| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/15/2015 | DE102014212957A1 Hochintegrierte leistungselektronische Modulbaugruppe Highly integrated power electronic module assembly |
| 01/15/2015 | DE102014109771A1 Mehrchipvorrichtung Multi-chip device |
| 01/15/2015 | DE102014109662A1 Halbleiterchip und Gehäuse mit Source-Down- und Sensorkonfiguration Semiconductor chip and package with source-down and sensor configuration |
| 01/15/2015 | DE102014109475A1 Elektronische schaltung mit einem rückwärts leitenden igbt und einer gate-ansteuerschaltung An electronic circuit with a reverse-conducting IGBT and a gate drive circuit |
| 01/15/2015 | DE102013213448A1 Elektronikbaugruppe mit Leistungshalbleiter Electronics module with power semiconductor |
| 01/15/2015 | DE102013107354A1 Solarzellenvorrichtung mit elektrochemischer Speicherzelle Solar cell device with electrochemical storage cell |
| 01/15/2015 | DE102013107227A1 Konversionselement mit Trennstruktur Conversion element separation structure |
| 01/14/2015 | EP2824707A1 Lighting component and lighting device |
| 01/14/2015 | EP2824705A2 Semiconductor devices |
| 01/14/2015 | EP2824701A1 High-power semiconductor module |
| 01/14/2015 | EP2824696A1 Semiconductor device and method of manufacture thereof |
| 01/14/2015 | EP2823517A1 Lighting module and method of manufacturing a lighting module |
| 01/14/2015 | EP2823508A1 Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same |
| 01/14/2015 | CN204103744U 一种mcm封装的电源模块 One kind mcm encapsulated power supply module |
| 01/14/2015 | CN204102901U 全周光倒装led光源 All-optical flip-week led light |
| 01/14/2015 | CN204102900U 一体式led灯板封装结构 Integrated led light board package |
| 01/14/2015 | CN204102899U 发光模块 Emitting module |
| 01/14/2015 | CN204102898U 全周光led光源 The whole week led light source |
| 01/14/2015 | CN204102897U 新型cob显示屏封装焊盘结构 The new package cob display pad structure |
| 01/14/2015 | CN204102896U 一种可调色温、显指的led灯 An adjustable color temperature, CRI led lights |
| 01/14/2015 | CN204102895U 半导体封装结构 Semiconductor package structure |
| 01/14/2015 | CN204102894U 一种片式双芯片肖特基二极管 A chip dual-chip Schottky diode |
| 01/14/2015 | CN204102862U 一种基于腔体技术多芯片叠加封装装置 A cavity technique based on multi-chip package device superimposed |
| 01/14/2015 | CN204099964U 管型基元led及应用其的照明装置 Primitives led tube lighting device and its application |
| 01/14/2015 | CN104285294A 半导体装置及该半导体装置的制造方法 Semiconductor device and method of manufacturing the semiconductor device |
| 01/14/2015 | CN104284559A 电源装置和电源装置的制造方法 The method of manufacturing a power supply device and power supply device |
| 01/14/2015 | CN104283406A 一种mcm封装的电源模块及制备方法 One kind mcm encapsulated power modules and preparation methods |
| 01/14/2015 | CN104282829A 发光装置以及发光装置的制造方法 The method of manufacturing a light emitting device and a light emitting device |
| 01/14/2015 | CN104282817A 发光二极管组件及制作方法 Emitting diode assembly and production methods |
| 01/14/2015 | CN104282802A 一种多子电池串联的太阳能电池模组及其制备方法 A multi-module and solar cells prepared sub-series |
| 01/14/2015 | CN104282679A 带有功率半导体的电子组件 Electronic assembly with power semiconductors |
| 01/14/2015 | CN104282678A 具有光感测功能的发光显示器 A light emitting display sensing capabilities |
| 01/14/2015 | CN104282677A 一种快恢复二极管模块 In fast recovery diode module |
| 01/14/2015 | CN104282676A 一体式led灯板封装结构及封装工艺 Integrated led light board packaging structure and packaging technology |
| 01/14/2015 | CN104282675A 发光元件及发光装置 Emitting element and a light-emitting device |
| 01/14/2015 | CN104282674A 发光装置 Light-emitting device |
| 01/14/2015 | CN104282673A 具有紫外光的白光发光二极管模组结构 UV light, the white LED module structure |
| 01/14/2015 | CN104282672A 可调整色温的发光二极管封装结构 Adjustable color temperature of a light emitting diode package structure |
| 01/14/2015 | CN104282671A 发光二极管组件及制作方法 Emitting diode assembly and production methods |
| 01/14/2015 | CN104282670A 减小共源共栅堆栈电路的氧化层应力 Reduce common source of stress common-gate oxide layer stack circuit |
| 01/14/2015 | CN104282669A 半导体装置 Semiconductor device |
| 01/14/2015 | CN104282668A 半导体装置 Semiconductor device |
| 01/14/2015 | CN104282653A 管芯堆积方法及利用其的半导体封装 Die stacking method and a semiconductor package using its |
| 01/14/2015 | CN104282647A 高功率半导体模块 High power semiconductor module |
| 01/14/2015 | CN104282640A 半导体芯片与具有该半导体芯片的层叠型半导体封装 The semiconductor chip and the multilayer semiconductor package having the semiconductor chip |
| 01/14/2015 | CN104282578A 内嵌式封装体工艺及其结构 Embedded technology package and its structure |
| 01/14/2015 | CN104282237A 一种led集成像素封装模组及其高清显示屏 One kind of led module and integrated package pixel HD display |
| 01/14/2015 | CN102384405B 液晶显示装置背光源用led光源装置和液晶显示装置 The liquid crystal display device using a backlight device and a liquid crystal display led light source apparatus |
| 01/14/2015 | CN102163602B 发光装置以及具备此发光装置的照明装置 This light-emitting device includes a light emitting device and illumination device |
| 01/13/2015 | US8934745 Apparatus for use in optoelectronics having a sandwiched lens |
| 01/13/2015 | US8934277 Semiconductor system with at least one three-level electric power inverter circuit |
| 01/13/2015 | US8933748 Active pen IC with a reduced amount of pads and a method thereof |
| 01/13/2015 | US8933715 Configurable vertical integration |
| 01/13/2015 | US8933644 LED lamps with improved quality of light |
| 01/13/2015 | US8933621 Light emitting device |
| 01/13/2015 | US8933620 White light LED module with green and red phosphors and illumination device having the same |
| 01/13/2015 | US8933570 Three dimensional structure memory |
| 01/13/2015 | US8933561 Semiconductor device for semiconductor package having through silicon vias of different heights |
| 01/13/2015 | US8933555 Semiconductor chip package |
| 01/13/2015 | US8933554 Semiconductor device and method for manufacturing semiconductor device |
| 01/13/2015 | US8933553 Semiconductor unit |
| 01/13/2015 | US8933551 3D-packages and methods for forming the same |
| 01/13/2015 | US8933540 Thermal via for 3D integrated circuits structures |
| 01/13/2015 | US8933481 Lead frame assembly, LED package and LED light bar |
| 01/13/2015 | US8933468 Electronic device with reduced non-device edge area |
| 01/13/2015 | US8933467 Smart integrated semiconductor light emitting system including nitride based light emitting diodes (LED) and application specific integrated circuits (ASIC) |
| 01/13/2015 | US8933431 Dual-plane memory array |
| 01/13/2015 | US8933394 Semiconductor device having at least a transistor cell with a second conductive type region surrounding a wall region and being insulated from both gate electrode and source electrode and solid state relay using same |
| 01/13/2015 | US8933320 Redundant electrical architecture for photovoltaic modules |
| 01/13/2015 | US8932910 Method for producing chip stacks, and a carrier for carrying out the method |
| 01/13/2015 | US8932908 Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die |
| 01/13/2015 | US8932907 Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die |
| 01/08/2015 | WO2015003068A1 Method and structure of panelized packaging of semiconductor devices |
| 01/08/2015 | WO2015001727A1 Semiconductor apparatus |
| 01/08/2015 | WO2015001653A1 Electronic apparatus |
| 01/08/2015 | WO2015001648A1 Semiconductor device manufacturing method and semiconductor device |
| 01/08/2015 | WO2015001413A1 Solar cell assembly |
| 01/08/2015 | WO2015001174A1 A method to accomplish a broadband, even and efficient led-light |
| 01/08/2015 | WO2015001040A1 Organic light-emitting diode and method for operating an organic light-emitting diode |
| 01/08/2015 | WO2015000814A1 Optoelectronic semiconductor device |
| 01/08/2015 | WO2015000813A1 Electronic hardware assembly |
| 01/08/2015 | WO2015000596A1 Die package with low electromagnetic interference interconnection |
| 01/08/2015 | WO2015000594A1 An interconnect system comprising an interconnect having a plurality of metal cores at least partially surrounded by a dielectric layer |
| 01/08/2015 | US20150011028 Stack type semiconductor device and method of fabricating and testing the same |
| 01/08/2015 | US20150008954 Monolithic integrated circuit die having modular die regions stitched together |
| 01/08/2015 | US20150008594 Semiconductor packages |
| 01/08/2015 | US20150008592 Method for Carbon Nanofiber Alignment Using Magnetic Nanoparticles |
| 01/08/2015 | US20150008588 Semiconductor chip and stacked type semiconductor package having the same |
| 01/08/2015 | US20150008582 Semiconductor device |
| 01/08/2015 | US20150008580 Stacked package and method for manufacturing the same |
| 01/08/2015 | US20150008572 Power Semiconductor Package with Multiple Dies |
| 01/08/2015 | US20150008460 Stress relief for array-based electronic devices |
| 01/08/2015 | US20150008445 III-Nitride Device and FET in a Package |
| 01/08/2015 | DE112013001234T5 Leistungshalbleitermodul und Energieumsetzungseinrichtung Power semiconductor module and energy conversion device |
| 01/08/2015 | DE112008001410B4 Halbleiterelementkühlstruktur und Verwendung davon Semiconductor element cooling structure and use thereof |
| 01/08/2015 | DE102014212376A1 Halbleitervorrichtung Semiconductor device |
| 01/08/2015 | DE102014109223A1 Lead-Frame Tasche Lead Frame Bag |
| 01/08/2015 | DE102014108641A1 Schaltungsanordnung und verfahren zur herstellung derselben Circuit arrangement and method for producing same |
| 01/08/2015 | DE102013213348A1 Leistungshalbleitermodul und elektrischer Antrieb mit einem Leistungshalbleitermodul The power semiconductor module and electrical drive with a power semiconductor module |
| 01/08/2015 | DE102013212928A1 Verfahren zum Herstellen eines optoelektronischen Bauelements A method for producing an optoelectronic component |