| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/05/2009 | CN100524734C Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same |
| 08/05/2009 | CN100524733C Semiconductor power module |
| 08/05/2009 | CN100524720C Outer down-lead assembly of multimodule spliced long alignment infrared focal plane detector |
| 08/05/2009 | CN100524704C Semiconductor device and method for making the same |
| 08/05/2009 | CN100524672C Method for manufacturing display device |
| 08/05/2009 | CN100523898C LSI package provided with interface module and method of mounting the same |
| 08/04/2009 | US7570079 Level-restoring buffers for programmable interconnect circuits and method for building the same |
| 08/04/2009 | US7569940 Method and device for connecting chips |
| 08/04/2009 | US7569922 Semiconductor device having a bonding wire and method for manufacturing the same |
| 08/04/2009 | US7569861 Light emitting device having light emitting elements |
| 08/04/2009 | US7569473 Methods of forming semiconductor assemblies |
| 08/04/2009 | US7569418 Methods for securing packaged semiconductor devices to carrier substrates |
| 08/04/2009 | US7568823 Systems and components for enhancing rear vision from a vehicle |
| 07/30/2009 | WO2009093982A1 Power switching module |
| 07/30/2009 | WO2009093895A1 A method for producing a led assembly and led assembly produced by the method |
| 07/30/2009 | WO2009093414A1 Multilayer packaging structure |
| 07/30/2009 | WO2009092362A1 Optoelectronic component and method for producing an optoelectronic component and a wafer |
| 07/30/2009 | WO2006054236A3 Composite led modules |
| 07/30/2009 | US20090189515 Laminated interconnects for organic opto-electronic device modules and methods |
| 07/30/2009 | US20090189273 Multiphase synchronous buck converter |
| 07/30/2009 | US20090189268 Method of manufacturing semiconductor device |
| 07/30/2009 | DE10345377B4 Halbleitermodul und Verfahren zur Herstellung eines Halbleitermoduls Semiconductor module and method for manufacturing a semiconductor module |
| 07/30/2009 | DE102004061908B4 Verfahren zum Herstellen einer Schaltungsanordnung auf einem Substrat A method for manufacturing a circuit arrangement on a substrate |
| 07/30/2009 | DE102004049744B4 Schaltungsanordnung Circuitry |
| 07/30/2009 | DE10129006B4 Elektronische Baugruppe Electronic assembly |
| 07/30/2009 | DE10119474B4 Halbleitergerät mit nivelliert ausgebildeten Strompfadlängen Semiconductor device formed leveled current path lengths |
| 07/30/2009 | DE10044455B4 Signalleuchte Signal light |
| 07/29/2009 | EP2083454A2 Light emitting diode package |
| 07/29/2009 | EP2083344A1 Memory card |
| 07/29/2009 | EP1271653B1 Semiconductor device comprising an insulated gate bipolar transistor and a free-wheel diode |
| 07/29/2009 | CN201282143Y Packaging structure for chip integrated circuit |
| 07/29/2009 | CN201282142Y Plastic packaging body flat seal type novel semiconductor packaging structure |
| 07/29/2009 | CN101496171A LED mosaic |
| 07/29/2009 | CN101496170A Integrating light source module |
| 07/29/2009 | CN101494219A High-power LED aluminum substrate integrated module |
| 07/29/2009 | CN101494218A Multichannel stacking semiconductor apparatus and production method thereof and application of stacking substrate |
| 07/29/2009 | CN101494217A Conductor frame |
| 07/29/2009 | CN100521470C Surface mounted power supply circuit apparatus and method for manufacturing the same |
| 07/29/2009 | CN100521200C Light emitting semiconductor module with by-path turn-on switch |
| 07/29/2009 | CN100521199C Heat dissipation electronic devices and forming method thereof |
| 07/29/2009 | CN100521198C Semiconductor apparatus and a production method thereof |
| 07/29/2009 | CN100521197C Semiconductor device |
| 07/29/2009 | CN100521196C Semiconductor device |
| 07/29/2009 | CN100521195C 半导体装置 Semiconductor device |
| 07/29/2009 | CN100521194C Package structure of crystal particle and manufacturing method thereof |
| 07/29/2009 | CN100521193C Relay board provided in semiconductor device and semiconductor device |
| 07/29/2009 | CN100521192C 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 07/29/2009 | CN100521176C 半导体芯片及半导体装置 The semiconductor chip and semiconductor device |
| 07/29/2009 | CN100521167C Method for producing mixed integrated circuit apparatus |
| 07/28/2009 | US7566955 High-frequency chip packages |
| 07/28/2009 | US7566878 Radiation image detector |
| 07/28/2009 | US7566834 Wiring board and semiconductor package using the same |
| 07/28/2009 | US7566828 Power source device and charge controlling method to be used in same |
| 07/28/2009 | US7566590 Low voltage drop and high thermal performance ball grid array package |
| 07/28/2009 | US7565738 Method for manufacturing circuit device |
| 07/23/2009 | WO2009090896A1 Electronic component |
| 07/23/2009 | WO2009090693A1 Circuit board module and electronic apparatus |
| 07/23/2009 | WO2009090349A2 Method for making an electrically conducting mechanical interconnection member |
| 07/23/2009 | WO2009037648A3 Integrated circuit stack and its thermal management |
| 07/23/2009 | WO2009004243A4 Assemblage of radiofrequency chips |
| 07/23/2009 | US20090184759 Semiconductor integrated circuit device |
| 07/23/2009 | US20090184409 Semiconductor device including semiconductor chips with different thickness |
| 07/23/2009 | DE10297047B4 Lötfreie Leiterplatten-Baugruppe Solderless PCB assembly |
| 07/23/2009 | DE102005047106B4 Leistungshalbleitermodul und Verfahren zur Herstellung The power semiconductor module and process for preparing |
| 07/22/2009 | EP2081419A2 Printed circuit board and method of manufacturing printed circuit board |
| 07/22/2009 | EP2081227A2 Light-emitting device and lighting apparatus incorporating same |
| 07/22/2009 | EP2081226A1 Multi-channel stackable semiconductor device and method for fabricating the same, and stacking substrate applied to the semiconductor device |
| 07/22/2009 | EP2008316A4 Multi-element led lamp package |
| 07/22/2009 | EP1528593B1 Semiconductor device and method for manufacturing the same |
| 07/22/2009 | CN201278349Y Surface adhesive LED encapsulation structure |
| 07/22/2009 | CN201278348Y Plug type LED encapsulation structure for fuse wire |
| 07/22/2009 | CN101488497A Stacked semiconductor apparatus with configurable vertical I/O |
| 07/22/2009 | CN101488496A Semiconductor device and power supply system |
| 07/22/2009 | CN101488495A Semiconductor module with switching components and driver electronics |
| 07/22/2009 | CN101488494A Conductive wire type semiconductor device and conductive wire rack thereof |
| 07/22/2009 | CN101488480A Interlayer dielectric and pre-applied die attach adhesive materials |
| 07/22/2009 | CN100517708C Hybrid integrated circuit device |
| 07/22/2009 | CN100517707C Light-emitting diode arrangement, optical recording device and method for the pulsed operation of at least one light-emitting diode |
| 07/22/2009 | CN100517706C Radiation source and method for producing lens mould |
| 07/22/2009 | CN100517705C Power semiconductor module |
| 07/22/2009 | CN100517704C 半导体装置 Semiconductor device |
| 07/22/2009 | CN100517703C Semiconductor module comprising a coupling substrate and production method thereof |
| 07/22/2009 | CN100517702C Ultrafast recovery diode module |
| 07/22/2009 | CN100517701C Polycrystal pieces packaging structure |
| 07/22/2009 | CN100517700C Image sensor package structure |
| 07/22/2009 | CN100517699C Stack package with vertically formed heat sink |
| 07/22/2009 | CN100517698C Image sensing devices, image sensor modules, and manufacturing methods |
| 07/22/2009 | CN100517697C Integrated circuit chip and package |
| 07/22/2009 | CN100517696C Semiconductor device having semiconductor element, insulation substrate and metal electrode |
| 07/22/2009 | CN100517695C Semiconductor device |
| 07/22/2009 | CN100517694C Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device |
| 07/22/2009 | CN100517693C Electronic package and packaging method |
| 07/22/2009 | CN100517692C Semiconductor color changing luminescent device |
| 07/22/2009 | CN100517691C Chip interconnection structure and system |
| 07/22/2009 | CN100517690C Three-dimensional package |
| 07/21/2009 | US7564262 Crossbar comparator |
| 07/21/2009 | US7564261 Embedding memory between tile arrangement of a configurable IC |
| 07/21/2009 | US7564142 Electronic device and method of manufacturing the same, circuit board, and electronic instrument |
| 07/21/2009 | US7564139 Semiconductor device and method for manufacturing the same |
| 07/21/2009 | US7564118 Chip and wafer integration process using vertical connections |