| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/10/2009 | CN100499177C Solar cell module connector and method of producing solar cell module panel |
| 06/10/2009 | CN100499119C LED module |
| 06/10/2009 | CN100499118C Heavy current three-phase rectification power electronic device module |
| 06/10/2009 | CN100499117C Multilevel semiconductor module and method for fabricating the same |
| 06/10/2009 | CN100499116C Chip package body |
| 06/10/2009 | CN100499115C Semiconductor element mounting substrate and opitcal transmitters |
| 06/10/2009 | CN100499114C LED lamp source assembly structure |
| 06/10/2009 | CN100499113C Light-emitting device |
| 06/10/2009 | CN100499112C Concentrating solar energy receiver |
| 06/10/2009 | CN100499053C Power semiconductor wiring technology for electric insulation material layer that follows the surface contours |
| 06/09/2009 | US7545205 Low power on-chip global interconnects |
| 06/09/2009 | US7545169 FPGA architecture having two-level cluster input interconnect scheme without bandwidth limitation |
| 06/09/2009 | US7545167 Configurable IC with interconnect circuits that also perform storage operations |
| 06/09/2009 | US7545117 Two stage energy storage device |
| 06/09/2009 | US7545049 Electronic parts packaging structure |
| 06/09/2009 | US7545047 Semiconductor device with a wiring substrate and method for producing the same |
| 06/09/2009 | US7545036 Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
| 06/09/2009 | US7545033 Low cost power semiconductor module without substrate |
| 06/09/2009 | US7544263 Method of forming folded-stack packaged device using vertical progression folding tool |
| 06/09/2009 | US7544249 Large-diameter SiC wafer and manufacturing method thereof |
| 06/04/2009 | WO2009069532A1 Electronic circuit |
| 06/04/2009 | WO2009069308A1 Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board |
| 06/04/2009 | WO2009067996A2 Chip assembly, connecting assembly, led and method for producing a chip assembly |
| 06/04/2009 | WO2009067989A1 Arrangement having at least two light-emitting semi-conductor components and method for the production of such an arrangement |
| 06/04/2009 | WO2009050623A3 Side-emitting led light source for backlighting applications |
| 06/04/2009 | WO2009032539A3 Semiconductor assemblies and methods of manufacturing such assemblies |
| 06/04/2009 | WO2005059967A3 Multiple chip package module having inverted package stacked over die |
| 06/04/2009 | US20090140800 Integrated circuit with signal bus formed by cell abutment of logic cells |
| 06/04/2009 | DE10335622B4 Harzversiegelte Halbleiterbaugruppe The resin-sealed semiconductor device |
| 06/04/2009 | DE102008056846A1 Leistungshalbleitermodul mit Temperaturmessung Power semiconductor module with temperature measurement |
| 06/04/2009 | DE102008042772A1 Flexible LED-Verbindung mittels Metallbahnen Flexible LED connection using metal tracks |
| 06/04/2009 | DE102008021618A1 Chipanordnung, Anschlussanordnung, LED sowie Verfahren zur Herstellung einer Chipanordnung Chip assembly, fitting assembly, LED and method for producing a chip arrangement |
| 06/04/2009 | DE102008012844A1 Lighting device for providing background lighting of thin, laminar display device of e.g. mobile phone, has element emitting radiation in certain range, where element is embedded in medium so that radiation is emitted in direction of medium |
| 06/04/2009 | DE102008005935A1 Halbleiteranordnung sowie Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device |
| 06/04/2009 | DE102007057240A1 Anordnung mit einem Licht emittierendem Modul und einem flexiblen Leitungsträger Arrangement with a light emitting module and a flexible cable carrier |
| 06/04/2009 | DE102005030247B4 Leistungshalbleitermodul mit Verbindungselementen hoher Stromtragfähigkeit Power semiconductor module with fasteners high current carrying capacity |
| 06/04/2009 | DE102004027074B4 Verfahren zur Herstellung eines BGA (Ball Grid Array)-Bauteils mit einer dünnen metallischen Kühlfolie A method for preparing a BGA (Ball Grid Array) component with a thin metallic film cooling |
| 06/03/2009 | EP2065947A1 Semiconductor module for power generation or light emission |
| 06/03/2009 | EP2065936A2 System-in-package |
| 06/03/2009 | CN201252100Y Polycrystal encapsulating unit |
| 06/03/2009 | CN201252099Y Photodiode array device |
| 06/03/2009 | CN201252098Y Diode heat dissipation case structure for an automotive rectifier |
| 06/03/2009 | CN201252097Y Packing and fixing structure of magnetizing diode of automobile rectifier |
| 06/03/2009 | CN101449377A 半导体器件 Semiconductor devices |
| 06/03/2009 | CN101447478A Photocoupler |
| 06/03/2009 | CN101447477A Light emitting diode package, method for fabricating the same and backlight assembly including the same |
| 06/03/2009 | CN101447476A Light emitting diode device with electrostatic discharge protection function |
| 06/03/2009 | CN101447475A System-in-Package |
| 06/03/2009 | CN101447474A Image sensing wafer package structure and imaging module used by same |
| 06/03/2009 | CN100495739C Stacked photovoltaic device |
| 06/03/2009 | CN100495702C Stacked dual mosfet package |
| 06/03/2009 | CN100495701C A three-dimensional wafer stacking structure with post-and-beam construction and method to stack three-dimensional wafer |
| 06/02/2009 | US7542304 Memory expansion and integrated circuit stacking system and method |
| 06/02/2009 | US7541682 Semiconductor chip having bond pads |
| 06/02/2009 | US7541220 Integrated circuit device having flexible leadframe |
| 05/28/2009 | WO2009066704A1 Solder material, process for producing the solder material, joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module |
| 05/28/2009 | WO2009066504A1 Module with embedded components |
| 05/28/2009 | WO2009039825A4 Arrangement comprising an optoelectronic component |
| 05/28/2009 | US20090134507 Adhesive on wire stacked semiconductor package |
| 05/28/2009 | US20090134466 Dual work function semiconductor device and method for manufacturing the same |
| 05/28/2009 | US20090134425 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same |
| 05/28/2009 | US20090134420 Semiconductor light emitting device, lighting module, lighting apparatus, display element, and manufacturing method for semiconductor light emitting device |
| 05/28/2009 | US20090134328 Image-taking apparatus and method thereof |
| 05/28/2009 | US20090133254 Components with posts and pads |
| 05/28/2009 | US20090133247 Apparatus for packaging a tape substrate |
| 05/28/2009 | DE102008011153A1 Anordnung mit mindestens zwei lichtemittierenden Halbleiterbauelementen und Verfahren zur Herstellung einer Anordnung mit mindestens zwei lichtemittierenden Halbleiterbauelementen Arrangement having at least two light emitting semiconductor devices and method for producing an arrangement with at least two semiconductor light emitting devices |
| 05/28/2009 | DE102007054709A1 Leistungshalbleitermodul mit einem Substrat und mit einer Druckeinrichtung Power semiconductor module with a substrate and with a printing device |
| 05/27/2009 | EP2063466A2 Interconnection element and method of fabrication thereof |
| 05/27/2009 | EP2062301A2 Housing for an optoelectronic component and arrangement of an optoelectronic component in a housing |
| 05/27/2009 | EP2062296A1 Led semiconductor body and use of an led semiconductor body |
| 05/27/2009 | EP2062295A1 Light-emitting device and display unit and lighting unit using the same |
| 05/27/2009 | EP2062294A1 Power semiconductor module comprising an explosion protection system |
| 05/27/2009 | EP1665393B1 PV wind performance enhancing methods |
| 05/27/2009 | CN201247775Y High-power controlled silicon set constructional device |
| 05/27/2009 | CN201247774Y Packaging structure for high-power multi-chip |
| 05/27/2009 | CN101443910A 功率半导体模块 Power semiconductor module |
| 05/27/2009 | CN101443909A Double-sided solar module |
| 05/27/2009 | CN101443907A Assembly, chip and method of operating |
| 05/27/2009 | CN101443904A Base for power module |
| 05/27/2009 | CN101442082A Solar battery with LED |
| 05/27/2009 | CN101442043A Organic light coupling device |
| 05/27/2009 | CN101442042A Display device, preparation method and mask board for preparing the same |
| 05/27/2009 | CN101442041A Multi-chip package semiconductor device |
| 05/27/2009 | CN101442040A Encapsulation structure for LED and method of manufacturing the same |
| 05/27/2009 | CN101442015A Light emitting diode device and manufacturing method thereof |
| 05/27/2009 | CN101442013A Circuit module and manufacturing method thereof |
| 05/27/2009 | CN100492680C Multi-stack surface mount light emitting diodes |
| 05/27/2009 | CN100492639C Cpu power delivery system |
| 05/27/2009 | CN100492638C Stack package of semiconductor device |
| 05/27/2009 | CN100492637C Semiconductor device package and its manufacturing method, and semiconductor |
| 05/27/2009 | CN100492634C Mount assembly, optical transmission line and photoelectric circuit board |
| 05/27/2009 | CN100492623C Low power multi-chip semiconductor memory device and chip enabling method thereof |
| 05/26/2009 | US7539967 Self-configuring components on a device |
| 05/26/2009 | US7539826 System, device, and method for improved mirror mode operation of a semiconductor memory device |
| 05/26/2009 | US7538603 Signal distribution architecture and semiconductor device |
| 05/26/2009 | US7538580 Logic array devices having complex macro-cell architecture and methods facilitating use of same |
| 05/26/2009 | US7538577 System and method for configuring a field programmable gate array |
| 05/26/2009 | US7538565 High density integrated circuit apparatus, test probe and methods of use thereof |
| 05/26/2009 | US7538436 Press pack power semiconductor module |
| 05/26/2009 | US7538326 Visible light and IR combined image camera with a laser pointer |