| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/23/2009 | US7550805 Stress-controlled dielectric integrated circuit |
| 06/23/2009 | US7550324 Interface port for electrically programmed fuses in a programmable logic device |
| 06/18/2009 | WO2009074814A2 An electronic device |
| 06/18/2009 | WO2009074454A2 Semiconductor module and connection terminal device |
| 06/18/2009 | WO2009043670A3 Electronic circuit composed of sub-circuits and method for producing the same |
| 06/18/2009 | WO2009034349A3 Electrically isolated vertical light emitting diode structure |
| 06/18/2009 | WO2009030204A3 Semiconductor component and method for producing a semiconductor component |
| 06/18/2009 | WO2008050312A3 A self-display rfid tag device with a display unit or bluetooth technology |
| 06/18/2009 | US20090152668 Semiconductor apparatus |
| 06/18/2009 | US20090152640 Semiconductor Device and Manufacturing Process Therefor |
| 06/18/2009 | US20090152569 Led module with reduced operating temperature |
| 06/18/2009 | DE19743766B4 In vertikaler und horizontaler Ebene stapelbare Halbleiterchip-Gehäuse und Verfahren zu deren Herstellung In vertical and horizontal plane stackable semiconductor chip package and method of manufacture |
| 06/18/2009 | DE19706983B4 Oberflächenanbringungseinheit und Wandleranordnungen unter Verwendung der Oberflächenanbringungseinheit Surface mounting unit and transducer assemblies using the surface mounting unit |
| 06/18/2009 | DE10329843B4 Wasserdichtes Leistungmodul und Verfahren zur Herstellung eines wasserdichten Leistungsmoduls Waterproof power module and method for manufacturing a waterproof power module |
| 06/18/2009 | DE102008061636A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 06/18/2009 | DE102008052029A1 Halbleitermodul mit Schaltbauteilen und Treiberelektronik Semiconductor module with switching devices and drive electronics |
| 06/18/2009 | DE102008022352A1 Stapelartige Chip-Package-Struktur Stack-type chip package structure |
| 06/18/2009 | DE102007060206A1 Anordnung mit mindestens einem optoelektronischen Halbleiterbauelement Arrangement with at least one optoelectronic semiconductor component |
| 06/18/2009 | DE102007060198A1 Konversions-LED Conversion LED |
| 06/18/2009 | DE102007059471A1 Headlamp i.e. H4 retrofit lamp, for use as e.g. gas-discharge lamp, in motor vehicle, has lamp base and light emission predefined by international standards with respect to distance and position in relation to reference plane of base |
| 06/18/2009 | DE102004063824B4 Leuchtdioden-Baugruppe mit antiparallelem Diodenchip Light-emitting diode assembly with antiparallel diode chip |
| 06/18/2009 | DE102004058946B4 Leistungshalbleitermodul mit Hilfsanschluss Power semiconductor module with auxiliary port |
| 06/18/2009 | DE102004037656B4 Elektronikmodul mit optimierter Montagefähigkeit und Bauteilanordnung mit einem Elektronikmodul Electronics module with optimized assembly capability and component assembly with an electronic module |
| 06/18/2009 | DE102004027960B4 Elektrische Leistungs-Halbleitervorrichtung Electrical power semiconductor device |
| 06/18/2009 | DE102004018476B4 Leistungshalbleiteranordnung mit kontaktierender Folie und Anpressvorrichtung Power semiconductor device having contacted foil and pressing device |
| 06/17/2009 | EP2071642A2 Textured encapsulant surface in led packages |
| 06/17/2009 | EP2071640A1 Lighting device |
| 06/17/2009 | EP2071626A1 Semiconductor module and connection terminal device |
| 06/17/2009 | EP2071625A1 Chip carrier with ferro/ferrimagnetic layers |
| 06/17/2009 | EP2070117A1 Optical element for a light-emitting diode, light-emitting diode, led arrangement and method for producing an led arrangement |
| 06/17/2009 | EP2070116A1 Modular backlighting device |
| 06/17/2009 | EP2070115A2 Thin film solar cell with finger pattern |
| 06/17/2009 | CN201259892Y LED encapsulation construction having embedded electrostatic protection function |
| 06/17/2009 | CN201259891Y Multi-chip encapsulation module having electromagnetic construction |
| 06/17/2009 | CN101461061A 半导体器件 Semiconductor devices |
| 06/17/2009 | CN101459170A 半导体器件 Semiconductor devices |
| 06/17/2009 | CN101459169A Method and system for an integrated circuit package with ferri/ferromagnetic layers |
| 06/17/2009 | CN101459168A Method and system for a phased array antenna embedded in an integrated circuit package |
| 06/17/2009 | CN101459167A Imaging device unit and imaging apparatus |
| 06/17/2009 | CN101459166A Licht aussendende diode |
| 06/17/2009 | CN101459165A Electronic component wafer module, manufacturing method thereof and electronic information device |
| 06/17/2009 | CN101459164A 功率半导体模块 Power semiconductor module |
| 06/17/2009 | CN101459163A Light emitting diode |
| 06/17/2009 | CN101459162A Solid illuminating device |
| 06/17/2009 | CN101459161A Integrate circuit |
| 06/17/2009 | CN101459160A Diode needle contact member for voltage stabilization |
| 06/17/2009 | CN100502176C Semiconductor device manufacture method |
| 06/17/2009 | CN100502061C LED multi color line light source and its producing process |
| 06/17/2009 | CN100502057C Photovoltaic cell, photovoltaic cell module, method of fabricating photovoltaic cell and method of repairing photovoltaic cell |
| 06/17/2009 | CN100502024C Semiconductor modular, solid-state pickup element, camera and camera manufacture method |
| 06/17/2009 | CN100501993C Optoelectronic component that emits electromagnetic radiation and illumination module |
| 06/17/2009 | CN100501992C Method and structure for implementing secure multichip modules for encryption applications |
| 06/17/2009 | CN100501806C Flat display |
| 06/16/2009 | US7548444 Memory module and memory device |
| 06/16/2009 | US7548089 Structures and methods to avoiding hold time violations in a programmable logic device |
| 06/16/2009 | US7547977 Semiconductor chip having bond pads |
| 06/16/2009 | US7547967 Semiconductor device and method of manufacturing the same |
| 06/16/2009 | US7547963 Semiconductor device and its wiring method |
| 06/11/2009 | WO2009072492A1 Photosensitive adhesive |
| 06/11/2009 | WO2009072221A1 Electronic equipment obtained by soldering with lead-free jointing material |
| 06/11/2009 | WO2009071313A2 Substrate for an led submount, and led submount |
| 06/11/2009 | US20090149034 Semiconductor module and method of manufacturing the same |
| 06/11/2009 | US20090146434 Wind generator with movable sails |
| 06/11/2009 | US20090146315 Integrated circuit package-on-package stacking system and method of manufacture thereof |
| 06/11/2009 | US20090146287 Semiconductor device having a chip-size package |
| 06/10/2009 | EP2068378A2 LED backlight for a liquid crystal display device |
| 06/10/2009 | EP2068362A1 Semiconductor power module with flexible circuit leadframe |
| 06/10/2009 | EP2067178A1 Led semiconductor element, and use thereof |
| 06/10/2009 | EP2067068A2 Optical interconnect device and method for manufacturing the same |
| 06/10/2009 | EP1428266A4 Chain link metal interconnect structure |
| 06/10/2009 | EP1025584B1 Integrated electronic circuit comprising at least an electronic power component |
| 06/10/2009 | DE19926756B4 Elektronische Schaltkreisvorrichtung und Verfahren zum Herstellen derselben Electronic circuit device and method of manufacturing the same |
| 06/10/2009 | DE10343257B4 Verfahren zur Herstellung von Zwischenverbindungen bei Chip-Sandwich-Anordnungen Process for the preparation of intermediate compounds in chip-sandwich assemblies |
| 06/10/2009 | DE10205563B4 Gehäustes Halbleiterbauelement mit zwei Die-Paddles sowie zugehöriges Herstellungsverfahren A housed semiconductor component with two paddles and the manufacturing method thereof |
| 06/10/2009 | DE102008060300A1 Halbleitervorrichtung Semiconductor device |
| 06/10/2009 | DE102007059133A1 Substrat für ein LED-Submount und LED-Submount Substrate for an LED submount and LED submount |
| 06/10/2009 | DE102007057346B3 Laminierte Leistungselektronikbaugruppe Laminated power electronics module |
| 06/10/2009 | DE102007056581A1 Electrical load i.e. motor vehicle blower motor, controlling device, has connection elements brought out from housing, and chip and resistance element, which are electrically connected by connection elements |
| 06/10/2009 | DE102007007224B4 Leistungshalbleitermodul mit einem Gehäuse Power semiconductor module with a housing |
| 06/10/2009 | DE102007003587B4 Leistungshalbleitermodul mit Druckkörper Power semiconductor module with a pressure body |
| 06/10/2009 | DE102006006425B4 Leistungshalbleitermodul in Druckkontaktausführung Power semiconductor module in pressure contact design |
| 06/10/2009 | DE102006006423B4 Leistungshalbleitermodul und zugehöriges Herstellungsverfahren The power semiconductor module and associated production method |
| 06/10/2009 | CN201256150Y Non-adhesive encapsulation module for LED |
| 06/10/2009 | CN101454900A Solar collector arrangement with reflecting surface |
| 06/10/2009 | CN101454899A Technique for manufacturing photovoltaic modules |
| 06/10/2009 | CN101452928A Microchip matrix light source module |
| 06/10/2009 | CN101452927A A self-cooling type thyratron transistor valve |
| 06/10/2009 | CN101452926A Hybrid integrated circuit device |
| 06/10/2009 | CN101452925A 半导体器件 Semiconductor devices |
| 06/10/2009 | CN101452924A Led backlight for a liquid crystal display device |
| 06/10/2009 | CN101452923A Light emitting unit |
| 06/10/2009 | CN101452922A Light emitting unit |
| 06/10/2009 | CN101452921A Light emitting unit |
| 06/10/2009 | CN101452920A Light emitting unit |
| 06/10/2009 | CN101452919A Multi-wafer intersecting stacking encapsulation construction |
| 06/10/2009 | CN101452918A Carrier plate module having built-in phase lock loop, integration type system, and manufacturing method thereof |
| 06/10/2009 | CN101452917A Light source device |
| 06/10/2009 | CN101452916A LED encapsulation module and manufacturing method thereof |
| 06/10/2009 | CN101452915A Multi-system module having functional carrier plate |
| 06/10/2009 | CN100499969C Module with built-in circuit component and method for producing the same |