H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2009
11/25/2009	CN100563001C Mounting body and method for manufacturing same
11/25/2009	CN100563000C Semiconductor device and method for fabricating the same
11/25/2009	CN100562999C Circuit module
11/25/2009	CN100562995C Bottom substrate of package on package and manufacturing method thereof
11/25/2009	CN100562993C Semiconductor grain and package structure
11/25/2009	CN100562981C Semiconductor chip and method of manufacturing semiconductor chip and semiconductor device
11/25/2009	CN100562787C Backlight module with complementary concolores light source and manufacturing method thereof
11/24/2009	US7623397 Semiconductor device
11/24/2009	US7623101 Light emitting device and light emitting system
11/24/2009	US7622952 Periphery clock signal distribution circuitry for structured ASIC devices
11/24/2009	US7622950 GPIO mux/dynamic port configuration
11/24/2009	US7622805 Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof
11/24/2009	US7622802 Electronic device with semiconductor chip including a radiofrequency power module
11/24/2009	US7622801 Thin planar semiconductor device
11/24/2009	US7622743 Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device
11/24/2009	US7622700 Photo-electric conversion apparatus with alternating photoelectric conversion elements
11/24/2009	US7621654 LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module
11/19/2009	WO2009139472A1 Substrate for power module, power module, and method for producing substrate for power module
11/19/2009	WO2009139372A1 Inductor element, integrated circuit device, and three-dimensionally packaged circuit device
11/19/2009	WO2009139210A1 High frequency storing case and high frequency module
11/19/2009	WO2009138374A1 Led arrangement
11/19/2009	WO2009137958A1 An outdoor illumination device
11/19/2009	WO2009085374A3 Formation of a hybrid integrated circuit device
11/19/2009	US20090286356 Stacked mass storage flash memory package
11/19/2009	US20090284310 Semiconductor device
11/19/2009	US20090283678 Target with thermal imaging system
11/19/2009	DE102005016650B4 Leistungshalbleitermodul mit stumpf gelöteten Anschluss- und Verbindungselementen Power semiconductor module with blunt soldered connections and fasteners
11/18/2009	EP2120263A1 Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
11/18/2009	CN201348997Y Automatic polarity switching oil-immersed silicon stack
11/18/2009	CN201348996Y Self-cooled thyristor valve
11/18/2009	CN201348995Y Press mounting mechanism of thyristor valve
11/18/2009	CN101582476A Light emitting diode and support module thereof
11/18/2009	CN101582434A Image sensor packaging structure, manufacturing method thereof and camera module
11/18/2009	CN101582420A Focusing infrared receiver with built-in reflective cup
11/18/2009	CN101582419A Device and system for mini surface-mount device
11/18/2009	CN101582418A Tricolor single-chip white light-emitting diode regulated through electric injection
11/18/2009	CN101582417A Power module for controlling leading out of terminal spring
11/18/2009	CN101582416A Electronic element wafer module and method for manufacturing the same
11/18/2009	CN101582415A Semiconductor device
11/18/2009	CN101582414A Power module by directly bonding power terminal
11/18/2009	CN101582413A Power module with lower stray inductance
11/18/2009	CN101582401A 芯片封装单元 Chip packaging unit
11/18/2009	CN101582396A Semiconductor device and manufacturing of the same
11/18/2009	CN101582385A Light-emitting diode display and method for manufacturing the same
11/18/2009	CN100561759C White light emitting device
11/18/2009	CN100561737C Lamina ball grid array package piece of central welding-spot chip and manufacture method thereof
11/18/2009	CN100561736C Image sensory element packaging structure and image-forming module group applying same
11/18/2009	CN100561735C Power circuit package and fabrication method
11/18/2009	CN100561734C Semiconductor IC-embedded module
11/18/2009	CN100561733C LED illumination device
11/17/2009	US7620926 Methods and structures for flexible power management in integrated circuits
11/17/2009	US7619313 Multi-chip module and methods
11/17/2009	US7618886 Semiconductor device and method of manufacturing the same
11/12/2009	WO2009137450A1 Proximity optical memory module
11/12/2009	WO2009137286A1 3-d integrated circuit lateral heat dissipation
11/12/2009	WO2009136591A1 Semiconductor device
11/12/2009	WO2009136496A1 Three-dimensionally integrated semiconductor device and method for manufacturing the same
11/12/2009	WO2009135800A2 A method of assembling wafers by molecular bonding
11/12/2009	WO2009135457A1 Radiation-emitting semiconductor chip
11/12/2009	US20090278569 Semiconductor Device and its Manufacturing Method, Semiconductor Manufacturing Mask, and Optical Proximity Processing Method
11/12/2009	US20090278246 Semiconductor device
11/12/2009	US20090278212 Integrated Device
11/12/2009	US20090278124 Scribe based bond pads for integrated circuits
11/12/2009	DE102009020469A1 Halbleitervorrichtung mit mehreren Chips und Verfahren zur Fertigung der Halbleitervorrichtung A semiconductor device comprising a plurality of chips and process for manufacturing the semiconductor device
11/12/2009	DE102009019030A1 Halbleiterbauelement Semiconductor device
11/12/2009	DE102009002732A1 Schaltungsanordnung mit zwei Halbleiterschaltelementen und einem Freilaufelement Circuit arrangement having two semiconductor switching elements and one freewheeling element
11/12/2009	DE102006040838B4 Elektronische Leistungspackung mit zwei Substraten mit mehreren Halbleiterchips und elektronischen Komponenten Electronic power pack with two substrates with a plurality of semiconductor chips and electronic components
11/12/2009	CA2720966A1 3-d integrated circuit lateral heat dissipation
11/11/2009	EP2117041A1 Adhesive film for semiconductor and semiconductor device using the adhesive film
11/11/2009	CN201345364Y Surface-mounting type LED
11/11/2009	CN101577303A Light emitting diode packages, light emitting diode systems and methods of manufacturing the same
11/11/2009	CN101577301A Package method for white light LED and LED device manufactured by package method for white light LED
11/11/2009	CN101577273A CPU power delivery system
11/11/2009	CN101577272A Luminescence module
11/11/2009	CN101577271A Semiconductor device and its manufacturing method
11/11/2009	CN101577270A Semi-conductor luminescence component
11/11/2009	CN101577269A Bonding pad sharing method applied to multi-chip module and apparatus thereof
11/11/2009	CN101577268A Package structure for stacked type integrated circuit chip
11/11/2009	CN101577267A 芯片封装结构 Chip package structure
11/11/2009	CN101577237A Semiconductor device and method including first and second carriers
11/11/2009	CN100559584C Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket
11/11/2009	CN100559583C LED module
11/11/2009	CN100559582C Chip stack packaging structure and method of producing the same
11/11/2009	CN100559581C Light emitting package, backlight unit and liquid crystal display device including the same
11/10/2009	US7616027 Configurable circuits, IC's and systems
11/10/2009	US7616016 Probe card assembly and kit
11/10/2009	US7615939 Spectrally calibratable multi-element RGB LED light source
11/10/2009	US7615859 Thin semiconductor package having stackable lead frame and method of manufacturing the same
11/10/2009	US7615837 Lithography device for semiconductor circuit pattern generation
11/10/2009	US7615793 AC driven light—emitting device
11/10/2009	US7615703 Electrolyte composition, dye-sensitized solar cell and production method thereof
11/10/2009	US7615640 Merocyanine dyes; solar cells
11/10/2009	US7615462 Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack
11/10/2009	US7615411 Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof
11/05/2009	WO2009134113A1 Waterproof led beacon light
11/05/2009	WO2009133682A1 Evaluation method and evaluation device
11/05/2009	WO2009132926A1 Electrical power unit
11/05/2009	WO2009132922A2 Substrate-mounted circuit module comprising components in a plurality of contact planes
11/05/2009	WO2009132723A1 Cooling arrangement comprising two semiconductor components disposed next to one another
11/05/2009	WO2009132618A1 Surface-mounted led module and method for producing a surface-mounted led module

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