Multi-chip stacking construction for lead frame on chip and chip on lead frame |
| 03/18/2009 | CN101388379A Illuminating diode module |
| 03/18/2009 | CN101388369A Pressure contact three-phase converter module |
| 03/18/2009 | CN101388347A Multi-wave length illuminating diode array packaging module and packaging method thereof |
| 03/18/2009 | CN101387549A Selfluminous device |
| 03/18/2009 | CN100470856C Solid-crystal conductive and heat-conductive packing structure of light-emitting diodes |
| 03/18/2009 | CN100470852C Semiconductor light-emitting device, manufacturing method thereof, and electronic image pickup device |
| 03/18/2009 | CN100470797C Method for preparing a plurality of connected optoelectronic devices and corresponding optoelectronic devices |
| 03/18/2009 | CN100470796C 半导体器件 Semiconductor devices |
| 03/18/2009 | CN100470795C Pluggable module |
| 03/18/2009 | CN100470794C 半导体器件 Semiconductor devices |
| 03/18/2009 | CN100470793C Semiconductor device and method of manufacturing semiconductor device |
| 03/18/2009 | CN100470792C Radiating type stereo package structure and its manufacturing method |
| 03/18/2009 | CN100470791C Semiconductor apparatus having stacked semiconductor components and manufacturing method thereof |
| 03/18/2009 | CN100470790C Semiconductor apparatus |
| 03/18/2009 | CN100470772C Solder-free PCB assembly |
| 03/18/2009 | CN100470766C Semiconductor device and manufacturing method thereof |
| 03/18/2009 | CN100470003C Laminated glass and structural glass with integrated lighting, sensors and electronics |
| 03/17/2009 | US7505276 Semiconductor module provided with contacts extending through the package |
| 03/17/2009 | US7505273 Cooling body and rectifier module for an electrical machine |
| 03/17/2009 | US7504858 Configurable integrated circuit with parallel non-neighboring offset connections |
| 03/17/2009 | US7504729 Semiconductor device with extraction electrode |
| 03/17/2009 | US7504717 Semiconductor device |
| 03/17/2009 | US7503155 Method for packaging a tape substrate |
| 03/12/2009 | WO2009032539A2 Semiconductor assemblies and methods of manufacturing such assemblies |
| 03/12/2009 | WO2009032398A1 Interconnect in a multi-element package |
| 03/12/2009 | WO2009032153A2 Memory device interface methods, apparatus, and systems |
| 03/12/2009 | WO2009031251A1 Wiring substrate and method for manufacturing the same |
| 03/12/2009 | WO2009030562A1 Method for the production and contacting of electronic components by means of a substrate plate, particularly a dcb ceramic substrate plate |
| 03/12/2009 | US20090067210 Three dimensional structure memory |
| 03/12/2009 | US20090067135 Semiconductor Package Having Socket Function, Semiconductor Module, Electronic Circuit Module and Circuit Board with Socket |
| 03/12/2009 | US20090066475 Radiographic apparatus and control method therefor |
| 03/12/2009 | US20090065937 Structure of high performance combo chip and processing method |
| 03/12/2009 | US20090065922 Semiconductor device package structure |
| 03/12/2009 | US20090065894 Electronic circuit device having silicon substrate |
| 03/12/2009 | DE102007044567A1 Beleuchtungseinrichtung mit mehreren steuerbaren Leuchtdioden Illumination device having a plurality of controllable LEDs |
| 03/12/2009 | DE102007044566A1 Beleuchtungssystem Lighting system |
| 03/12/2009 | DE102007043192A1 Leuchtdioden-Modul Light-emitting module |
| 03/12/2009 | DE102007043001A1 Bandverfahren für elektronische Bauelemente, Module und LED-Anwendungen Band method for electronic components, modules and LED applications |
| 03/11/2009 | EP2034521A2 Fluid cooled semiconductor power module having double-sided cooling |
| 03/11/2009 | EP2033230A2 Solar cells arrangement |
| 03/11/2009 | EP2033220A2 Stack die packages |
| 03/11/2009 | EP1387412B1 Light source device using led, and method of producing same |
| 03/11/2009 | CN201207393Y Large power self-cooling thyratron transistor valve and vehicle for mounting |
| 03/11/2009 | CN201207392Y Electronic system encapsulation construction |
| 03/11/2009 | CN101385142A Semiconductor module and drive device for hybrid vehicle having the same |
| 03/11/2009 | CN101385140A Microelectronic assemblies having very fine pitch stacking |
| 03/11/2009 | CN101383344A Horizontal assembled type thick film circuit apparatus and electronic equipment |
| 03/11/2009 | CN101383343A Wireless communication device |
| 03/11/2009 | CN101383342A Semiconductor component and method of manufacture |
| 03/11/2009 | CN101383341A Module of LED |
| 03/11/2009 | CN101383340A Semiconductor power device having a stacked discrete inductor structure |
| 03/11/2009 | CN101383334A Lead frame, semiconductor device, and method of manufacturing semiconductor device |
| 03/11/2009 | CN101383295A Process for producing optical semiconductor device and slice used in same process |
| 03/11/2009 | CN100468728C Multiple chip semi-conductor packaging structure and encapsulation method |
| 03/11/2009 | CN100468727C Stacking structure for semiconductor packaging assembly |
| 03/11/2009 | CN100468725C Anti-electrostatic discharging radiating module and system thereof |
| 03/11/2009 | CN100468719C Overlappable semiconductor device and method of manufacturing the same |
| 03/11/2009 | CN100468716C Electronic device |
| 03/11/2009 | CN100468712C Through electrode, spacer provided with the through electrode, and method of manufacturing the same |
| 03/11/2009 | CN100468709C Luminous modular and its light source device |
| 03/10/2009 | US7501707 Multichip semiconductor package |
| 03/10/2009 | US7501702 Integrated transistor module and method of fabricating same |
| 03/10/2009 | US7501700 Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
| 03/10/2009 | US7501309 Standoffs for centralizing internals in packaging process |
| 03/05/2009 | WO2009029335A1 Detachable interconnect for configurable width memory system |
| 03/05/2009 | WO2009009436A3 Packaged semiconductor assemblies and methods for manufacturing such assemblies |
| 03/05/2009 | US20090057919 Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
| 03/05/2009 | US20090057914 Multiple chip semiconductor device |
| 03/05/2009 | US20090057901 Structure of high performance combo chip and processing method |
| 03/05/2009 | US20090056988 Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
| 03/05/2009 | DE102008039706A1 Halbleiterbauelement Semiconductor device |
| 03/05/2009 | DE102008034164A1 Halbleitermodul Semiconductor module |
| 03/05/2009 | DE102007058703A1 Array-type light emitting device, has light emitting chip emitting part of visible light, where visible light with wavelength range is mixed with projected light, which is emitted by LED chip, in order to make device to produce white light |
| 03/05/2009 | DE102007058700A1 Array type light emitting device, has set of chips absorbing part of visible light, where visible light with wavelength range is mixed with projected light, red light, green light and yellow light, and is mixed with amber colored light |
| 03/05/2009 | DE102007041926A1 Method for electrical insulation of unpackaged electronic construction element, particularly high power element or semiconductor high power element, involves fastening or electrical contacting of connection surface on lower surface |
| 03/05/2009 | DE102007041921A1 Verfahren zur Herstellung und Kontaktierung von elektronischen Bauelementen mittels einer Substratplatte, insbesondere DCB-Keramik-Substratplatte A process for preparing and contacting of electronic components by means of a substrate plate, in particular DCB-ceramic substrate board |
| 03/05/2009 | DE102007041896A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device |