| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 10/01/2009 | DE102008013428A1 Radiation detector module producing method for detecting X-ray or gamma radiation, involves connecting converter and electronic component such that contact surfaces face each other and contact elements are connected with each other |
| 10/01/2009 | DE102008000842A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly |
| 10/01/2009 | CA2753467A1 A decoration solar panel bridge supplying power sources |
| 09/30/2009 | EP2105961A2 Method and system for inter-chip communication via package waveguides |
| 09/30/2009 | CN201319377Y Concentrator solar cell single module |
| 09/30/2009 | CN201319376Y Power-type light emitting diode led |
| 09/30/2009 | CN101548380A Twin chip-mounted diode |
| 09/30/2009 | CN101546762A Light-emitting diode and manufacturing method thereof |
| 09/30/2009 | CN101546761A High power light emitting diode module package structure |
| 09/30/2009 | CN101546760A Inverse parallel double diode |
| 09/30/2009 | CN101546759A Method for manufacturing an electronic module and an electronic module |
| 09/30/2009 | CN101546758A Semiconductor device and semiconductor integrated circuit |
| 09/30/2009 | CN101546757A Packaging structure of card type memory |
| 09/30/2009 | CN101546756A LED package structure with multifunctional integral chip and package method thereof |
| 09/30/2009 | CN101546755A LED package structure with different arrangement pitches and package method thereof |
| 09/30/2009 | CN101546754A LED module |
| 09/30/2009 | CN101546753A Double-purpose light-gathering solar cell component for electricity generation and LED illumination |
| 09/30/2009 | CN101546745A Chip interconnect swizzle mechanism |
| 09/30/2009 | CN101546715A Method for manufacturing LED substrate and LED substrate thereof |
| 09/30/2009 | CN100546029C Package for optical transceiver module |
| 09/30/2009 | CN100546028C 半导体装置 Semiconductor device |
| 09/30/2009 | CN100546027C Encapsulation structure of spacer with ventilation hole |
| 09/30/2009 | CN100546026C Image capturing device |
| 09/29/2009 | US7596208 Apparatus system, and method for high flux, compact compton x-ray source |
| 09/29/2009 | US7595588 Electroluminescent device and method of making same |
| 09/29/2009 | US7595550 Flex-based circuit module |
| 09/29/2009 | US7595222 Semiconductor device and manufacturing method thereof |
| 09/29/2009 | US7594644 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
| 09/24/2009 | WO2009116585A1 Power module |
| 09/24/2009 | WO2009115955A1 Modular oled device |
| 09/24/2009 | WO2009115551A1 Method for making microstructures by converting porous silicon into porous metal or ceramics |
| 09/24/2009 | WO2009115124A1 A voltage source converter |
| 09/24/2009 | WO2009087037A3 Electric circuit arrangement comprising at least one power semiconductor, and method for the production thereof |
| 09/24/2009 | WO2009051975A3 Wafer level stacked die packaging |
| 09/24/2009 | US20090237935 Light emitting device having light emitting elements |
| 09/24/2009 | US20090237154 Semiconductor device, liquid crystal display device and electronic equipment |
| 09/24/2009 | US20090236721 Semiconductor device and manufacturing method thereof |
| 09/24/2009 | DE102009011975A1 Halbleiteranordnung mit einem lagestabilen überdeckten Element A semiconductor device comprising a positionally stable element covered |
| 09/24/2009 | DE102009011234A1 Elektronische Baugruppe Electronic assembly |
| 09/24/2009 | DE102008038946A1 Verfahren zum Herstellen einer halbleiterbasierten Schaltung und halbleiterbasierte Schaltung mit dreidimensionaler Schaltungstopologie A method of manufacturing a semiconductor-based circuit and semiconductor-based circuit with three-dimensional circuit topology |
| 09/24/2009 | DE102008000786A1 Sensorvorrichtung und Verfahren zur Herstellung einer Sensorvorrichtung Sensor device and method of manufacturing a sensor device |
| 09/24/2009 | DE10049356B4 Halbleitersensor Semiconductor sensor |
| 09/24/2009 | CA2718935A1 A voltage source converter |
| 09/23/2009 | EP2104182A1 Integrated antenna phased array control device |
| 09/23/2009 | EP2104144A1 Scalable radio receiver architecture providing three-dimensional packaging of multiple receivers |
| 09/23/2009 | EP2104140A1 Conductive microstructure obtained by converting porous silicon into porous metal |
| 09/23/2009 | EP2102911A1 Video camera system using multiple image sensors |
| 09/23/2009 | EP2102909A1 Tunable white point light source using a wavelength converting element |
| 09/23/2009 | EP2102908A1 Lighting device and lighting method |
| 09/23/2009 | CN201315319Y Multichip 3D stacked encapsulating structure |
| 09/23/2009 | CN101542726A Semiconductor chip with silicon through holes and side bonding pads |
| 09/23/2009 | CN101542702A Bonding method of three dimensional wafer lamination based on silicon through holes |
| 09/23/2009 | CN101542701A Bonding method of three dimensional wafer lamination based on silicon through holes |
| 09/23/2009 | CN101540836A Camera chip size module with novel structure and method for producing same |
| 09/23/2009 | CN101540314A Light-emitting diode element and forming method thereof |
| 09/23/2009 | CN101540313A Switching assembly with bond connection |
| 09/23/2009 | CN101540312A Stacked chip encapsulation structure |
| 09/23/2009 | CN101540308A Semiconductor chip package |
| 09/23/2009 | CN100544041C AC and DC power supply two-purpose bridge illuminating LED and producing method thereof |
| 09/23/2009 | CN100543986C Led device |
| 09/23/2009 | CN100543985C High brightness led with anti-static discharge impact protection function |
| 09/23/2009 | CN100543984C Light emitting apparatus |
| 09/23/2009 | CN100543983C Method of manufacturing a circuit board layer on substrate surface |
| 09/23/2009 | CN100543982C Multi-chip stack packaging structure with asymmetric conductive wire rack |
| 09/22/2009 | US7592970 Tiled electronic display structure |
| 09/22/2009 | US7592835 Co-processor having configurable logic blocks |
| 09/22/2009 | US7592703 RF and MMIC stackable micro-modules |
| 09/22/2009 | US7592696 Power module having at least two substrates |
| 09/22/2009 | US7592690 Semiconductor device including semiconductor elements mounted on base plate |
| 09/22/2009 | US7592594 Method of construction of CTE matching structure with wafer processing and resulting structure |
| 09/22/2009 | US7592593 Multi-band focal plane array |
| 09/22/2009 | CA2456671C Light emitting or light receiving semiconductor module and making method thereof |
| 09/17/2009 | WO2009114687A1 Led light engine kernel and method of making the kernel |
| 09/17/2009 | WO2009113847A1 Method and apparatus for repeating illumination information on a daisy chain bus structure |
| 09/17/2009 | WO2009113507A1 Semiconductor device, and communication apparatus and electronic apparatus provided with semiconductor device |
| 09/17/2009 | WO2009113373A1 Semiconductor device |
| 09/17/2009 | WO2009113312A1 Semiconductor device design system, semiconductor device manufacturing method, semiconductor device, and substrate bonding device |
| 09/17/2009 | WO2009113296A1 Resin varnish for semiconductor element bonding film formation, semiconductor element bonding film, and semiconductor device |
| 09/17/2009 | WO2009112644A1 Assembly including a wire member and a microelectronic chip with a notch, including at least one stud for holding the wire member |
| 09/17/2009 | WO2009112354A1 Methods for making a stack of memory circuits and for addressing a memory circuit, and corresponding stack and device |
| 09/17/2009 | WO2009112272A1 Method for the production of a semiconductor-based circuit, and semiconductor-based circuit comprising a three-dimensional circuit topology |
| 09/17/2009 | WO2009112020A2 Method for producing a plurality of optoelectronic semi-conductor chips and optoelectronic semi-conductor chip |
| 09/17/2009 | WO2009090349A3 Method for making an electrically conducting mechanical interconnection member |
| 09/17/2009 | US20090231822 Device, in particular intelligent power module with planar connection |
| 09/17/2009 | US20090230534 Semiconductor memory apparatus |
| 09/17/2009 | US20090230528 Support Mounted Electrically Interconnected Die Assembly |
| 09/17/2009 | DE102008014094A1 Radiation emitting device for use in reflector bowl, has frame like contacts provided between semiconductor layer sequences and electrically connecting sequences, where sequences include active zone to produce electromagnetic radiation |
| 09/17/2009 | DE102008013857A1 LED printed circuit board, has cooling fluid guide extending directly as through hole or extending indirectly from one side to another side of board, and active element i.e. nanomagnet, for active conveyance of cooling fluid in guide |
| 09/17/2009 | CA2716920A1 Semiconductor device, and communication apparatus and electronic apparatus having the same |
| 09/17/2009 | CA2716188A1 Led light engine kernel and method of making the kernel |
| 09/16/2009 | EP2101550A1 Insulated metal substrate with an implant |
| 09/16/2009 | EP2101355A1 Light-emitting device having light-emitting elements |
| 09/16/2009 | EP2101352A2 Semiconductor module with pressure contact configuration |
| 09/16/2009 | EP0917189B1 Method for mounting encapsulated body on mounting board and optical converter |
| 09/16/2009 | CN201311930Y Packaging structure of improved transistor |
| 09/16/2009 | CN101536186A Optical element for a light-emitting diode, light-emitting diode, LED arrangement and method for producing an LED arrangement |
| 09/16/2009 | CN101536185A Adhesive tape and semiconductor device using the same |
| 09/16/2009 | CN101533972A Press-fit-connection |
| 09/16/2009 | CN101533886A A luminous module encapsulation method |
| 09/16/2009 | CN101533880A Light emitting diode (LED) encapsulation module |