Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2009
11/05/2009WO2009112020A3 Method for producing a plurality of optoelectronic semi-conductor chips and optoelectronic semi-conductor chip
11/05/2009WO2009093982A4 Power switching module
11/05/2009US20090273099 Semiconductor integrated circuit
11/05/2009US20090273069 Low profile chip scale stacking system and method
11/05/2009US20090273068 3-D Integrated Circuit Lateral Heat Dissipation
11/05/2009US20090272888 Thermal infrared imaging system and associated methods for radiometric calibration
11/05/2009DE102008021661A1 LED-Modul mit Rahmen und Leiterplatte LED module with frame and PCB
11/05/2009DE102008021402A1 Oberflächenmontierbares Leuchtdioden-Modul und Verfahren zur Herstellung eines oberflächenmontierbaren Leuchtdioden-Moduls Surface mount light-emitting module and method of manufacturing a surface mount light-emitting diode module
11/05/2009DE102008020930A1 Elektrische Funktionseinheit und Verfahren zur Herstellung einer dreidimensionalen elektrischen Funktionseinheit Electric functional unit and method for producing a three-dimensional electrical functional unit
11/05/2009DE102008020924A1 Electrical and/or mechanical connections manufacturing method for gamma or X-ray detectors, involves producing elevation as seed layer, metallic column and solder layer based on substrate or electronic element
11/04/2009EP2113942A2 LED module with frame and circuit board
11/04/2009CN201340854Y Improved high-color-rendering light-emitting diode structure
11/04/2009CN201340853Y SOP / MSOP / TSSOP lead frame structure
11/03/2009US7613010 Stereoscopic electronic circuit device, and relay board and relay frame used therein
11/03/2009US7612448 Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner
11/03/2009US7612434 Electronic device having wiring substrate and lead frame
11/03/2009US7611925 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
10/2009
10/29/2009WO2009108734A4 Stackable communications system
10/29/2009WO2009051975A8 Wafer level stacked die packaging
10/29/2009WO2009048956A3 Integrated led-based luminaire for general lighting
10/29/2009US20090267222 Low Voltage Drop and High Thermal Performance Ball Grid Array Package
10/29/2009US20090267214 Electronic circuit device and method for manufacturing same
10/29/2009US20090267089 Light emitting device having light emitting elements
10/29/2009DE102008044641A1 Optoelektronisches Bauelement Optoelectronic component
10/29/2009DE102008026627B3 Kühlsystem für LED-Chip-Anordnung Cooling system for LED chip array
10/29/2009DE102008001414A1 Substrat-Schaltungsmodul mit Bauteilen in mehreren Kontaktierungsebenen Substrate circuit module with components in several contact-making
10/28/2009EP2112873A2 Electric function unit and method for manufacturing a three-dimensional electric function unit
10/28/2009EP1192627B1 Methods to implement sealing and electrical connections to single cell and multi-cell regenerative photoelectrochemical devices
10/28/2009CN101569023A Housing for an optoelectronic component and arrangement of an optoelectronic component in a housing
10/28/2009CN101569008A Semiconductor device and its fabrication method
10/28/2009CN101567647A Solar power station
10/28/2009CN101567411A Flip-chip integrated encapsulation structure of LED and method thereof
10/28/2009CN101567367A Semiconductor device
10/28/2009CN101567366A 发光二极管 Led
10/28/2009CN101567365A Light-emitting chip packaging structure with high-efficiency radiating substrate and method for packaging light-emitting chip
10/28/2009CN101567364A Multichip package structure capable of arranging chips on pins
10/28/2009CN101567357A Electronic device provided with wiring board, and wiring board for such electronic device
10/28/2009CN101567345A Through-electrode, circuit board, semiconductor package and stacked semiconductor package
10/28/2009CN101567322A Encapsulating structure and encapsulating method of chip
10/28/2009CN100556246C Wiring board manufacturing method
10/28/2009CN100556234C Hybrid electronic component and method for manufacturing the same
10/28/2009CN100556233C Method for manufacturing an electronic module and an electronic module
10/28/2009CN100555629C LED encapsulation structure
10/28/2009CN100555628C Semiconductor encapsulation structure with electromagnetic shielding function
10/28/2009CN100555627C Power semiconductor module
10/28/2009CN100555626C Semiconductor device, related method and printed circuit board
10/28/2009CN100555625C Image sensor module, method of manufacturing the same, and camera module using the same
10/28/2009CN100555624C Semiconductor device and power conversion apparatus using the same
10/28/2009CN100555609C 混合集成电路装置及其制造方法 Hybrid integrated circuit device and manufacturing method thereof
10/28/2009CN100555589C Method of manufacturing semiconductor assembly
10/28/2009CN100554773C LED lamp with radiation aluminum board
10/27/2009US7610572 Semiconductor integrated circuit device with independent power domains
10/27/2009US7609527 Electronic module
10/27/2009US7609089 FPGA architecture at conventional and submicron scales
10/27/2009US7609085 Configurable integrated circuit with a 4-to-1 multiplexer
10/27/2009US7608922 Semiconductor device including amplifier and frequency converter
10/27/2009US7608918 Semiconductor device
10/27/2009US7608556 Stable charge storage device; oxidation and reduction using catalyst in solution
10/22/2009WO2009128880A1 Multi-junction silicon thin film solar cell using plasma inside vapor deposition
10/22/2009WO2009127300A1 Microwave assembly
10/22/2009WO2009127179A1 Method for producing and assembly of a power module
10/22/2009US20090262515 Light emitting device
10/22/2009US20090261473 Low fabrication cost, fine pitch and high reliability solder bump
10/22/2009US20090261466 Semiconductor Device and Method of Forming Vertical Interconnect Structure Using Stud Bumps
10/22/2009US20090261447 Semiconductor integrated circuit
10/22/2009US20090261420 Recess gate transistor
10/22/2009DE102008018841A1 Verfahren zur Herstellung und Aufbau eines Leistungsmoduls Process for the preparation and structure of a power module
10/21/2009EP2110956A2 Single-chip wireless transceiver
10/21/2009EP2110853A2 Assembly in pressure contact with a high power semiconductor module
10/21/2009EP2110850A2 Device for the mutual contacting of two wafers
10/21/2009EP1966825B1 Process for the collective fabrication of 3d electronic modules
10/21/2009EP1309998B1 Method for electrically connecting a semiconductor component to an electrical subassembly
10/21/2009CN201332097Y 25 integration high-efficient LED support
10/21/2009CN201332096Y Colorful piranha LED
10/21/2009CN201332095Y Elliptical LED with double lighting effect
10/21/2009CN201332094Y Sub warhead LED with triple lighting effect
10/21/2009CN101563778A LED semiconductor body and use of an LED semiconductor body
10/21/2009CN101562178A 半导体发光装置 The semiconductor light emitting device
10/21/2009CN101562177A Semiconductor device, and energy transmission device using the same
10/21/2009CN101562176A A device of a chip module comprising a frequency enlarging device and a method
10/21/2009CN101562175A Image sensor encapsulating structure and imaging device applied thereof
10/21/2009CN101562174A LED chip encapsulating structure for backlight module and preparing method thereof
10/21/2009CN101562173A Novel wafer fixing structure
10/21/2009CN101562168A Multiple-crystal grain modularized encapsulation structure and encapsulation method thereof
10/21/2009CN101562139A Luminescence chip encapsulating structure for avoiding reducing luminous efficiency and manufacture method thereof
10/21/2009CN100552998C LCD back light source
10/21/2009CN100552992C Technology for package of high power luminous element
10/21/2009CN100552990C LED module group
10/21/2009CN100552967C AC illuminating body and AC illuminating device
10/21/2009CN100552948C Semiconductor chip mounting structure and method for manufacturing same
10/21/2009CN100552947C Electronic circuit device of power control system
10/21/2009CN100552946C Electronic packaging structure
10/21/2009CN100552945C White light LED packaging structure with silica substrate and its production method
10/21/2009CN100552944C Illuminating device
10/21/2009CN100552943C Stacked integrated circuit chip and packaging
10/21/2009CN100552942C Connecting module structure with passive element and its manufacturing method
10/21/2009CN100552941C Image sensing module
10/21/2009CN100552940C Lap connected structure of semiconductor component-buried loading board
10/21/2009CN100552926C Semiconductor device, wiring board and manufacturing method thereof
10/21/2009CN100552907C LED chip packaging structure with thick guide feet and manufacturing method thereof
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