Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2009
10/21/2009CN100552815C 半导体器件 Semiconductor devices
10/21/2009CN100552703C Chip with a power supply device
10/20/2009US7606048 Integrated circuit stacking system
10/20/2009US7605479 Stacked chip assembly with encapsulant layer
10/15/2009WO2009126412A1 Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking
10/15/2009WO2009125763A1 Adhesive injection device
10/15/2009WO2009125609A1 Bonding apparatus and bonding method
10/15/2009WO2009079985A3 Optoelectronic component and production method for an optoelectronic component
10/15/2009US20090256577 Delay Lock Loop Circuit, Timing Generator, Semiconductor Test Device, Semiconductor Integrated Circuit, and Delay Amount Calibration Method
10/15/2009US20090255572 Sealed Thin Film Photovoltaic Modules
10/15/2009DE112007002905T5 Film-auf-Drahtbond-Halbleitervorrichtung Film-on-wire bonding type semiconductor device
10/15/2009DE102008050840A1 Electrical module i.e. detector module, manufacturing method for X-ray measuring system of computer tomography scanner, involves soldering evaluation electronics of component with carrier substrate by low-temperature-guide
10/15/2009DE102008050838A1 Electric component for roentgen measuring system, has two semiconductor elements and contact element, where one semiconductor element is soldered on another semiconductor element, and contact element acts as tolerance compensation
10/15/2009DE102008016830A1 Verfahren und Vorrichtung zur Applikation eines Chipmoduls Method and apparatus for application of a chip module
10/14/2009EP2109138A1 Heat dissipating substrate and electronic device using the same
10/14/2009EP2108688A1 Adhesive for electronic components
10/14/2009CN201327829Y Rectifier luminescent diode device
10/14/2009CN201327828Y Multi-chip surface-mounted LED module packaging structure
10/14/2009CN201326923Y Multifunctional LED illuminator
10/14/2009CN101558492A Integrated circuit with signal bus formed by cell abutment of logic cells
10/14/2009CN101557100A Bidirectional and reverse blocking battery switch
10/14/2009CN101556951A Photo-thyristor valve body radiating with heat pipe
10/14/2009CN101556950A Stack structure of encapsulated wafer
10/14/2009CN100550454C Piezoelectric ignition mechanism
10/14/2009CN100550433C Selfluminous device
10/14/2009CN100550379C Semiconductor apparatus using back-side high-withstand-voltage integrated circuit
10/14/2009CN100550378C Image sensor and fabricating method thereof
10/14/2009CN100550377C Single package containing multiple integrated circuit devices
10/14/2009CN100550376C Semiconductor device and fabricating method thereof
10/14/2009CN100550375C LED packaging structure
10/14/2009CN100550374C LED packaging structure and packaging method
10/14/2009CN100550373C Multichip packaging structure and its production method
10/14/2009CN100550372C Display device
10/14/2009CN100550371C 可堆叠式半导体封装结构 Stackable semiconductor package structure
10/14/2009CN100550370C Plane structure of LED illuminating device
10/14/2009CN100550360C Apparatus, system and manufacture method with bottom heat spreader
10/14/2009CN100550355C Substrate for mounting semiconductor chip and manufacturing method and semiconductor module
10/13/2009US7602053 Leadframe of a leadless flip-chip package and method for manufacturing the same
10/13/2009US7602035 Light emitting or light receiving semiconductor module and method for manufacturing same
10/08/2009WO2009124246A1 Interposers, electronic modules, and methods for forming the same
10/08/2009WO2009124158A1 Method for integrating heat transfer members, and an led device
10/08/2009WO2009123048A1 Electronic component used for wiring and method for manufacturing the same
10/08/2009WO2009122867A1 Semiconductor device, composite circuit device, and methods for manufacturing semiconductor device and composite circuit device
10/08/2009WO2009067996A3 Chip assembly, connecting assembly, led and method for producing a chip assembly
10/08/2009US20090251206 Integrated circuit and method for manufacturing the same
10/08/2009US20090250801 Semiconductor device
10/08/2009US20090250781 Power semiconductor device
10/08/2009US20090250729 Capacitive micromachined ultrasonic transducer and manufacturing method
10/08/2009US20090250257 Electronic parts packaging structure and method of manufacturing the same
10/08/2009DE10357818B4 Verfahren zur Herstellung lichtemittierender Halbleiterdioden auf einer Platine A method for manufacturing light emitting semiconductor diodes on a board
10/08/2009DE102008062492A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
10/08/2009DE102008017553A1 Electronic system for use in transportation medium e.g. motor vehicle, has space formed between housing and electronic component and filled with binding material to absorb water or aqueous fluid resulting from condensation in housing
10/07/2009EP2106617A1 Trench isolation for reduced cross talk
10/07/2009EP1769533B1 Electronic device comprising an integrated circuit
10/07/2009CN201323198Y Rectifier bridge
10/07/2009CN101553923A Edge connect wafer level stacking
10/07/2009CN101553922A Microelectronic package
10/07/2009CN101553921A Template for three-dimensional thin-film solar cell manufacturing and methods of use
10/07/2009CN101553917A Method of manufacturing stacked chip packages
10/07/2009CN101552299A Solar panel
10/07/2009CN101552268A Light-emitting diode module
10/07/2009CN101552267A Single-arm bridge type auto rectifier diode
10/07/2009CN101552266A Wafer
10/07/2009CN101552265A Radiation image device
10/07/2009CN101552264A Power module
10/07/2009CN101552263A Wafer-level packaging of chip and packaging method thereof
10/07/2009CN101552262A Polycrystalline packaging unit and manufacture method thereof
10/07/2009CN101552249A Semiconductor package structure having movable gain variation on circumsphere point
10/07/2009CN101552216A Electronic device and method of manufacturing same
10/07/2009CN101552214A Multi-chip stacking method for halving routing procedure and structure thereof
10/07/2009CN101551962A Full-color LED display device
10/07/2009CN100547820C Semi-conductor light source device
10/07/2009CN100547785C Direct insertion LED and its making method
10/07/2009CN100547784C Internal connecting wire of multi-chip packing structure
10/07/2009CN100547753C Solid package structure and manufacture method thereof
10/07/2009CN100547749C Method for manufacturing photoelectric chip packaging structure with control chip
10/07/2009CN100547607C Modularized memory card apparatus capable of dividing memory body magnetic region
10/06/2009US7598619 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
10/06/2009US7598617 Stack package utilizing through vias and re-distribution lines
10/06/2009US7598605 Semiconductor device having capacitive insulation means and communication terminal using the device
10/06/2009US7598121 Method of manufacturing a semiconductor device
10/01/2009WO2009120285A1 A decoration solar panel bridge supplying power sources
10/01/2009WO2009119904A1 Semiconductor device, semiconductor device manufacturing method, printed circuit board and electronic device
10/01/2009WO2009119374A1 Method for manufacturing electronic component module
10/01/2009WO2009119166A1 Semiconductor optical interconnection device and semiconductor optical interconnection method
10/01/2009WO2009119038A2 Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product
10/01/2009WO2009118694A1 Integrated 3d high density and high quality inductive element
10/01/2009WO2009117882A1 Pulse-laser bonding method for through-silicon-via based stacking of electronic components
10/01/2009WO2009088869A3 Multiple access over proximity communication
10/01/2009US20090246909 Semiconductor device and method of manufacturing the same
10/01/2009US20090245004 Semiconductor device including multi-chip
10/01/2009US20090244860 Mounting structure of semiconductor device and electronic apparatus using thereof
10/01/2009US20090243725 Semiconductor device
10/01/2009US20090243028 Capacitive isolation circuitry with improved common mode detector
10/01/2009DE102009014582A1 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
10/01/2009DE102009012123A1 Licht aussendende Diode und Beleuchtungsvorrichtung, die diese nutzt Light emitting diode, and illumination device that uses this
10/01/2009DE102008038857A1 Beleuchtungseinrichtung Lighting device
10/01/2009DE102008016534A1 Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterbauelements Radiation-emitting semiconductor device and method of manufacturing a radiation-emitting semiconductor component
10/01/2009DE102008016458A1 Printed circuit board for use in e.g. lighting device, has heat dissipating element arranged in through-hole, and radiation source i.e. LED, arranged on heat dissipating element, where heat dissipating element is electrically conductive
10/01/2009DE102008016457A1 Leuchtvorrichtung Lighting device
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