| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/08/2015 | DE102013211595A1 Optische Baueinheit Optical assembly |
| 01/08/2015 | DE102013203666B4 Leuchtband mit bandförmigem Substrat Light band with band-shaped substrate |
| 01/08/2015 | DE102013106948A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device |
| 01/08/2015 | DE102010054761B4 Abgedichtete elektronische Steuereinrichtung und Verfahren zum Herstellen derselben Sealed electronic control device and method for manufacturing the same |
| 01/08/2015 | DE102007009229B4 Lichtquelle zur Simulation einer Punktlichtquelle, sowie Leuchte mit einer derartigen Lichtquelle Light source for the simulation of a point light source, and light with a light source of |
| 01/07/2015 | EP2822367A1 Wiring board |
| 01/07/2015 | EP2822034A2 Semiconductor light emitting element |
| 01/07/2015 | EP2822033A1 Formation of conductive circuit |
| 01/07/2015 | EP2820924A1 Circuit board assembly |
| 01/07/2015 | CN204089616U 一种高压晶闸管换流阀阀塔 A high voltage thyristor valve tower |
| 01/07/2015 | CN204088382U 一种半导体芯片封装结构 A semiconductor chip package structure |
| 01/07/2015 | CN204088373U 可弯折的led灯丝及其灯泡结构 Led lamp filament bendable structure and |
| 01/07/2015 | CN204088372U Led支架 Led bracket |
| 01/07/2015 | CN204088317U Led芯片集成模块、光源及其固定结构 Led chip module, light source and a fixed structure |
| 01/07/2015 | CN204088316U 正装芯片倒装360度发光可任意环绕led灯丝 Formal wear flip-chip 360-degree surround led luminous filament can be arbitrary |
| 01/07/2015 | CN204088315U Mcob led荧光粉分离封装结构 Mcob led phosphor separate package |
| 01/07/2015 | CN204088314U 一种集成化led灯丝 An integrated led filament |
| 01/07/2015 | CN204088313U 一种条状全方位发光led灯丝 One kind of filament light led strip round |
| 01/07/2015 | CN204088312U 聚光的大功率集成uvled面光源 Uvled integrated high-power condenser surface light source |
| 01/07/2015 | CN204088311U 一种led光源 One kind of led light |
| 01/07/2015 | CN204088310U 一种led光源组件 One kind of led light module |
| 01/07/2015 | CN204088309U 一种led灯的光源组件 Light assembly for a led lamp |
| 01/07/2015 | CN204088308U 一种cob光源系统 One kind of light source system cob |
| 01/07/2015 | CN204088307U 一种植物生长照明用led光源 A plant growing lighting led light |
| 01/07/2015 | CN204088306U 一种白光led模组 One kind of white led module |
| 01/07/2015 | CN204088305U 新型高密度可堆叠封装结构 New high-density stackable package |
| 01/07/2015 | CN204088303U 一种红外遥控接收放大器 An infrared remote control receiver amplifier |
| 01/07/2015 | CN104269398A 基于反挖槽工艺的gpp整流芯片 Trench technology-based anti-chip rectifier gpp |
| 01/07/2015 | CN104269388A 垂直集成系统 Vertical integration system |
| 01/07/2015 | CN104267858A 感测芯片及其制造方法,以及配置该感测芯片的电子装置 Sensing chip and its manufacturing method, and electronic device is configured the sensing chip |
| 01/07/2015 | CN102903829B 发光二极管光源装置 LED light source device |
| 01/07/2015 | CN102209410B 一种外置突发自动光功率控制电路 An outboard burst automatic optical power control circuit |
| 01/06/2015 | US8929097 Power conversion apparatus |
| 01/06/2015 | US8929089 Electronic circuit module component and method of manufacturing electronic circuit module component |
| 01/06/2015 | US8929078 Electronic control device |
| 01/06/2015 | US8928893 Proximity sensor |
| 01/06/2015 | US8928399 Semiconductor device having stacked chips |
| 01/06/2015 | US8928350 Programming the behavior of individual chips or strata in a 3D stack of integrated circuits |
| 01/06/2015 | US8928155 Detector structure for imaging applications and related method of manufacture |
| 01/06/2015 | US8928154 Semiconductor module |
| 01/06/2015 | US8928153 Flip-chip, face-up and face-down centerbond memory wirebond assemblies |
| 01/06/2015 | US8928150 Multi-chip package and method of manufacturing the same |
| 01/06/2015 | US8928148 Semiconductor component and device provided with heat dissipation means |
| 01/06/2015 | US8928141 Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtained |
| 01/06/2015 | US8928138 Complete power management system implemented in a single surface mount package |
| 01/06/2015 | US8928135 Power semiconductor module with connecting devices |
| 01/06/2015 | US8928132 Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package |
| 01/06/2015 | US8928130 Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same |
| 01/06/2015 | US8928129 Semiconductor packaging for a memory device and a fabricating method thereof |
| 01/06/2015 | US8928119 Three dimensional structure memory |
| 01/06/2015 | US8928118 Processes and structures for IC fabrication |
| 01/06/2015 | US8928115 Semiconductor package having internal shunt and solder stop dimples |
| 01/06/2015 | US8928009 Light emitting device, illuminating device, and display device |
| 01/06/2015 | US8928002 Semiconductor device and method of manufacturing semiconductor device |
| 01/06/2015 | US8927426 Semiconductor devices having through-vias and methods for fabricating the same |
| 01/06/2015 | US8927417 Semiconductor package signal routing using conductive vias |
| 01/06/2015 | US8927391 Package-on-package process for applying molding compound |
| 01/06/2015 | US8927337 Stacked packaging improvements |
| 01/06/2015 | US8927335 Method for bonding of chips on wafers |
| 01/06/2015 | US8927333 Die carrier for package on package assembly |
| 01/06/2015 | US8927332 Methods of manufacturing semiconductor device assemblies including face-to-face semiconductor dice |
| 01/01/2015 | US20150004750 Methods of Forming Conductive Materials on Contact Pads |
| 01/01/2015 | US20150004749 Electrical leakage reduction in stacked integrated circuits having through-silicon-via (tsv) structures |
| 01/01/2015 | US20150003841 Hybrid electro-optical package for an opto-electronic engine |
| 01/01/2015 | US20150003065 Led lighting assembly and an illuminating apparatus having the led lighting assembly |
| 01/01/2015 | US20150002984 Method of forming a magnetic mems tunable capacitor |
| 01/01/2015 | US20150002202 Semiconductor integrated circuit and signal transmission method thereof |
| 01/01/2015 | US20150001948 Die-to-die inductive communication devices and methods |
| 01/01/2015 | US20150001737 Semiconductor packages and electronic systems including the same |
| 01/01/2015 | US20150001736 Die connections using different underfill types for different regions |
| 01/01/2015 | US20150001731 Package assembly for embedded die and associated techniques and configurations |
| 01/01/2015 | US20150001725 Bonding structure and method for forming the same |
| 01/01/2015 | US20150001715 Semiconductor device |
| 01/01/2015 | US20150001713 Multiple level redistribution layer for multiple chip integration |
| 01/01/2015 | US20150001707 Semiconductor Device and Method of Using Substrate With Conductive Posts and Protective Layers to Form Embedded Sensor Die Package |
| 01/01/2015 | US20150001703 Semiconductor Device and Method of Individual Die Bonding Followed by Simultaneous Multiple Die Thermal Compression Bonding |
| 01/01/2015 | US20150001701 Multichip module with stiffing frame and associated covers |
| 01/01/2015 | US20150001693 Leadframe pocket |
| 01/01/2015 | US20150001692 Semiconductor component having a lateral semiconductor device and a vertical semiconductor device |
| 01/01/2015 | US20150001689 Radio frequency shielding within a semiconductor package |
| 01/01/2015 | US20150001685 Semiconductor packages having through electrodes and methods of fabricating the same |
| 01/01/2015 | US20150001618 Semiconductor package |
| 01/01/2015 | US20150001599 Power Semiconductor Package with Non-Contiguous, Multi-Section Conductive Carrier |
| 01/01/2015 | US20150001559 Package for light emitting apparatus and light emitting apparatus including the same |
| 01/01/2015 | US20150001538 Semiconductor device and a method of manufacturing the same |
| 01/01/2015 | US20150001527 Light emitting display having light sensors |
| 01/01/2015 | US20150001425 Device for Emitting Electromagnetic Radiation |
| 12/31/2014 | CN204067356U 发光装置 Light-emitting device |
| 12/31/2014 | CN204067355U 隔离荧光粉集成的led 封装器件 Phosphor isolation led package integrated devices |
| 12/31/2014 | CN204067354U 一种八脚贴片式led灯 An eight-pin SMD led lights |
| 12/31/2014 | CN204067353U 一种大功率led集成cob光源封装结构 One kind of power led light source integrated package cob |
| 12/31/2014 | CN204067352U 一种桥式整流器内部封装结构 A bridge-type rectifier inside the package |
| 12/31/2014 | CN204067351U 双芯片封装体 Dual-chip package |
| 12/31/2014 | CN104254915A 高分辨率显示器的构造 Construct a high-resolution monitor |
| 12/31/2014 | CN104253203A 发光装置用封装件及使用了它的发光装置 A light emitting device package and a light emitting device using it |
| 12/31/2014 | CN104253188A 发光二极管元件的制造方法 The method of manufacturing a light emitting diode element |
| 12/31/2014 | CN104253122A 半导体封装件 Semiconductor package |
| 12/31/2014 | CN104253121A 全方位发光的发光二极管装置及其封装方法 Light-emitting diode light-emitting device and method for packaging a full range of |
| 12/31/2014 | CN104253120A 发光装置 Light-emitting device |
| 12/31/2014 | CN104253119A 一种电力半导体压接式绝缘型模块 A power semiconductor modules insulation crimp |