| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/29/2009 | CN100483710C 半导体器件 Semiconductor devices |
| 04/29/2009 | CN100483709C Light emitting diode packaging structure |
| 04/29/2009 | CN100483703C Piled semiconductor packing structure and its production |
| 04/29/2009 | CN100483697C Structure and method for fabrication of leadless multi-die carrier |
| 04/29/2009 | CN100483679C Method of reducing serial resistance between inductance in chip and antenna in chip |
| 04/29/2009 | CN100483190C Audio signal processing circuit and a display device incorporating the same |
| 04/28/2009 | US7525373 Compensation of process and voltage variability in multi-threshold dynamic voltage scaling circuits |
| 04/28/2009 | US7525340 Programmable logic device architecture for accommodating specialized circuitry |
| 04/28/2009 | US7525247 Substrate for organic EL display devices and organic EL display devices |
| 04/28/2009 | US7525189 Semiconductor device, wiring board, and manufacturing method thereof |
| 04/28/2009 | US7525186 Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same |
| 04/28/2009 | US7524703 Integrated circuit stacking system and method |
| 04/28/2009 | US7524699 Electronic component and a panel |
| 04/28/2009 | US7524391 Optical device and method for manufacturing the same, and electronic apparatus |
| 04/28/2009 | US7524097 Light emitting assembly |
| 04/23/2009 | WO2009050891A1 Mounting structure |
| 04/23/2009 | WO2009050623A2 Side-emitting led light source for backlighting applications |
| 04/23/2009 | WO2009025972A3 Stacked microelectronic devices and methods for manufaturing staked microelectronic devices |
| 04/23/2009 | WO2008155522A3 Improvements relating to semiconductor packages |
| 04/23/2009 | WO2007138589A3 Solar cells arrangement |
| 04/23/2009 | WO2005119532A3 Low-power fpga circuits and methods |
| 04/23/2009 | US20090103292 Image display unit |
| 04/23/2009 | US20090102512 Edit structure that allows the input of a logic gate to be changed by modifying any one of the metal or via masks used to form the metal interconnect structure |
| 04/23/2009 | US20090102061 Self-Aligned Wafer Level Integration System |
| 04/23/2009 | DE102008051560A1 Power module, particularly power semiconductor module, has housing with multiple receiving elements and carrier element, where elastic deformable cover is arranged on carrier element |
| 04/23/2009 | DE102008050972A1 Halbleiter-Chipbaustein, Halbleiter-Chipbaugruppe und Verfahren zum Herstellen eines Bauelements A semiconductor chip package, semiconductor chip assembly and method of manufacturing a device |
| 04/23/2009 | DE102007056269A1 Gekühltes Multichipmodul Chilled multichip module |
| 04/23/2009 | DE102007052217A1 Integrierter Schaltkreis mit NAND-Speicherzellen-Strängen An integrated circuit comprising NAND memory cell strings |
| 04/23/2009 | DE102007050433A1 Halbleitermodul und Verfahren zum Herstellen eines Halbleitermoduls Semiconductor module and method for manufacturing a semiconductor module |
| 04/23/2009 | DE10105086B4 Leistungsmodul Power module |
| 04/23/2009 | DE10100620B4 Leistungsmodul Power module |
| 04/22/2009 | EP2051301A1 Semiconductor device |
| 04/22/2009 | EP2050138A2 Integrating light source module |
| 04/22/2009 | EP2050137A2 Power source |
| 04/22/2009 | EP2050136A2 Thin film photovoltaic module wiring for improved efficiency |
| 04/22/2009 | EP2050135A2 Apparatus for obtaining radiant energy |
| 04/22/2009 | EP1081764B1 High-frequency module and method of manufacture thereof |
| 04/22/2009 | CN201226361Y LED packaging structure and backlight module unit with the same |
| 04/22/2009 | CN201226360Y High-power LED encapsulation structure |
| 04/22/2009 | CN201226357Y LED chip packaging structure for backlight module |
| 04/22/2009 | CN201226356Y LED packaging structure for preventing fluorescent powder light-emitting efficiency from reducing due to high temperature |
| 04/22/2009 | CN201226355Y Packaging structure for electronic memory device |
| 04/22/2009 | CN101416307A Cooler |
| 04/22/2009 | CN101416302A Elastically deformable integrated-circuit device |
| 04/22/2009 | CN101414651A Luminous diode component for apparatus stacked by high refractive index nanometer particles and manufacturing method thereof |
| 04/22/2009 | CN101414605A Light emitting element with a plurality of cells bonded, method of manufacturing the same, and light emitting device using the same |
| 04/22/2009 | CN101414604A Light-emitting diode |
| 04/22/2009 | CN101414603A Stacked semiconductor package and method for manufacturing the same |
| 04/22/2009 | CN101414602A Inner imbedded type multifunctional integration type structure for integration protection element and preparation method thereof |
| 04/22/2009 | CN101414601A Semiconductor encapsulation stacking combined construct for protecting welding spot between external pins |
| 04/22/2009 | CN101414600A Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same |
| 04/22/2009 | CN101414586A Package for a power semiconductor device and package method |
| 04/22/2009 | CN100481545C Seat structure of LED |
| 04/22/2009 | CN100481537C Manufacture method for diode light-emitting device and structure thereof |
| 04/22/2009 | CN100481530C Light-emitting unit, light-emitting unit assembly and light-emitting device composed of multiple light-emitting units |
| 04/22/2009 | CN100481524C Encapsulant layer for solar battery assembly and solar battery assembly |
| 04/22/2009 | CN100481449C Structure for packaging light emitting diode |
| 04/22/2009 | CN100481448C Transparent LED display |
| 04/22/2009 | CN100481447C Light emitting device provided with lens for controlling light distribution characteristic |
| 04/22/2009 | CN100481446C 半导体器件 Semiconductor devices |
| 04/22/2009 | CN100481445C Electronic parts, module, module assembling method, identification method, and environment setting method |
| 04/22/2009 | CN100481444C A modular integrated circuit chip carrier |
| 04/22/2009 | CN100481443C Electronic apparatus |
| 04/22/2009 | CN100481442C Optical module with flexible substrate |
| 04/22/2009 | CN100481441C Electron package structure |
| 04/22/2009 | CN100481430C Surface installing emitting LED |
| 04/22/2009 | CN100481421C Method for fabricating semiconductor package |
| 04/22/2009 | CN100481420C Stack type chip packaging structure, chip packaging body and manufacturing method thereof |
| 04/22/2009 | CN100481416C Semiconductor device and stacked semiconductor device and the manufacturing methods thereof |
| 04/22/2009 | CN100481414C Semiconductor device and manufacturing thereof |
| 04/22/2009 | CN100481412C Insulating circuit board and insulating circuit board provided with cooling sink section |
| 04/22/2009 | CN100481411C Electric circuit module as well as power converter and vehicle-mounted electric system comprising the same |
| 04/22/2009 | CN100481402C Semiconductor device and manufacturing method thereof |
| 04/22/2009 | CN100481376C Semiconductor device and manufacturing method thereof, circuit plate and electronic device |
| 04/22/2009 | CN100481358C Chip packaging and chip packaging method |
| 04/21/2009 | US7522422 Heat sink |
| 04/21/2009 | US7521993 Substrate stress signal amplifier |
| 04/21/2009 | US7521872 Integrated lamp with feedback and wireless control |
| 04/21/2009 | US7521809 Semiconductor device having a chip stack on a rewiring plate |
| 04/21/2009 | US7521786 Sustaining circuit with bi-directional device |
| 04/21/2009 | US7521785 Packaged systems with MRAM |
| 04/21/2009 | US7521288 Stacked chip semiconductor device and method for manufacturing the same |
| 04/16/2009 | WO2009048154A1 Semiconductor device and method for designing the same |
| 04/16/2009 | WO2006124576A3 Integrated circuit with signal bus formed by cell abutment of logic cells |
| 04/16/2009 | US20090096082 High speed electrical interconnects and method of manufacturing thereof |
| 04/16/2009 | US20090095960 Heat dissipation member, semiconductor apparatus and semiconductor light emitting apparatus |
| 04/16/2009 | DE112006003866T5 Eine elektronische Mehrfachchip-Baugruppe mit reduzierter Spannung An electronic multi-chip module with reduced voltage |
| 04/16/2009 | DE102008050063A1 Chipinduktionsspule Chip inductor |
| 04/16/2009 | DE102008048845A1 Eine Struktur zur gemeinschaftlichen Nutzung intern erzeugter Spannungen durch Chips bei Mehrchipgehäusen A structure for common use internally generated voltages by chips in multichip packages |
| 04/16/2009 | DE102008048628A1 Verfahren und Struktur zum Erweitern, Hochrüsten oder Reparieren eines Mehrchipgehäuses Method and structure for expanding, upgrading or repairing a multi-chip package |
| 04/16/2009 | DE102008046033A1 Bildsensor und Verfahren zu dessen Herstellung Image sensor and method for its production |
| 04/16/2009 | DE102008039389A1 Halbleiterbauelement Semiconductor device |
| 04/16/2009 | DE102008039388A1 Gestapelte Halbleiterchips Stacked semiconductor chips |
| 04/16/2009 | DE102008035911A1 Verfahren zum Herstellen eines integrierten Schaltungsmoduls A method of manufacturing an integrated circuit module |
| 04/16/2009 | DE102007048604A1 Verbund aus mindestens zwei Halbleitersubstraten sowie Herstellungsverfahren Composite of at least two semiconductor substrates and manufacturing method |
| 04/16/2009 | DE102007046451A1 Vorrichtung zur Detektion von Wärmestrahlung mit hoher Auflösung, Verfahren zum Herstellen und Verwendung der Vorrichtung A device for detection of thermal radiation with high resolution, methods of making and using the apparatus |
| 04/16/2009 | DE102007044620A1 Anordnung mit einer Verbindungseinrichtung und mindestens einem Halbleiterbauelement Arrangement with a connection device and at least one semiconductor component |
| 04/16/2009 | DE102004035746B4 Leistungshalbleitermodul The power semiconductor module |
| 04/16/2009 | DE102004018471B4 Leistungshalbleiterschaltung und Verfahren zum Herstellen einer Leistungshalbleiterschaltung Power semiconductor circuit and method for manufacturing a power semiconductor circuit |
| 04/15/2009 | EP2047518A2 Method and apparatus for arranging a solar cell and reflector |