H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2009
08/19/2009	CN100530629C Multi-wafer piling base plate and multi-wafer piling encapsulation structure based on this base plate
08/19/2009	CN100530609C Semiconductor device and manufacturing method of the same
08/19/2009	CN100530579C Method for manufacture of transparent devices having light emitting diodes (LED)
08/19/2009	CN100530576C Semiconductor device and its manufacturing method
08/19/2009	CN100530573C Photoelectric sensor and detector terminal module therefor
08/18/2009	US7576565 Crossbar waveform driver circuit
08/18/2009	US7576563 High fan-out signal routing systems and methods
08/18/2009	US7576440 Semiconductor chip having bond pads and multi-chip package
08/18/2009	US7576431 Semiconductor chip package and multichip package
08/18/2009	US7576421 Semiconductor device having a multi-layered semiconductor substrate
08/18/2009	US7576420 Semiconductor integrated circuit device having reduced terminals and I/O area
08/18/2009	US7576282 Photovoltaic awning structures
08/18/2009	US7575957 Leadless semiconductor package and method for manufacturing the same
08/18/2009	US7575953 Stacked die with a recess in a die BGA package
08/18/2009	CA2416193C Matrix converter for the transformation of electrical energy
08/13/2009	WO2009099191A1 Film for semiconductor, method for manufacturing semiconductor device and semiconductor device
08/13/2009	WO2009074814A3 An electronic device
08/13/2009	WO2009071313A3 Substrate for an led submount, and led submount
08/13/2009	WO2009033837A3 Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias
08/13/2009	US20090200869 System and method for creating a networked infrastructure roadway distribution platform of solar energy gathering devices
08/13/2009	US20090200665 Semiconductor device and method of manufacturing the same
08/13/2009	US20090200653 Memory modules and systems including the same
08/13/2009	US20090200651 Multi-chip package
08/13/2009	US20090200468 Clip-on infrared imager
08/13/2009	US20090200467 Automatic image-based volumetric detection of an object in a space
08/13/2009	DE102009006869A1 Halbleitermodul Semiconductor module
08/13/2009	DE102009005650A1 Mehrchipmodul Multi-chip module
08/12/2009	EP2088623A1 A multi-component electrical module
08/12/2009	EP2087534A2 High efficiency light emitting articles and methods of forming the same
08/12/2009	EP2087533A2 Planarized led with optical extractor
08/12/2009	EP2087508A1 Method of making a contact on a backside of a die
08/12/2009	CN201289865Y Patch light-emitting diode
08/12/2009	CN201289849Y Pentagon LED die set with lamp cup
08/12/2009	CN201289848Y Square LED die set
08/12/2009	CN101507095A Ultra and very-high efficiency solar cells
08/12/2009	CN101506975A Stack die packages
08/12/2009	CN101504965A Light emitting dipolar body and back light module unit
08/12/2009	CN101504943A 半导体集成电路 The semiconductor integrated circuit
08/12/2009	CN101504942A Improved SOT encapsulation structure
08/12/2009	CN101504941A Improved SOT encapsulation structure for multi-chip dual basement
08/12/2009	CN101504940A Semico.nductor package, and method of manufacturing semiconductor package
08/12/2009	CN101504939A 半导体器件 Semiconductor devices
08/12/2009	CN101504938A LED encapsulation structure and LED encapsulation method
08/12/2009	CN101504919A Encapsulation structure and method for semi-conductor
08/12/2009	CN100527108C Memory system and memory module
08/12/2009	CN100526901C Probe card for probing wafers with raised contact elements
08/12/2009	CN100526709C Method and apparatus for LED panel lamp systems
08/11/2009	US7573723 Method for attaching chips in a flip-chip arrangement
08/11/2009	US7573296 Configurable IC with configurable routing resources that have asymmetric input and/or outputs
08/11/2009	US7573136 Semiconductor device assemblies and packages including multiple semiconductor device components
08/11/2009	US7573135 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
08/11/2009	US7573128 Semiconductor module in which a semiconductor package is bonded on a mount substrate
08/11/2009	US7573041 Imaging apparatus, radiation imaging apparatus, and radiation imaging system
08/11/2009	US7573006 Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing
08/11/2009	US7572671 Stacked module systems and methods
08/11/2009	US7571759 Stacked type cooler
08/06/2009	WO2009096897A1 Positioning apparatus and method
08/06/2009	WO2009096233A1 Crimp-type high power thyristor module
08/06/2009	WO2009096203A1 Semiconductor device
08/06/2009	WO2009095860A1 Lighting unit with temperature compensation
08/06/2009	WO2009095829A1 Semiconductor package with incorporated light or temperature sensors and time multiplexing
08/06/2009	WO2009094987A1 Radiation-emitting optoelectronic component and method for producing a radiation-emitting component
08/06/2009	WO2009074454A3 Semiconductor module and connection terminal device
08/06/2009	US20090194792 Semiconductor device and manufacturing method therefor
08/06/2009	US20090194768 Vertical system integration
08/06/2009	DE202009006068U1 Leuchtdiodenchip und Leuchtdioden-Chiparray mit rechteckiger Abstrahlung LED chip and LED chip array with rectangular radiation
08/06/2009	DE102008029191A1 Beleuchtungseinrichtung zur Hinterleuchtung eines Displays sowie ein Display mit einer solchen Beleuchtungseinrichtung Illumination device for backlighting a display and a display with such a lighting device
08/06/2009	DE102008018353A1 Strahlungsemittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelelements A radiation-emitting optoelectronic component and method of manufacturing a radiation-emitting Bauelelements
08/06/2009	DE10119502B4 Halbleitergerät mit gleichmäßigen Strompfaden und kleinem Aufbau Semiconductor device with uniform flow paths and small construction
08/05/2009	EP2084742A1 Method of manufacturing stacked chip packages
08/05/2009	EP1356520B1 Microelectronic substrate with integrated devices
08/05/2009	CN101501847A Semiconductor device
08/05/2009	CN101501388A Illumination device with wavelength converting element side holding heat sink
08/05/2009	CN101501153A Film adhesive, adhesive sheet, and semiconductor device using the same
08/05/2009	CN101499508A LED device and its production method
08/05/2009	CN101499504A Luminous element packaging structure
08/05/2009	CN101499468A LED device
08/05/2009	CN101499467A Thermoelectric module
08/05/2009	CN101499466A Thermoelectric module
08/05/2009	CN101499465A Thermoelectric module and manufacturing method thereof
08/05/2009	CN101499464A Method for manufacturing stack package using through-electrodes
08/05/2009	CN101499463A Ultra-high-power LED die set light source structure
08/05/2009	CN101499462A Ultra-high-power LED die set light source bracket
08/05/2009	CN101499461A Photoelectric element and optical sub-module employing the same
08/05/2009	CN101499460A Electronic packaging circuit board assembly with strutting member
08/05/2009	CN101499432A Stacked semiconductor device and method
08/05/2009	CN100524864C LED encapsulation structure and its making method
08/05/2009	CN100524747C Mounting structure in integrated circuit module
08/05/2009	CN100524746C High power LED module for spot illumination
08/05/2009	CN100524745C Method for packaging organic light emitting display with frit seal and reinforcing structure
08/05/2009	CN100524744C Semiconductor device of laminated chips
08/05/2009	CN100524743C Oganic light-emitting display device and method for fabricating the same
08/05/2009	CN100524742C Power semiconductor device
08/05/2009	CN100524741C Stack packaging structure
08/05/2009	CN100524740C Stack type package
08/05/2009	CN100524739C Semiconductor device and fabrication method thereof
08/05/2009	CN100524738C Multi-chip stacking package structure
08/05/2009	CN100524737C Power module, Phase leg, and three-phase inverter
08/05/2009	CN100524736C A stacking type wafer packaging structure
08/05/2009	CN100524735C Semiconductor device

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