| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/02/2009 | US20090167351 Co-processor having configurable logic blocks |
| 07/02/2009 | US20090166851 Power semiconductor module |
| 07/02/2009 | US20090166832 Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate |
| 07/02/2009 | DE202009001611U1 Halbleiter-Temperatursensor mit ESD-Schutz Semiconductor temperature sensor with ESD protection |
| 07/02/2009 | DE102008051443A1 Halbleiter-Bauelement Semiconductor component |
| 07/02/2009 | DE102008050875A1 Printed circuit board for testing e.g. electronic device, has set of bypass pads testing electric circuit i.e. memory and formed of copper, and solder resist layer exposing external pads and covering bypass pads |
| 07/02/2009 | DE102007061261A1 Leuchtkörper mit LED-DIEs und deren Herstellung Fixtures with LED DIEs and their preparation |
| 07/02/2009 | DE102006040820B4 Elektrische Leistungspackung mit zwei Substraten mit mehreren elektronischen Komponenten Electric power pack with two substrates with several electronic components |
| 07/02/2009 | DE102005024830B4 Leuchtdioden-Anordnung Light emitting diode array |
| 07/02/2009 | DE102005018116B4 Leistungshalbleitermodul The power semiconductor module |
| 07/01/2009 | EP2075838A2 Light source module with high heat dissipation efficiency |
| 07/01/2009 | EP2075832A1 method for aligning and bonding elements and a device comprising aligned and bonded elements |
| 07/01/2009 | EP2075828A1 Semiconductor device and a method for aligining and bonding a first and second element for the fabrication of a semiconductor device |
| 07/01/2009 | EP2074656A2 A light module package |
| 07/01/2009 | EP2074655A1 Light-emitting apparatus |
| 07/01/2009 | EP2074654A1 High temperature, high voltage sic void-less electronic package |
| 07/01/2009 | CN201266609Y LED chip with electrostatic protection function |
| 07/01/2009 | CN201266608Y Die set for packing electronic element device |
| 07/01/2009 | CN201266607Y Discrete power module |
| 07/01/2009 | CN101473436A Method for achieving very high bandwidth between the levels of a cache hierarchy in 3-dimensional structures, and a 3-dimensional structure resulting therefrom |
| 07/01/2009 | CN101471337A Light source die set with good radiating performance |
| 07/01/2009 | CN101471336A 半导体装置 Semiconductor device |
| 07/01/2009 | CN101471335A Light emitting module and method for manufacturing the same |
| 07/01/2009 | CN101471334A Light-emitting device and manufacturing method thereof |
| 07/01/2009 | CN101471333A Optical device containing refrigeration chip |
| 07/01/2009 | CN101471332A Optical device containing laser diode and luminous diode |
| 07/01/2009 | CN101471331A Encapsulation structure and method of combined wafer die set |
| 07/01/2009 | CN101471330A Semiconductor encapsulation structure |
| 07/01/2009 | CN100508211C Fast switching power insulated gate semiconductor device |
| 07/01/2009 | CN100508188C A bar-shaped LED light source |
| 07/01/2009 | CN100508187C A luminescent device and preparation method thereof |
| 07/01/2009 | CN100508186C Surface mount light emitting type and preparation method thereof |
| 07/01/2009 | CN100508185C Stackable semi-conductor package structure and manufacture method thereof |
| 07/01/2009 | CN100508184C Stack type semiconductor packaging structure |
| 07/01/2009 | CN100508183C Chip package structure |
| 07/01/2009 | CN100508182C Semiconductor packaging structure having microstrip antenna structure |
| 06/30/2009 | US7554872 Semiconductor device including multi-chip |
| 06/30/2009 | US7554752 Lighting equipment |
| 06/30/2009 | US7554358 Programmable logic devices with user non-volatile memory |
| 06/30/2009 | US7554209 Semiconductor device having a metal plate conductor |
| 06/30/2009 | US7554205 Flip-chip type semiconductor device |
| 06/30/2009 | US7554181 Semiconductor device with non-overlapping chip mounting sections |
| 06/30/2009 | US7554114 High-heat-resistant semiconductor device |
| 06/30/2009 | US7554030 Tracking solar collector assembly |
| 06/30/2009 | US7553697 Multiple chip semiconductor package |
| 06/30/2009 | US7553691 forming a triple-junction cells comprising germanium bottom cell, indium, aluminum, gallium arsenide and phosphide containing middle cell having a heterojunction base and emitter disposed over bottom cell, and homojunction top cell; photovoltaic solar cells; enhanced performance |
| 06/30/2009 | CA2302957C Circuit chip connector and method of connecting a circuit chip |
| 06/25/2009 | WO2009079516A1 Reticulated heat dissipation |
| 06/25/2009 | WO2009078229A1 Semiconductor device and method for manufacturing the same |
| 06/25/2009 | WO2009077949A1 Illumination device including collimating optics |
| 06/25/2009 | WO2009077932A1 Light emitting module and thermal protection method |
| 06/25/2009 | WO2009076922A1 Arrangement comprising at least one optoelectronic semiconductor component |
| 06/25/2009 | US20090160544 Semiconductor integrated circuit |
| 06/25/2009 | US20090160036 Package with multiple dies |
| 06/25/2009 | US20090159918 Semiconductor light emitting devices and submounts and methods for forming the same |
| 06/25/2009 | DE102008061479A1 Sensormodul und Verfahren zum Herstellen eines Sensormoduls Sensor module and method of manufacturing a sensor module |
| 06/25/2009 | DE102008019902A1 Optoelektronisches Bauelement und Herstellungsverfahren für ein optoelektronisches Bauelement Optoelectronic component and manufacturing method for an optoelectronic component |
| 06/25/2009 | DE102008015941A1 Beleuchtungseinrichtung Lighting device |
| 06/25/2009 | DE102008013030A1 Strahlungsemittierende Vorrichtung Radiation emitting device |
| 06/25/2009 | DE102008008599A1 Light-emitting semiconductor component has epitaxially grown semiconductor layer sequence with sublayer suitable for light generation and electrical contacts, which are contacting semiconductor layer sequence |
| 06/25/2009 | DE102004029844B4 Halbleiterchippackung mit mehreren eingebetteten Chips Semiconductor chip package with multiple embedded chips |
| 06/24/2009 | EP2073280A1 Reflective secondary optics and semiconductor components |
| 06/24/2009 | EP2073265A1 Pressure contact in an assembly comprising a power semiconductor module |
| 06/24/2009 | EP2073264A1 Semiconductor device |
| 06/24/2009 | EP1614184B1 Integrated passive devices fabricated utilizing multi-layer, organic laminates |
| 06/24/2009 | CN201262957Y High on-stage voltage right-handed LED integrated chip |
| 06/24/2009 | CN201262956Y High-power multi-chip packaging structure of integrated circuit |
| 06/24/2009 | CN201262955Y High on-state voltage LED integrated chip with electrostatic protection |
| 06/24/2009 | CN101467253A Stacked IC encapsulation with interconnected top and bottom |
| 06/24/2009 | CN101467252A 半导体装置 Semiconductor device |
| 06/24/2009 | CN101467251A Semiconductor device |
| 06/24/2009 | CN101465348A LED encapsulation module capable of reducing operation temperature |
| 06/24/2009 | CN101465347A Light source die set and method of manufacturing the same |
| 06/24/2009 | CN101465346A Semiconductor device and method for manufacturing the device |
| 06/24/2009 | CN101465345A Light source deviceLight source die set and method for manufacturing the light source device |
| 06/24/2009 | CN101465344A Encapsulation structure of image die set |
| 06/24/2009 | CN101465343A Three-dimensional stack chip structure with vertical electrical self-connection and manufacturing method thereof |
| 06/24/2009 | CN101465342A Encapsulation structure for power-supply module |
| 06/24/2009 | CN101465341A Stacked chip packaging structure |
| 06/24/2009 | CN101465340A Stacked packaging structure |
| 06/24/2009 | CN100505254C Semiconductor device and its manufactureing method |
| 06/24/2009 | CN100505253C Memory module with different types of multi chip packages |
| 06/24/2009 | CN100505252C Buried chip package structure |
| 06/24/2009 | CN100505251C Light-emitting diode system |
| 06/24/2009 | CN100505250C 半导体封装装置 The semiconductor package device |
| 06/24/2009 | CN100505249C Semiconductor package structure and package method |
| 06/24/2009 | CN100505248C Stack type chip package with radiation structure |
| 06/24/2009 | CN100505247C Stack type chip package structure with wire frame inner pin installed with metal welding pad |
| 06/24/2009 | CN100505246C Semi-conductor packaging structure and producing method thereof |
| 06/24/2009 | CN100505245C Semiconductor chip packaging structure and semiconductor light source device |
| 06/24/2009 | CN100505244C 封装结构 Package structure |
| 06/24/2009 | CN100505243C Systems and methods for reducing simultaneous switching noise in an integrated circuit |
| 06/24/2009 | CN100505242C Multi-level semiconductor micro-module |
| 06/24/2009 | CN100505190C Integrated circuit package and its forming mehtod |
| 06/24/2009 | CN100505000C Light-emitting diode matrix display and exciting circuit |
| 06/24/2009 | CN100504146C LED illumination source and device |
| 06/23/2009 | US7552370 Application specific distributed test engine architecture system and method |
| 06/23/2009 | US7550843 Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member |
| 06/23/2009 | US7550842 Integrated circuit assembly |
| 06/23/2009 | US7550825 Interlayer dielectric and pre-applied die attach adhesive materials |