| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/16/2009 | CN101533836A Large-array CMOS image sensor and manufacturing method thereof |
| 09/16/2009 | CN101533835A An active electron component |
| 09/16/2009 | CN101533834A Thin compact semiconductor die packages suitable for smart-power modules, methods of making the same, and systems using the same |
| 09/16/2009 | CN101533833A Busbar assembly with integrated cooling |
| 09/16/2009 | CN101533832A Integrated chips of Micro-electro-mechanism system device and integrated circuit, and integration method |
| 09/16/2009 | CN101533831A Solar energy collecting/storing module and manufacturing method thereof |
| 09/16/2009 | CN101533817A Semiconductor encapsulation structure with pins on bearing seat |
| 09/16/2009 | CN101533811A Structure of semiconductor chip with silicon through hole and stacking assembly thereof |
| 09/16/2009 | CN101533791A Method for manufacturing luminescence module and luminescence module |
| 09/16/2009 | CN101533784A Light emitting diode encapsulating structure and production method thereof |
| 09/16/2009 | CN100542375C Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module |
| 09/16/2009 | CN100541837C Method and apparatus for producing untainted white light using white-like light emitting diodes |
| 09/16/2009 | CN100541796C Light receiving module |
| 09/16/2009 | CN100541795C Side view LED with improved arrangement of protection device |
| 09/16/2009 | CN100541794C Flash module with quantum dot light conversion |
| 09/16/2009 | CN100541793C 堆叠式光源 Stacked light |
| 09/16/2009 | CN100541792C A composite assembly that incorporate multiple devices that use different wavelengths of light and method for making same |
| 09/16/2009 | CN100541791C Semiconductor device and method of manufacturing the same |
| 09/16/2009 | CN100541790C Solid-state image pickup device and method for manufacturing thereof |
| 09/16/2009 | CN100541789C Stack package utilizing through vias and re-distribution lines |
| 09/16/2009 | CN100541788C Manufacture method of semiconductor device and stack package |
| 09/16/2009 | CN100541787C Stacked type semiconductor memory device and chip selection circuit |
| 09/16/2009 | CN100541786C A device for providing low noise power supply package to IC |
| 09/16/2009 | CN100541785C Semiconductor package stack with through-via connection |
| 09/16/2009 | CN100541784C A stacking type semiconductor chip package |
| 09/16/2009 | CN100541783C LSI package provided with interface module, and transmission line header employed in the package |
| 09/16/2009 | CN100541782C Packing structure with stacking platform and its package method |
| 09/16/2009 | CN100541706C High power AlInGaN based multi-chip light emitting diode |
| 09/16/2009 | CN100541447C System, device, and method for improved mirror mode operation |
| 09/16/2009 | CN100540981C Vehicle head lamp |
| 09/15/2009 | US7589566 Semiconductor device provided with antenna ratio countermeasure circuit |
| 09/15/2009 | US7589415 Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip |
| 09/15/2009 | US7587864 Photovoltaic building materials and related methods of installation |
| 09/11/2009 | WO2009111186A1 Semiconductor stack assembly having reduced thermal spreading resistance and methods of making same |
| 09/11/2009 | WO2009110376A1 Leadframe substrate, semiconductor module and method for manufacturing leadframe substrate |
| 09/11/2009 | CA2713151A1 Semiconductor stack assembly having reduced thermal spreading resistance and methods of making same |
| 09/10/2009 | US20090224388 Semiconductor chip stacking for redundancy and yield improvement |
| 09/10/2009 | US20090224356 Method and apparatus for thermally aware design improvement |
| 09/10/2009 | US20090224330 Semiconductor Memory Device and Method for Arranging and Manufacturing the Same |
| 09/10/2009 | US20090223142 Modular Shade System with Solar Tracking Panels |
| 09/10/2009 | DE102009009874A1 Elektronikbauelement und Verfahren zu dessen Herstellung An electronics device and process for its preparation |
| 09/10/2009 | DE102008033852B3 Power semiconductor module arrangement, has power semiconductor module with two fixing elements e.g. locking-centering-fasteners, formed such that fixing elements limit movement of substrate towards lower side of housing |
| 09/10/2009 | DE102008008853A1 Schaltungsanordnung mit Bondverbindung Circuitry with bond |
| 09/10/2009 | DE102004026061B4 Leistungshalbleitermodul und Verfahren zum Kühlen eines Leistungshalbleitermoduls The power semiconductor module and method for cooling a power semiconductor module |
| 09/09/2009 | EP2099120A2 Power converter |
| 09/09/2009 | EP2099119A2 Power converter apparatus |
| 09/09/2009 | EP2099118A2 Power converter apparatus |
| 09/09/2009 | EP2099031A1 Methods for manufacturing a stack of memory circuits and for addressing a memory circuit, corresponding stack and device |
| 09/09/2009 | EP2097925A2 Stacked packages |
| 09/09/2009 | EP2097202A1 Wire and solder bond forming methods |
| 09/09/2009 | CN201307594Y LED thermal conduction structure |
| 09/09/2009 | CN101529590A Semiconductor electronic component and semiconductor device using the same |
| 09/09/2009 | CN101527303A Power converter |
| 09/09/2009 | CN101527302A Power converter apparatus |
| 09/09/2009 | CN101527301A Battery protection IC chip |
| 09/09/2009 | CN101527300A 堆叠式集成电路与其制造方法 Stacked ICs and its manufacturing method |
| 09/09/2009 | CN101527299A Package structure |
| 09/09/2009 | CN100539200C Structures and materials for dye sensitized solar cells |
| 09/09/2009 | CN100539137C Power semiconductor module as H - bridge circuit and method for producing the same |
| 09/09/2009 | CN100539136C Organic electroluminescent display device and manufacturing method |
| 09/09/2009 | CN100539135C Stereoscopic electronic circuit device, electronic device using the same, and method for manufacturing the same |
| 09/09/2009 | CN100539134C Illumination apparatus |
| 09/09/2009 | CN100539133C White light LED |
| 09/09/2009 | CN100539132C Packed integrated circuit of system and packing method thereof |
| 09/09/2009 | CN100539131C Electronic element packaging structure |
| 09/09/2009 | CN100539130C Transistor tube valve with force top pressing structure |
| 09/09/2009 | CN100539129C Semiconductor package and its manufacturing method |
| 09/09/2009 | CN100539128C Semiconductor packaging stack device for preventing semiconductor stack from micro-contact soldering point rupture |
| 09/09/2009 | CN100539127C Device package and methods for the fabrication and testing thereof |
| 09/09/2009 | CN100539126C Chip overlap structure and wafer structure for manufacturing the chip stack structure |
| 09/09/2009 | CN100539125C Integration encapsulation structure of cantilever stack system and its encapsulation method |
| 09/09/2009 | CN100539124C Packaging structure and its manufacturing method |
| 09/09/2009 | CN100539123C A multiple-chip structure and multiple-chip electronic device with multiple-chip structure |
| 09/09/2009 | CN100539122C System packaging package |
| 09/09/2009 | CN100539121C Packing component for decreasing electromagnetic-wave disturbance |
| 09/09/2009 | CN100539120C Semiconductor device |
| 09/09/2009 | CN100539090C 半导体装置 Semiconductor device |
| 09/09/2009 | CN100538867C Memory circuit arrangement and method for the production thereof |
| 09/08/2009 | US7586758 Integrated circuit stacking system |
| 09/08/2009 | US7586327 Distributed memory circuitry on structured application-specific integrated circuit devices |
| 09/08/2009 | US7585700 Ball grid array package stack |
| 09/03/2009 | WO2009108734A1 Stackable communications system |
| 09/03/2009 | WO2009108136A1 Substrate cavity semiconductor package |
| 09/03/2009 | WO2009106051A2 Miniature housing and support arrangement having at least one miniature housing |
| 09/03/2009 | WO2009022316A3 Optical element coupled to low profile side emitting led |
| 09/03/2009 | WO2008153245A3 Semiconductor package module using anodized oxide layer and manufacturing method thereof |
| 09/03/2009 | US20090220783 Adhesive Sheet for Dicing and Die Bonding |
| 09/03/2009 | US20090219777 Multi-chip assembly and method for driving the same |
| 09/03/2009 | US20090219745 Memory module and memory device |
| 09/03/2009 | US20090218683 Semiconductor Device |
| 09/03/2009 | US20090218671 Semiconductor device and method of fabricating the same |
| 09/03/2009 | US20090218670 Storage medium and semiconductor package |
| 09/03/2009 | US20090217518 Device-incorporated substrate and method of manufacturing thereof as well as printed circuit board and method of manufacturing thereof |
| 09/03/2009 | DE202008005987U1 LED-Modul mit kalottenförmiger Farbkonversionsschicht LED module with dome-shaped color conversion layer |
| 09/03/2009 | DE112007002446T5 Elektronische Schaltungsvorrichtung und Verfahren zu ihrer Herstellung An electronic circuit apparatus and methods for their preparation |
| 09/03/2009 | DE10319984B4 Vorrichtung zum Kühlen von Speichermodulen Device for the cooling of memory modules |
| 09/03/2009 | DE10229711B4 Halbleitermodul mit Mikrokühler Semiconductor module with micro-cooler |
| 09/03/2009 | DE102009010265A1 Halbleiter-Leuchtvorrichtung Semiconductor light-emitting device |
| 09/03/2009 | DE10196942B4 Halbleiter-Leistungsmodul Semiconductor power module |
| 09/03/2009 | CA2712641A1 Stackable communications system |