| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/15/2009 | EP2047510A1 Led mosaic |
| 04/15/2009 | EP2047500A1 Metal filled through via structure for providing vertical wafer-to wafer interconnection |
| 04/15/2009 | CN201222499Y Flip LED integrated chip with high on-state voltage |
| 04/15/2009 | CN201222498Y Packaging structure for luminous diode chip with high efficiency crossrange luminous effect |
| 04/15/2009 | CN201221690Y LED plane illuminating device |
| 04/15/2009 | CN201221689Y Pink LED illuminating device |
| 04/15/2009 | CN101410981A Light sensor |
| 04/15/2009 | CN101410976A Method for manufacturing substrate having electric component |
| 04/15/2009 | CN101409279A Semiconductor device including electronic component coupled to a backside of a chip |
| 04/15/2009 | CN101409278A Glass substrate for planar display and IC chip for display |
| 04/15/2009 | CN101409272A Ring-shaped surface adherence type conductor holder |
| 04/15/2009 | CN101409266A Package structure |
| 04/15/2009 | CN101409241A Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device |
| 04/15/2009 | CN100479154C Light emitting diode packaging structure and method capable of increasing luminous efficiency |
| 04/15/2009 | CN100479153C Photoelectric semiconductor element with high light emitting efficiency |
| 04/15/2009 | CN100479152C Semiconductor device, electronic appts. their mfg. methods and electronic instrument |
| 04/15/2009 | CN100479151C Multi-chip package |
| 04/15/2009 | CN100479150C Super long alignment infrared focus plane detector |
| 04/15/2009 | CN100479134C Method for forming an encapsulated device and structure |
| 04/15/2009 | CN100479105C Adhesive sheet semiconductor device manufacturing method using the adhesive sheet |
| 04/14/2009 | US7518409 Input stage of semiconductor device with multiple pads of common function, and multi-chip package having the same |
| 04/14/2009 | US7518401 Differential clock tree in an integrated circuit |
| 04/14/2009 | US7518400 Barrel shifter implemented on a configurable integrated circuit |
| 04/14/2009 | US7518228 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 04/14/2009 | US7518227 Multiple die stack apparatus employing T-shaped interposer elements |
| 04/14/2009 | US7518223 Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer |
| 04/14/2009 | US7518158 Semiconductor light emitting devices and submounts |
| 04/14/2009 | US7518149 Light emitting mesa structures with high aspect ratio and near-parabolic sidewalls |
| 04/14/2009 | US7517778 Structure of high performance combo chip and processing method |
| 04/09/2009 | WO2009046030A1 Stackable integrated circuit package |
| 04/09/2009 | WO2009045716A1 Proximity communication package for processor, cache and memory |
| 04/09/2009 | WO2009045712A1 Self-assembly of micro-structures |
| 04/09/2009 | WO2009045711A1 Alignment features for proximity communication |
| 04/09/2009 | WO2009045693A1 Multi-chip module and proximity communication between chips in the module |
| 04/09/2009 | WO2009045626A1 Packaged integrated circuit devices with through- body conductive vias, and methods of making same |
| 04/09/2009 | WO2009043670A2 Electronic circuit composed of sub-circuits and method for producing the same |
| 04/09/2009 | WO2008138015A3 Light-emitting diode assembly without solder |
| 04/09/2009 | WO2007074443A3 Millimeter wave imaging system |
| 04/09/2009 | WO2006065499A3 Non-linear colorization for imaging system |
| 04/09/2009 | DE4421358B4 Gleichrichteranordnung, vorzugsweise für einen Drehstromgenerator für Kraftfahrzeuge Rectifier arrangement, preferably for an alternator for motor vehicles |
| 04/09/2009 | DE102008045735A1 Gestapelte Halbleiterchips Stacked semiconductor chips |
| 04/09/2009 | DE102008040900A1 Verbindungen mittels Chip-Durchkontaktierungen für gestapelte integrierte Schaltkreisstrukturen Compounds by means of chip-vias for stacked integrated circuit structures |
| 04/09/2009 | DE102008035228A1 Leistungselektronikeinrichtungen mit integrierter Steuerschaltung Power electronics devices with integrated control circuit |
| 04/09/2009 | DE102007044795A1 Electronic module, has contact circuit path structure arranged on isolation structure, and component contact surfaces of components and contact surface of carrier electrically connected with each other by isolation structure |
| 04/09/2009 | DE102007043183A1 Optoelectronic component producing method, involves providing assembly of semiconductor body to generate electromagnetic radiation, and forming frame circumstantially formed at assembly region on carrier by photo-structure |
| 04/08/2009 | EP2045841A1 Power semiconductor module with connector devices |
| 04/08/2009 | EP2045840A2 Wiring board with guard ring |
| 04/08/2009 | EP2045839A1 Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device |
| 04/08/2009 | EP2044627A1 Electronic arrangement |
| 04/08/2009 | EP1955374B1 3d electronic module |
| 04/08/2009 | CN201218482Y Angle-fixing high-brightness polycrystal packaging LED heat radiating device |
| 04/08/2009 | CN101405833A Method and structure for fabricating solar cells |
| 04/08/2009 | CN101404314A Light emitting device and method for manufacturing the same |
| 04/08/2009 | CN101404280A Power electronics devices with integrated control circuitry |
| 04/08/2009 | CN101404279A Multi-chip 3D stacking and packaging structure |
| 04/08/2009 | CN101404278A Circuit device, circuit module and outdoor unit |
| 04/08/2009 | CN101404277A Multichip module |
| 04/08/2009 | CN101404276A Light emitting module and method for manufacturing the same |
| 04/08/2009 | CN101404275A Circuit device |
| 04/08/2009 | CN100477881C Pattern forming structure, method of forming pattern, device, electrooptical device and electronic equipment |
| 04/08/2009 | CN100477286C Semiconductor module |
| 04/08/2009 | CN100477283C Diode presenting high breakdown voltage |
| 04/08/2009 | CN100477211C LED module |
| 04/08/2009 | CN100477210C Led-luminous panel and carrier plate |
| 04/08/2009 | CN100477209C Device with power semiconductor components for controlling the power of high currents |
| 04/08/2009 | CN100477208C Method for manufacturing a semiconductor device |
| 04/08/2009 | CN100477207C Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 04/08/2009 | CN100477206C Method and apparatus involving capacitively coupled communication within a stack of laminated chips |
| 04/08/2009 | CN100477141C Semiconductor package device and method of formation and testing |
| 04/08/2009 | CN100476288C Luminescence diode lighting module and lighting device |
| 04/07/2009 | US7515879 Radio frequency circuit module |
| 04/07/2009 | US7515125 Light emitting module and method of driving the same, and optical sensor |
| 04/07/2009 | US7514796 Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
| 04/07/2009 | US7514776 Semiconductor/printed circuit board assembly, and computer system |
| 04/07/2009 | US7514767 Fan out type wafer level package structure and method of the same |
| 04/07/2009 | US7514723 Optoelectronic component |
| 04/07/2009 | US7514335 Semiconductor device and method of manufacturing the same |
| 04/07/2009 | US7513250 Positioning system for portable solar panels |
| 04/02/2009 | WO2009039825A1 Arrangement comprising an optoelectronic component |
| 04/02/2009 | WO2009039631A1 Carrier chip with cavity |
| 04/02/2009 | WO2009017758A3 Reconstituted wafer stack packaging with after-applied pad extensions |
| 04/02/2009 | US20090085446 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
| 04/02/2009 | US20090085045 Method for producing a matrix of individual electronic components and matrix produced thereby |
| 04/02/2009 | DE102008045744A1 Halbleiterbauelement mit einer an eine Rückseite eines Chips gekoppelten Elektronikkomponente A semiconductor device having a coupled to a backside of a chip electronic component |
| 04/02/2009 | DE102008039939A1 Integriertes Schaltungsbauelement mit einer aus der Gasphase abgeschiedenen Isolationsschicht An integrated circuit device having a deposited from the gas phase insulation layer |
| 04/02/2009 | DE102008035234A1 Motor vehicle e.g. sedan, power converter, has direct and alternate current connections coupled with conductive element i.e. bus bar, such that current from connections flows to electronic device sections of element in directions |
| 04/02/2009 | DE102008035227A1 Leistungselektronikeinrichtungen mit integrierter Gate-Ansteuerschaltung Power electronics devices with integrated gate drive |
| 04/02/2009 | DE102007061473A1 Strahlungsemittierende Vorrichtung Radiation emitting device |
| 04/02/2009 | DE102007059548A1 Optoelektronisches Bauelement und Auskoppellinse für ein optoelektronisches Bauelement Optoelectronic device and output lens for an optoelectronic component |
| 04/02/2009 | DE102007053849A1 Anordnung umfassend ein optoelektronisches Bauelement Assembly comprising an optoelectronic component |
| 04/02/2009 | DE102007051168A1 Method for manufacturing light emitting diode-module, involves producing multiple sub-layers consisting of layer stacks on growth wafer by layer deposition or epitaxial growth |
| 04/02/2009 | DE102007046969B3 Elektronische Schaltung aus Teilschaltungen und Verfahren zu deren Herstellung und demgemäßer Umrichter oder Schalter Electronic circuit part from circuits and methods for their preparation and demgemäßer converter or switch |
| 04/02/2009 | DE102007046743A1 Optoelektronisches Bauelement sowie Verfahren zu dessen Herstellung The optoelectronic component as well as methods for its preparation |
| 04/02/2009 | DE102007046520A1 Lichtemittierendes Flächenelement und Verfahren zum Herstellen eines lichtemittierenden Flächenelementes The light-emitting surface element and method for manufacturing a light-emitting surface element |
| 04/02/2009 | DE102007046348A1 Strahlungsemittierendes Bauelement mit Glasabdeckung und Verfahren zu dessen Herstellung Radiation-emitting component with glass cover and process for its preparation |
| 04/02/2009 | DE102007046339A1 Lichtquelle mit veränderlicher Abstrahlcharakteristik Light source with variable emission |
| 04/02/2009 | DE102007046095A1 Integrated circuit for automobile control system, has assembly contact points connected with substrate, and semiconductor chips arranged between lead frame and common connection plane, where chips are arranged on lead frame |
| 04/02/2009 | DE102007046075A1 LED module for lighting purpose and backlighting purpose, has printed circuit board with carrier from anodized aluminum, where conductors are attached on carrier and LED is arranged on carrier, and board stays in thermal contact with body |
| 04/02/2009 | DE102007045185A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 04/02/2009 | DE102007045184A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |