| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/02/2009 | DE102007044685B3 Elektronisches System und Verfahren zur Herstellung eines dreidimensionalen elektronischen Systems The electronic system and method for producing a three-dimensional electronic system |
| 04/02/2009 | DE102007044046A1 Power semiconductor module, has conductor section connected at side of frame, such that connection element is fixed in its position relative to substrate by positioning of element and frame relative to frame and element, respectively |
| 04/02/2009 | DE102006005645B4 Stapelbarer Baustein, Bausteinstapel und Verfahren zu deren Herstellung Stackable building block, block stack and processes for their preparation |
| 04/01/2009 | EP2043412A1 Conductor rail with heat conduction |
| 04/01/2009 | EP2043152A2 Electronic apparatus with stacked semiconductor chips and manufacturing method thereof |
| 04/01/2009 | EP2043151A2 Ray-emitting device |
| 04/01/2009 | EP2042983A2 Modular image display |
| 04/01/2009 | EP2041790A2 Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements |
| 04/01/2009 | EP1327265B1 Electronic module having canopy-type carriers |
| 04/01/2009 | CN201215806Y Package construction and component for LED lamp |
| 04/01/2009 | CN201215805Y LTCC integrated package millimeter wave component |
| 04/01/2009 | CN101401206A Circuit module, wireless communication apparatus and circuit module manufacturing method |
| 04/01/2009 | CN101401197A 电子元器件模块 Electronic Component Module |
| 04/01/2009 | CN101399263A Circuit device |
| 04/01/2009 | CN101399262A Power semiconductor arrangement |
| 04/01/2009 | CN101399261A Semiconductor package and method of fabricating the same |
| 04/01/2009 | CN101399260A Circuit module |
| 04/01/2009 | CN101399259A Circuit device and method of manufacturing the same |
| 04/01/2009 | CN101399258A 半导体装置 Semiconductor device |
| 04/01/2009 | CN101399257A Method and structure of expanding, upgrading, or fixing multi-chip package |
| 04/01/2009 | CN101399256A Electronic apparatus and manufacturing method thereof |
| 04/01/2009 | CN101399250A Semiconductor chip and semiconductor device having a plurality of semiconductor chips |
| 04/01/2009 | CN100474988C Packaging structure of two-side organic electroluminescence module and packaging method |
| 04/01/2009 | CN100474640C Semiconductor light emitting devices and sub-support and methods for forming the same |
| 04/01/2009 | CN100474583C LED array with temperature sensor |
| 04/01/2009 | CN100474582C Mixed integrated circuit device and manufacturing method thereof |
| 04/01/2009 | CN100474581C Bridging multi-chip packaging structure |
| 04/01/2009 | CN100474580C 发光装置 Light-emitting device |
| 04/01/2009 | CN100474579C 电路装置 Circuit means |
| 04/01/2009 | CN100474576C Semiconductor device |
| 04/01/2009 | CN100474573C Semiconductor device and manufacturing method thereof |
| 04/01/2009 | CN100474433C Stacked memory, memory module and memory system |
| 04/01/2009 | CN100474094C Light source device for taking picture |
| 03/31/2009 | US7511536 Cells of a customizable logic array device having independently accessible circuit elements |
| 03/31/2009 | US7511380 Semiconductor chip and method manufacturing the same |
| 03/31/2009 | US7511315 Semiconductor device and manufacturing method therefor |
| 03/31/2009 | US7510911 Semiconductor apparatus and method of manufacturing the same |
| 03/31/2009 | US7510910 Semiconductor device and production method thereof |
| 03/31/2009 | US7510888 LED arrangement |
| 03/31/2009 | US7510885 Method of preparing electronically connected optoelectronic devices, and optoelectronic devices |
| 03/31/2009 | US7510299 LED lighting device for replacing fluorescent tubes |
| 03/31/2009 | CA2540119C Illuminated electric toothbrushes |
| 03/26/2009 | WO2009038169A1 Semiconductor device and its fabrication method |
| 03/26/2009 | WO2009038042A1 Laminated mounting structure and method for manufacturing laminated mounting structure |
| 03/26/2009 | WO2009037878A1 Semiconductor device and wire bonding method |
| 03/26/2009 | US20090079496 Multi-chip package for reducing parasitic load of pin |
| 03/26/2009 | US20090079066 Integrated circuit packaging system with passive components |
| 03/26/2009 | US20090079061 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 03/26/2009 | US20090079017 Semiconductor device having multiple substrates |
| 03/26/2009 | US20090078968 Integrated circuit device and method for forming the same |
| 03/26/2009 | DE10244791B4 Vorrichtung zur Kühlung von elektronischen Bauelementen A device for cooling of electronic components |
| 03/25/2009 | EP2038929A2 Method for producing a matrix of individual electronic components and matrix produced thereby |
| 03/25/2009 | EP2001050A9 Method for manufacturing substrate having electric component |
| 03/25/2009 | EP1747706B1 Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 03/25/2009 | CN201213227Y Multifunctional input terminal |
| 03/25/2009 | CN201213136Y Led |
| 03/25/2009 | CN201213135Y LED chip packaging construction having highly efficient heat radiating substrate |
| 03/25/2009 | CN201213134Y Package construction for LED chip |
| 03/25/2009 | CN201212655Y High-brightness polycrystal packaged LED antisymmetric arrangement apparatus |
| 03/25/2009 | CN101395715A Electronic device package, module and electronic device |
| 03/25/2009 | CN101393948A Front-back enclosing type LED encapsulation construction and encapsulation method |
| 03/25/2009 | CN101393908A Encapsulation construction of multi-chip stack |
| 03/25/2009 | CN101393899A Semiconductor device |
| 03/25/2009 | CN101393876A Method of forming a semiconductor die having a sloped edge for receiving an electrical connector |
| 03/25/2009 | CN101393873A Stacked semiconductor chips |
| 03/25/2009 | CN101393871A Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 03/25/2009 | CN101392892A Array type illuminating device with high colour rendering |
| 03/25/2009 | CN101392891A Array type illuminating device with high colour rendering |
| 03/25/2009 | CN100472832C Radial power MHz ultrasound transducer |
| 03/25/2009 | CN100472823C Light-emitting device |
| 03/25/2009 | CN100472794C Large-area photovoltaic device |
| 03/25/2009 | CN100472785C Solar battery LED interlayer for photoelectric curtain wall glass and use thereof |
| 03/25/2009 | CN100472784C Light-emitting diode module and light-emitting diode bulb made of the same |
| 03/25/2009 | CN100472783C Contact method and device generated by using the method |
| 03/25/2009 | CN100472782C Semiconductor devices |
| 03/25/2009 | CN100472781C Multiple chips integrated module |
| 03/25/2009 | CN100472780C Electronic component and method for manufacturing the same |
| 03/25/2009 | CN100472779C Module part |
| 03/25/2009 | CN100472778C Semiconductor device with power module housed in casing |
| 03/25/2009 | CN100472777C Physical quantity sensor and manufacturing method therefor |
| 03/25/2009 | CN100472776C Small radio communication module and manufacturing method thereof |
| 03/25/2009 | CN100472768C Electronic packaging materials for use with low-k dielectric-containing semiconductor devices and method for improving reliability thereof |
| 03/25/2009 | CN100472763C Semiconductor packing structure comprising passive element |
| 03/25/2009 | CN100472762C Package circuit board and forming method thereof |
| 03/25/2009 | CN100472722C Conductive bond for through-wafer interconnection |
| 03/25/2009 | CN100472119C Vehicular lamp |
| 03/24/2009 | US7508256 Integrated circuit with signal bus formed by cell abutment of logic cells |
| 03/24/2009 | US7508238 Semiconductor integrated circuit device |
| 03/24/2009 | US7508234 Optically reconfigurable gate array write state inspection method, write state inspection device, and optically reconfigurable gate array |
| 03/24/2009 | US7508068 Semiconductor module and power conversion device |
| 03/24/2009 | US7508060 Multi-chip semiconductor connector assemblies |
| 03/24/2009 | US7507602 Semiconductor device and method of manufacturing the same |
| 03/24/2009 | US7507302 Method for producing nanocomposite magnet using atomizing method |
| 03/24/2009 | US7506438 Low profile integrated module interconnects and method of fabrication |
| 03/19/2009 | WO2009036308A1 Hybrid photovoltaically active layer and method for forming such a layer |
| 03/19/2009 | WO2009035941A1 Multi-chip systems with optical bypass |
| 03/19/2009 | WO2009034993A1 Power semiconductor chip, power semiconductor module, inverter device, and inverter-integrated type motor |
| 03/19/2009 | WO2009016584A3 Light output device |
| 03/19/2009 | WO2008112883A3 Die attachment method with a covex surface underfill |
| 03/19/2009 | US20090073665 Memory card |