| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/12/2009 | US7531441 Method of manufacturing semiconductor device |
| 05/12/2009 | US7530819 Device for controlling a vehicle |
| 05/12/2009 | US7530163 Electronic parts packaging structure and method of manufacturing the same |
| 05/07/2009 | WO2009057654A1 Part built-in wiring board, and manufacturing method for the part built-in wiring board |
| 05/07/2009 | WO2009057259A1 Structure with electronic component mounted therein and method for manufacturing such structure |
| 05/07/2009 | WO2009025974A3 Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods |
| 05/07/2009 | WO2008089725A3 Electrical component with a carrier substrate and a semiconductor chip |
| 05/07/2009 | WO2007118121A3 Method and structure for fabricating solar cells using a layer transfer process |
| 05/07/2009 | US20090117690 Integrated transistor module and method of fabricating same |
| 05/07/2009 | US20090115504 Circuit design methodology to reduce leakage power |
| 05/07/2009 | US20090115049 Semiconductor package |
| 05/07/2009 | US20090115042 Semiconductor device having three-dimensional stacked structure and method of fabricating the same |
| 05/07/2009 | US20090114952 Interconnect Components of a Semiconductor Device |
| 05/07/2009 | DE19800928B4 Gehäuse, insbesondere stapelbares Gehäuse, zur Aufnahme von Bauelementen und Verfahren zu dessen Herstellung Housing, in particular a stackable housing for receiving components and process for its preparation |
| 05/07/2009 | DE102008051467A1 Halbleiter-Bauelement Semiconductor component |
| 05/07/2009 | DE102007051875A1 HF-Chipmodul, HF-Baugruppe und Verfahren zur Herstellung einer HF-Baugruppe RF-chip module, the RF module and method for manufacturing a RF assembly |
| 05/07/2009 | DE10149093B4 Halbleiterbauelement mit Harzgehäuse A semiconductor device with resin case |
| 05/06/2009 | EP2056359A2 PV wind performance enhancing method and apparatus |
| 05/06/2009 | EP2056349A1 Component built-in module and method for producing the same |
| 05/06/2009 | EP2056348A1 Inverted Package-on-Package (POP) Assemblies and Packaging Methods for Integrated Circuits |
| 05/06/2009 | EP2056014A2 LED array and method for fabricating same |
| 05/06/2009 | EP2054937A1 Optoelectronic arrangement and method for operating such an optoelectronic arrangement |
| 05/06/2009 | EP2054936A2 Solar charged mobile working stations |
| 05/06/2009 | EP2054929A2 Process for the collective manufacturing of electronic 3d modules |
| 05/06/2009 | EP1360882A4 A stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same |
| 05/06/2009 | EP1247294A4 Packaging of integrated circuits and vertical integration |
| 05/06/2009 | CN201233905Y Aspheric narrow lighting angle optical lens and LED component constituted thereby |
| 05/06/2009 | CN201233904Y Aspheric wide lighting angle optical lens and LED component constituted thereby |
| 05/06/2009 | CN201233892Y Encapsulation construction for large power multiple LED chips |
| 05/06/2009 | CN201233891Y Convex type novel semiconductor encapsulation construction for functional pin and chip bearing substrate |
| 05/06/2009 | CN101427371A 电子部件模块 An electronic component module |
| 05/06/2009 | CN101425554A Package construction having vertical LED and manufacturing method thereof |
| 05/06/2009 | CN101425513A Light emitting module having heat radiation function, reflection cover and assembling method thereof |
| 05/06/2009 | CN101425512A Stacked semiconductor package and method for manufacturing the same |
| 05/06/2009 | CN101425511A Mounted structure |
| 05/06/2009 | CN101425510A Sensor module package structure and method of the same |
| 05/06/2009 | CN101425509A High heat radiation power type electrode rack for LED |
| 05/06/2009 | CN101425508A 芯片堆叠封装 Chip Stacking |
| 05/06/2009 | CN101425507A LED row having heat radiating fins and production method |
| 05/06/2009 | CN101425506A LED and its making method |
| 05/06/2009 | CN101425485A Semiconductor clamp system |
| 05/06/2009 | CN100485989C Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof |
| 05/06/2009 | CN100485926C Light-emitting diodes lamp |
| 05/06/2009 | CN100485925C LED module |
| 05/06/2009 | CN100485924C Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip |
| 05/06/2009 | CN100485914C Semiconductor package and semiconductor device |
| 05/06/2009 | CN100485900C Through-wafer gateway and surface metallization for coupling thereto |
| 05/06/2009 | CN100485895C Built-in wafer encapsulation structure and its making process |
| 05/05/2009 | US7529091 Power semiconductor module and method for cooling a power semiconductor module |
| 05/05/2009 | US7528884 Optical device |
| 05/05/2009 | US7528540 Light emitting device and optical device using the same |
| 05/05/2009 | US7528477 Castellation wafer level packaging of integrated circuit chips |
| 05/05/2009 | US7528475 BGA package with stacked semiconductor chips and method of manufacturing the same |
| 05/05/2009 | US7528473 Electronic circuit, a semiconductor device and a mounting substrate |
| 05/05/2009 | US7528421 Surface mountable light emitting diode assemblies packaged for high temperature operation |
| 05/05/2009 | US7528011 Semiconductor device and manufacturing method thereof |
| 05/05/2009 | US7528005 Method of manufacturing chip size package semiconductor device without intermediate substrate |
| 04/30/2009 | WO2009053357A1 Electrical power component, in particular power semiconductor module, having a cooling device and method for the planar and heat-conductive attachment of a cooling device to an electrical power component |
| 04/30/2009 | WO2009024761A3 Stack of integrated circuits |
| 04/30/2009 | WO2006119305A3 Ultra and very-high efficiency solar cells |
| 04/30/2009 | WO2006054233A3 Light-emitting device with inorganic housing |
| 04/30/2009 | WO2005036610A3 Multi-surface contact ic packaging structures and assemblies |
| 04/30/2009 | US20090111218 Stack mcp and manufacturing method thereof |
| 04/30/2009 | US20090108928 Large-scale integrated circuit |
| 04/30/2009 | US20090108470 Semiconductor device |
| 04/30/2009 | US20090108432 Stack package made of chip scale packages |
| 04/30/2009 | US20090108393 Semiconductor Device With a Plurality of Ground Planes |
| 04/30/2009 | US20090108311 CMOS Detector with Reduced Sensitivity to X-Rays |
| 04/30/2009 | US20090108275 Light emitting device having light emitting elements |
| 04/30/2009 | US20090108274 Light emitting device having light emitting elements |
| 04/30/2009 | US20090108273 Light emitting device having light emitting elements |
| 04/30/2009 | US20090108272 Light emitting device having light emitting elements |
| 04/30/2009 | DE112007001472T5 Elektronikkomponentenmodul Electronic Component Module |
| 04/30/2009 | DE102008041697A1 Mehrdimensionale LED-Leiterplatte unter Verwendung von beabstandeten Platten Multidimensional LED PCB using spaced plates |
| 04/30/2009 | DE102007050893A1 Verfahren zum Positionieren und Montieren einer LED-Baueinheit sowie Positionierkörper hierfür A method for positioning and mounting an LED assembly and positioning body for this purpose |
| 04/30/2009 | DE102007050604A1 Integrated circuit for use in memory module, has intermediate layer arranged between electrolyte and reactive layers, where parameter of intermediate layer is selected such that crystallization of electrolyte layer is partially suppressed |
| 04/30/2009 | DE102006001767B4 Halbleitermodul mit Halbleiterchips und Verfahren zur Herstellung desselben The same semiconductor module with a semiconductor chip and method for producing |
| 04/30/2009 | DE102004014864B4 Schutzkreis zum Schutz vor elektrostatischen Entladungen von Licht emittierenden Dioden und Verfahren zur Herstellung Protection circuit to protect against electrostatic discharges of light-emitting diodes and methods of making |
| 04/29/2009 | EP2053651A2 Method for producing substrate |
| 04/29/2009 | EP2053646A1 Method for vertical interconnection inside 3D electronic modules using vias |
| 04/29/2009 | EP2053108A1 Film adhesive, adhesive sheet, and semiconductor device using the same |
| 04/29/2009 | EP2052410A2 High speed, high density, low power die interconnect system |
| 04/29/2009 | EP1143514B1 Resin-sealed power semiconductor device including substrate with all electronic components for control circuit mounted thereon |
| 04/29/2009 | CN201230431Y 水冷功率模块 Water-cooled power modules |
| 04/29/2009 | CN201229945Y Combined electronic element |
| 04/29/2009 | CN201229944Y LED structure |
| 04/29/2009 | CN101421844A Light emitting diode module |
| 04/29/2009 | CN101420002A LED encapsulation construction and manufacturing method thereof |
| 04/29/2009 | CN101419990A Flexible thin-film solar cell component |
| 04/29/2009 | CN101419966A Semiconductor integrated circuit device |
| 04/29/2009 | CN101419965A Circuit device and method of manufacturing the same |
| 04/29/2009 | CN101419964A Device with a plurality of semiconductor chips |
| 04/29/2009 | CN101419963A Wafer-wafer encapsulation body and manufacturing process therefor |
| 04/29/2009 | CN101419962A LED, production method therefore and illuminator manufactured by the LED |
| 04/29/2009 | CN101419961A Heat radiating device for LED and manufacturing method therefor |
| 04/29/2009 | CN101419957A Semiconductor device and its fabrication process |
| 04/29/2009 | CN101417785A Wafer-level sensing element packaging structure and method for producing the same |
| 04/29/2009 | CN100483770C Electroluminescent device |
| 04/29/2009 | CN100483712C Light emitting diode assembly |
| 04/29/2009 | CN100483711C Surge protector for containing packed semiconductor |