| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/26/2009 | US7537966 Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer |
| 05/26/2009 | US7537960 Method of making multi-chip package with high-speed serial communications between semiconductor dice |
| 05/26/2009 | US7537959 Chip stack package and manufacturing method thereof |
| 05/22/2009 | WO2009063382A1 A lighting panel |
| 05/22/2009 | WO2009063255A1 Improved led device |
| 05/22/2009 | WO2009062534A1 Power semiconductor module |
| 05/22/2009 | WO2009020572A3 Stack packages using reconstituted wafers |
| 05/22/2009 | WO2009013409A3 Method for producing a set of chips mechanically interconnected by means of a flexible connection |
| 05/22/2009 | WO2008111546A3 Semiconductor device having semiconductor structure bodies on upper and lower surfaces thereof, and method of manufacturing the same |
| 05/22/2009 | WO2008100324A9 Method for achieving very high bandwidth between the levels of a cache hierarchy in 3-dimensional structures, and a 3- dimensional structure resulting therefrom |
| 05/22/2009 | WO2008051415A9 Method of manufacturing stacked chip packages |
| 05/21/2009 | US20090130801 Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same |
| 05/21/2009 | US20090128176 High density integrated circuit apparatus, test probe and methods of use thereof |
| 05/21/2009 | US20090127639 Semiconductor apparatus |
| 05/21/2009 | US20090127587 Tunable antifuse elements |
| 05/20/2009 | EP2061080A1 Semiconductor device, lead frame product used in the semiconductor device, and method for manufacturing the semiconductor device |
| 05/20/2009 | EP2061071A2 Method for producing a semiconductor component |
| 05/20/2009 | EP2059949A1 Luminous module |
| 05/20/2009 | EP1801866B1 Method of manufacturing a semiconductor device |
| 05/20/2009 | DE102008007543B3 Stack of chips has multiple semiconductor chips arranged on one another, where each semiconductor chip has upper side, lower side and lateral surface encircling border of upper and lower sides |
| 05/20/2009 | DE102007055133A1 Beleuchtungsvorrichtung mit einem Kühlkörper A lighting device with a heat sink |
| 05/20/2009 | DE102007054856A1 Beleuchtungsvorrichtung mit einer Substratplatte und einem Kühlkörper A lighting device having a substrate plate and a heat sink |
| 05/20/2009 | DE102004050588B4 Anordnung mit einem Leistungshalbleiterbauelement und mit einer Kontakteinrichtung Arrangement with a power semiconductor component and with a contact device |
| 05/20/2009 | DE102004012979B4 Kopplungssubstrat für Halbleiterbauteile, Anordnungen mit dem Kopplungssubstrat, Kopplungssubstratstreifen, Verfahren zur Herstellung dieser Gegenstände und Verfahren zur Herstellung eines Halbleitermoduls Coupling substrate for semiconductor devices, with the coupling assemblies substrate, coupling substrate strip, process for producing these articles and methods for manufacturing a semiconductor module |
| 05/20/2009 | CN201243017Y LED and LED module with open circuit breakage protection |
| 05/20/2009 | CN201243016Y Laminated construction of integrated circuit component |
| 05/20/2009 | CN201243015Y Liquid radiating device for high power light-emitting diode |
| 05/20/2009 | CN101438408A Composite LED modules |
| 05/20/2009 | CN101438407A Solar panel with optical films |
| 05/20/2009 | CN101438406A Light-emitting device with inorganic housing |
| 05/20/2009 | CN101438403A Semiconductor device and method for manufacturing same |
| 05/20/2009 | CN101437187A Stacked encapsulation structure for tapering (reducing) minitype sensor encapsulation volume |
| 05/20/2009 | CN101436632A LED chip component with heat-dissipating substrate and preparation method thereof |
| 05/20/2009 | CN101436603A Imaging die set |
| 05/20/2009 | CN101436590A Package-on-package with improved joint reliability |
| 05/20/2009 | CN101436589A Semiconductor module and image pickup apparatus |
| 05/20/2009 | CN101436588A 电路模块 Circuit module |
| 05/20/2009 | CN101436587A Semiconductor module and image pickup apparatus |
| 05/20/2009 | CN101436586A Semiconductor module and image pickup apparatus |
| 05/20/2009 | CN101436585A Power semiconductor module having a substrate and a pressure device |
| 05/20/2009 | CN101436584A Stacked semiconductor package |
| 05/20/2009 | CN101436583A Stacking type packaging piece |
| 05/20/2009 | CN101436582A LED light source device with separate type wavelength transition unit and wavelength transition unit thereof |
| 05/20/2009 | CN101436581A Microwave low-waveband submicron hybrid integrated circuit and preparation technique thereof |
| 05/20/2009 | CN101436571A Electrical device and method |
| 05/20/2009 | CN101436556A Method for producing a semiconductor component |
| 05/20/2009 | CN100490160C Optical device |
| 05/20/2009 | CN100490145C Package structure coated with asymmetric single-side pin lower wafer |
| 05/20/2009 | CN100490132C Insulating sheet and power module comprising the insulating sheet |
| 05/20/2009 | CN100490129C Metal-base circuit board and its manufacturing method |
| 05/20/2009 | CN100489627C Back light unit and light-emitting diode packaging structure |
| 05/19/2009 | US7536666 Integrated circuit and method of routing a clock signal in an integrated circuit |
| 05/19/2009 | US7535255 Logic integrated circuit having dynamic substitution function, information processing apparatus using the same, and dynamic substitution method of logic integrated circuit |
| 05/19/2009 | US7535109 Die assembly having electrical interconnect |
| 05/19/2009 | US7535094 Substrate structure, a method and an arrangement for producing such substrate structure |
| 05/19/2009 | US7535090 LSI package provided with interface module |
| 05/19/2009 | US7535076 Power semiconductor device |
| 05/19/2009 | US7535002 Camera with visible light and infrared image blending |
| 05/19/2009 | US7534956 Solar cell module having an electric device |
| 05/19/2009 | US7534654 Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
| 05/19/2009 | US7534645 CMOS type image sensor module having transparent polymeric encapsulation material |
| 05/14/2009 | WO2009004243A3 Assemblage of radiofrequency chips |
| 05/14/2009 | WO2007035677A3 Integrated solar roofing system |
| 05/14/2009 | WO2006083520A3 Method of separating a mold from a solidified layer disposed on a substrate |
| 05/14/2009 | US20090124045 Low Profile Stacking System and Method |
| 05/14/2009 | US20090121338 Assemblies and multi chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads |
| 05/14/2009 | US20090121337 Semiconductor device manufacturing method and semiconductor |
| 05/14/2009 | US20090121336 Stacked semiconductor package |
| 05/14/2009 | US20090121210 Formation of self-assembled monolayers on silicon substrates |
| 05/14/2009 | US20090119915 Method for Manufacturing Circuit Device |
| 05/14/2009 | DE10209204B4 Elektronisches Bauteil mit einem Stapel aus Halbleiterchips und Verfahren zur Herstellung desselben The same electronic component having a stack of semiconductor chips and processes for making |
| 05/14/2009 | DE102007052630A1 Power semiconductor module has electrically and thermally conductive base plate and electrically insulating and thermally conductive substrate arranged on base plate |
| 05/14/2009 | DE102005047566B4 Anordnung mit einem Leistungshalbleiterbauelement und mit einem Gehäuse sowie Herstellungsverfahren hierzu Arrangement with a power semiconductor device and a housing and manufacturing method therefor |
| 05/13/2009 | EP2058872A2 Semiconductor package |
| 05/13/2009 | EP2058861A1 Electric power converter |
| 05/13/2009 | EP2057687A1 Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure |
| 05/13/2009 | EP2057681A2 Light-emitting diode arrangement and method for producing the same |
| 05/13/2009 | CN201238053Y LED chip packaging structure with different arrangement interspace |
| 05/13/2009 | CN201238052Y LED chip packaging structure with substrate as lampshade |
| 05/13/2009 | CN201238051Y Controlled silicon three-phase fully controlled bridge and heat radiating device assembly |
| 05/13/2009 | CN201237174Y Multi-point light source plane packaging structure |
| 05/13/2009 | CN101432896A Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
| 05/13/2009 | CN101432876A Semiconductor device and semiconductor device manufacturing method |
| 05/13/2009 | CN101432870A Semiconductor device with double-sided electrode structure and its manufacturing method |
| 05/13/2009 | CN101432867A Methods and materials useful for chip stacking, chip and wafer bonding |
| 05/13/2009 | CN101431319A Electronic component |
| 05/13/2009 | CN101431132A Luminous diode |
| 05/13/2009 | CN101431070A Hybrid integrated circuit structure of three-dimensional CMOS and molecule switching element |
| 05/13/2009 | CN101431069A Power semiconductor module with temperature sensor |
| 05/13/2009 | CN101431068A 半导体封装模块 The semiconductor package module |
| 05/13/2009 | CN101431067A Packaging structure for multi-chip stack |
| 05/13/2009 | CN101431066A Semiconductor packaging stack combination construction with movable outer terminal |
| 05/13/2009 | CN101431033A Multi-chip stack packaging method |
| 05/13/2009 | CN100487935C Light emitting device assembly and backlight unit using the same |
| 05/13/2009 | CN100487893C Semiconductor chip and its manufacturing method |
| 05/13/2009 | CN100487892C Semiconductor packages including transformer or antenna |
| 05/12/2009 | US7531890 Multi-chip package (MCP) with a conductive bar and method for manufacturing the same |
| 05/12/2009 | US7531809 Gamma ray detector modules |
| 05/12/2009 | US7531740 Photovoltaic module for roofs |
| 05/12/2009 | US7531492 Aqueous solution of sulfuric acid, hydrogen peroxide, H2SiF6, HBF4; clean residual polymers from aluminium or aluminium-containing surfaces, during the production of semiconductor elements |