| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 07/21/2009 | US7563990 Electronic product, a body and a method of manufacturing |
| 07/21/2009 | US7563987 Electronic parts packaging structure and method of manufacturing the same |
| 07/21/2009 | US7563640 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof |
| 07/16/2009 | WO2009088869A2 Multiple access over proximity communication |
| 07/16/2009 | WO2009088069A1 Manufacturing method for condenser-packaged device, and manufacturing method for condenser-packaged package |
| 07/16/2009 | WO2009087037A2 Electric circuit arrangement comprising at least one power semiconductor, and method for the production thereof |
| 07/16/2009 | US20090180257 Stacked semiconductor apparatus, system and method of fabrication |
| 07/16/2009 | DE202009001880U1 Packaging-Struktur einer Vollfarb-LED mit Antriebsmechanismus Packaging structure of a full-color LED with drive mechanism |
| 07/16/2009 | DE102009004168A1 Schichtbauelement-Herstellungsverfahren Layer device manufacturing method |
| 07/16/2009 | DE102008042511A1 Verfahren zur Packung eines Doppelschicht-Moduls einer Leuchtdiode und Anordnung, die mit dem Verfahren hergestellt ist A method of packing a double-layer module of a light emitting diode and assembly which is prepared by the procedure |
| 07/16/2009 | DE102008009510B3 Verfahren zum Niedertemperatur-Drucksintern Method for low temperature pressure sintering |
| 07/16/2009 | DE102006057248B4 Halbleitermodul Semiconductor module |
| 07/16/2009 | DE10149580B4 Halbleitervorrichtung Semiconductor device |
| 07/15/2009 | EP2079291A1 Printed circuit board and method of manufacturing printed circuit board |
| 07/15/2009 | EP2079108A1 Semiconductor electronic component and semiconductor device using the same |
| 07/15/2009 | EP2078227A2 Display system |
| 07/15/2009 | EP1371094A4 sUPER-THIN HIGH SPEED FLIP CHIP PACKAGE |
| 07/15/2009 | CN201274291Y Packaging structure |
| 07/15/2009 | CN101483174A Die package including substrate with molded device |
| 07/15/2009 | CN101483173A Semiconductor cooling structure |
| 07/15/2009 | CN100514638C AC-LED single chip having three contact points |
| 07/15/2009 | CN100514637C Transparent LED display and method for manufacture thereof |
| 07/15/2009 | CN100514636C Light-emitting diode package, light-emitting diode array and method for improving chromatic aberration |
| 07/15/2009 | CN100514635C Sealing structure of light-emitting diodes |
| 07/15/2009 | CN100514634C 半导体装置 Semiconductor device |
| 07/15/2009 | CN100514633C System-in-package structure |
| 07/15/2009 | CN100514632C Stack type semiconductor packaging structure |
| 07/15/2009 | CN100514631C Structure and method for packing infrared receiving mould set and surface-adhered mould set |
| 07/15/2009 | CN100514630C Multi-chip assembly and method for driving the same |
| 07/15/2009 | CN100514584C Manufacturing method for semiconductor device, semiconductor device, circuit substrate and apparatus |
| 07/15/2009 | CN100514580C Reversible leadless package and stack thereof |
| 07/14/2009 | US7562318 Test structure for automatic dynamic negative-bias temperature instability testing |
| 07/14/2009 | US7561221 Apparatuses and methods for forming assemblies |
| 07/14/2009 | US7560745 LED package and backlight assembly for LCD comprising the same |
| 07/14/2009 | US7560741 Lighting module and method for the production thereof |
| 07/14/2009 | US7560738 Light-emitting diode array having an adhesive layer |
| 07/14/2009 | US7560694 Method and system for increasing signal-to-noise ratio in microbolometer arrays |
| 07/14/2009 | US7560305 Apparatus and method for high density multi-chip structures |
| 07/09/2009 | WO2009084300A1 Interposer and manufacturing method of the interposer |
| 07/09/2009 | WO2009084299A1 Interposer and manufacturing method of the interposer |
| 07/09/2009 | WO2009083582A1 Method for aligning and bonding elements and a device comprising aligned and bonded elements |
| 07/09/2009 | WO2009032153A3 Memory device interface methods, apparatus, and systems |
| 07/09/2009 | WO2009016192A3 Arrangement comprising at least one semiconductor component, in particular a power semiconductor component for the power control of high currents |
| 07/09/2009 | WO2007122548A3 Thermal isolation of electronic devices in submount used for leds lighting applications |
| 07/09/2009 | US20090174070 Three-dimensional stacked substrate arrangements |
| 07/09/2009 | US20090174060 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 07/09/2009 | US20090174051 Semiconductor package and semiconductor device |
| 07/09/2009 | DE4443424B4 Anordnungen aus einem mehrschichtigen Substrat und einem Leistungselement und Verfahren zu ihrer Herstellung Arrays of a multi-layer substrate and a power element and process for their preparation |
| 07/09/2009 | DE202008005509U1 LED-Modul mit anwendungsspezifischer Farbeinstellung LED module with application-specific color setting |
| 07/09/2009 | DE10303103B4 Halbleiterbauteil, insbesondere Leistungshalbleiterbauteil Semiconductor component, in particular power semiconductor component |
| 07/09/2009 | DE102008051965A1 Bauelement mit mehreren Halbleiterchips Component having a plurality of semiconductor chips |
| 07/09/2009 | DE102007054710B3 Verfahren zur Herstellung einer Halbleiterbaugruppe A process for producing a semiconductor package |
| 07/09/2009 | DE102004057421B4 Druckkontaktiertes Leistungshalbleitermodul für hohe Umgebungstemperaturen und Verfahren zu seiner Herstellung Pressure-contacted power semiconductor module for high ambient temperatures and process for its preparation |
| 07/09/2009 | DE102004046806B4 Leistungshalbleitermodul The power semiconductor module |
| 07/09/2009 | CA2704707A1 Formation of a hybrid integrated circuit device |
| 07/08/2009 | EP2077703A1 Printed circuit board and method of manufacturing printed circuit board |
| 07/08/2009 | EP2077583A1 Light detecting device |
| 07/08/2009 | EP2077582A1 Light detecting device |
| 07/08/2009 | EP2077579A1 Twin chip-mounted diode |
| 07/08/2009 | CN101477982A Photoconverter, manufacturing process thereof, and LED |
| 07/08/2009 | CN101477981A Light source module and manufacturing process thereof |
| 07/08/2009 | CN101477980A Stacked wafer level package having a reduced size |
| 07/08/2009 | CN101477979A Multi-chip encapsulation body |
| 07/08/2009 | CN100512613C Power component cooling device |
| 07/08/2009 | CN100512597C Method for manufacturing circuit board |
| 07/08/2009 | CN100511725C Optical communication module |
| 07/08/2009 | CN100511679C Semiconductor device |
| 07/08/2009 | CN100511677C Contact device |
| 07/08/2009 | CN100511676C Microelectronic package method and device |
| 07/08/2009 | CN100511675C Light emitting unit |
| 07/08/2009 | CN100511674C A side-lighting LED illumination lamp, illuminating method of backlight source and mobile phone |
| 07/08/2009 | CN100511673C Integrated circuit for driving semiconductor device and power converter |
| 07/08/2009 | CN100511672C Chip stacking semiconductor device |
| 07/08/2009 | CN100511671C Semiconductor package structure |
| 07/08/2009 | CN100511670C 半导体装置 Semiconductor device |
| 07/08/2009 | CN100511669C Light source assembly and luminous chip packaging body |
| 07/08/2009 | CN100511612C Wire bonding apparatus and method thereof |
| 07/07/2009 | US7557646 Semiconductor device with non-intersecting power and ground wiring patterns |
| 07/07/2009 | US7557645 Semiconductor device |
| 07/07/2009 | US7557644 Fully integrated floating power supply for high voltage technologies including N-EPI biasing |
| 07/07/2009 | US7557610 Columnar floorplan |
| 07/07/2009 | US7557609 Configurable integrated circuit with different connection schemes |
| 07/07/2009 | US7557608 Passgate structures for use in low-voltage applications |
| 07/07/2009 | US7557512 Organic electroluminescent device and driving apparatus |
| 07/07/2009 | US7557442 Power semiconductor arrangement |
| 07/07/2009 | US7557438 Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same |
| 07/07/2009 | US7557437 Fan out type wafer level package structure and method of the same |
| 07/07/2009 | US7557292 Modular shade system with solar tracking panels |
| 07/07/2009 | US7557291 Photovoltaic module for roofs |
| 07/07/2009 | US7557014 Semiconductor system-in-package |
| 07/07/2009 | US7556983 Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same |
| 07/07/2009 | CA2483363C Light-receiving or light-emitting panel, and manufacturing method thereof |
| 07/02/2009 | WO2009081723A1 Semiconductor device and method for manufacturing the same |
| 07/02/2009 | WO2009081689A1 Semiconductor module |
| 07/02/2009 | WO2009081225A1 Thermal sensors for stacked dies |
| 07/02/2009 | WO2009080354A1 Reflective secondary optics and semiconductor assembly and method for the production thereof |
| 07/02/2009 | WO2009079985A2 Optoelectronic component and production method for an optoelectronic component |
| 07/02/2009 | WO2009079983A1 Led chip with discharge protection |
| 07/02/2009 | WO2009079772A1 Method for stacking serially-connected integrated circuits and multi-chip device made from same |
| 07/02/2009 | US20090168390 Directing the flow of underfill materials using magnetic particles |