| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/02/2009 | EP2096671A1 Adhesive tape and semiconductor device using the same |
| 09/02/2009 | EP2095421A2 Individually encapsulated solar cells and/or solar cell strings |
| 09/02/2009 | CN201302997Y LED encapsulation structure |
| 09/02/2009 | CN101523599A A light module package |
| 09/02/2009 | CN101523598A Light-emitting diode arrangement and method for producing the same |
| 09/02/2009 | CN101523597A Electronic circuit device and method for manufacturing the same |
| 09/02/2009 | CN101521253A Solid luminous element and light source module |
| 09/02/2009 | CN101521246A 成像探测器 Imaging Detectors |
| 09/02/2009 | CN101521198A Electronic device |
| 09/02/2009 | CN101521197A Stepper for juxtaposedly pushing three or four piezoelectrics and scanning probe microscope body thereof |
| 09/02/2009 | CN101521196A Light-emitting diode (LED) and method for preparing LED and base of LED |
| 09/02/2009 | CN101521195A Three-friction stepper for juxtaposedly pushing double piezoelectrics and scanning probe microscope thereof |
| 09/02/2009 | CN101521194A High-speed photoelectric subassembly and flip chip structure thereof |
| 09/02/2009 | CN101521193A Electronic encapsulating structure |
| 09/02/2009 | CN101521192A Package structure of light emitting diode and the packaging method thereof |
| 09/02/2009 | CN101521191A Series connection electricity utilization signal processing circuit and electronic device |
| 09/02/2009 | CN101521183A Semiconductor light emitting device and method for manufacturing the same |
| 09/02/2009 | CN100536131C Semiconductor device and fabricating method thereof |
| 09/02/2009 | CN100536130C High heat radiation multi-chip integrated high-power white light LED module and its making method |
| 09/02/2009 | CN100536129C Inter-chip ESD protection structure for high speed and high frequency devices and its forming method |
| 09/02/2009 | CN100536128C Semiconductor module and method of manufacturing the same |
| 09/02/2009 | CN100536127C 电路装置 Circuit means |
| 09/02/2009 | CN100536122C Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 09/01/2009 | US7583019 Semiconductor light-emitting device with wavelength change material |
| 09/01/2009 | US7582919 Functional coating of the SCFM preform |
| 09/01/2009 | US7582878 Method, apparatus, and system of electric-signal detection by asynchronous demultiplexing |
| 09/01/2009 | US7582512 Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device |
| 09/01/2009 | US7582510 Electronic packaging materials for use with low-k dielectric-containing semiconductor devices |
| 08/27/2009 | WO2009104536A1 Semiconductor chip and semiconductor device |
| 08/27/2009 | US20090212819 Method and system for changing circuits in an integrated circuit |
| 08/27/2009 | US20090212410 Stack die packages |
| 08/27/2009 | US20090212327 Standard cell libraries and integrated circuit including standard cells |
| 08/27/2009 | US20090212216 Mining methods and apparatus |
| 08/27/2009 | DE102008026841A1 Optoelektronisches Bauteil The optoelectronic device |
| 08/27/2009 | DE102008011150A1 Optoelectronic component has stack of semiconductor layers which have active layer suitable for producing electromagnetic radiation and main surface for extracting radiation |
| 08/27/2009 | DE102008010512A1 Optoelectronic component, particularly light emitting diode or photodiode, has semiconductor chip with chip lower side, and two electrical bondings with contact lower sides |
| 08/27/2009 | DE102008009808A1 LED-light strip, has casting compound presented as contoured casting compound, where process of electromagnetic shaft is determined by contoured casting compound, and LED air-tightly locked by compound compared to substrate or plate |
| 08/26/2009 | EP2093798A2 MCM packages |
| 08/26/2009 | EP2093792A1 Method for power semiconductor module fabricaton, its apparatus, power semiconductor module and its junction method |
| 08/26/2009 | EP2092566A2 Color tunable illumination source and method for controlled illumination |
| 08/26/2009 | EP2092466A2 A self-display rfid tag device with a display unit or bluetooth technology to send / receive data |
| 08/26/2009 | EP1394734B1 Ic card |
| 08/26/2009 | CN201298552Y Ball-bar array packaged chip |
| 08/26/2009 | CN201298551Y High-voltage LED |
| 08/26/2009 | CN101517845A Socket, module board, and inspection system using the module board |
| 08/26/2009 | CN101517757A Led semiconductor element, and use thereof |
| 08/26/2009 | CN101515053A Lens module and illuminating device |
| 08/26/2009 | CN100533796C Light emitting diode with good light radiation and color development |
| 08/26/2009 | CN100533795C Light emitting device |
| 08/26/2009 | CN100533730C High-frequency circuit module and radio communication apparatus |
| 08/26/2009 | CN100533729C Power semiconductor module with reduced parasitic inductances |
| 08/26/2009 | CN100533728C Chip stage package for integrated multi-chip |
| 08/26/2009 | CN100533727C Module for optical device and manufacturing method thereof |
| 08/26/2009 | CN100533726C Operation processing apparatus |
| 08/26/2009 | CN100533724C Electronic device |
| 08/26/2009 | CN100533720C Semiconductor device, mounting structure, electro-optical device and electronic member manufacture method |
| 08/25/2009 | US7579869 Repeatable block producing a non-uniform routing architecture in a field programmable gate array having segmented tracks |
| 08/25/2009 | US7579868 Architecture for routing resources in a field programmable gate array |
| 08/25/2009 | US7579866 Programmable logic device with configurable override of region-wide signals |
| 08/25/2009 | US7579681 Super high density module with integrated wafer level packages |
| 08/25/2009 | US7579629 Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
| 08/25/2009 | US7579269 Microelectronic spring contact elements |
| 08/20/2009 | WO2009102485A1 Broadband light emitting device lamps for providing white light output |
| 08/20/2009 | WO2009101685A1 Semiconductor element module and method for manufacturing the same |
| 08/20/2009 | WO2009016497A3 Die stacking apparatus and method |
| 08/20/2009 | US20090209063 Chipstack package and manufacturing method thereof |
| 08/20/2009 | US20090206471 Electronic parts packaging structure and method of manufacturing the same |
| 08/20/2009 | US20090206462 Semiconductor device and method for manufacturing thereof |
| 08/20/2009 | US20090206451 Semiconductor device |
| 08/20/2009 | US20090206379 Semiconductor device and manufacturing method thereof |
| 08/20/2009 | US20090206261 Apparatus and Method For Analyzing Relative Outward Flow Characterizations of Fabricated Features |
| 08/20/2009 | DE202009007822U1 Kühlvorrichtung LED-Lampen Cooler LED lamps |
| 08/20/2009 | DE202009007540U1 LED-Packungsanordnung und LED-Balken unter Verwendung derselben LED package assembly and LED bar using the same |
| 08/20/2009 | DE102008043645A1 Optische Halbleiterbaugruppe, diese enthaltender photoelektrischer Sensor und Verfahren zur Herstellung der optischen Halbleiterbaugruppen Optical semiconductor package, these containing photoelectric sensor and method for manufacturing the optical semiconductor modules |
| 08/20/2009 | DE102008009913A1 Electronic power converter module for power electronics, has semiconductor module, which is arranged on base body, and has two direct current connections |
| 08/20/2009 | DE102005014176B4 Verfahren zum Erstellen einer Schutzanordnung zum Schutz eines Elektronikbausteins vor elektrostatischen Entladungen und entsprechend ausgebildeter Elektronikbaustein Method for creating a protective order to protect an electronic module from ESD and appropriately designed electronic module |
| 08/20/2009 | DE102005008491B4 Leistungs-Halbleitervorrichtung und Verfahren zu ihrer Herstellung Power semiconductor device and process for their preparation |
| 08/20/2009 | CA2715344A1 Semiconductor element module and method for manufacturing the same |
| 08/19/2009 | EP2091080A1 Power semiconductor with a substrate and a printing device |
| 08/19/2009 | EP1665393B8 PV wind performance enhancing methods |
| 08/19/2009 | EP1060513B1 Semiconductor component with several semiconductor chips |
| 08/19/2009 | CN201294227Y Conductor frame structure of LED |
| 08/19/2009 | CN101512763A Apparatus for obtaining radiant energy |
| 08/19/2009 | CN101512757A Power semiconductor module with explosion protection |
| 08/19/2009 | CN101512721A Method and structure for fabricating solar cells using a layer transfer process |
| 08/19/2009 | CN101510546A Led-array with temperature sensor |
| 08/19/2009 | CN101510545A Light-emitting device |
| 08/19/2009 | CN101510544A Integrated front-end passive equalizer and method thereof |
| 08/19/2009 | CN101510543A Integrated semiconductor device |
| 08/19/2009 | CN101510542A Encapsulation structure and manufacturing method for high power light-emitting diode chip |
| 08/19/2009 | CN100531524C Method of making mounting plates |
| 08/19/2009 | CN100531520C Bank structure, method of forming bank structure, device, electro-optical device and electronic apparatus |
| 08/19/2009 | CN100531310C 数码相机模组 Digital Camera Module |
| 08/19/2009 | CN100530640C 集成电路组合件 IC assembly |
| 08/19/2009 | CN100530639C System-in-package type static random access memory device and manufacturing method thereof |
| 08/19/2009 | CN100530638C Organic light emitting device and manufacturing method thereof |
| 08/19/2009 | CN100530637C Stacked structures and methods of forming stacked structures |
| 08/19/2009 | CN100530636C Three-dimensional multiple chips packaging module and preparation method |
| 08/19/2009 | CN100530635C Stacking method and stacked structure for attaching memory components to associated device |
| 08/19/2009 | CN100530634C Method and structure for wafer-to-wafer alignments |