H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2009
12/09/2009	CN101599482A Stack structure for chip packaging
12/09/2009	CN101599481A LED crystalline grain device
12/09/2009	CN101599480A Semiconductor chip encapsulating structure
12/09/2009	CN101599468A Electronic component
12/09/2009	CN101599443A Multi-wavelength LED crystal particle structure and manufacturing method thereof
12/09/2009	CN101597493A Alkaline-earth metal phosphosilicate phosphor powder and preparation method and application thereof
12/09/2009	CN100569045C Light-receiving element
12/09/2009	CN100568503C High-brightness LED with protective function of electrostatic discharge damage
12/09/2009	CN100568502C 半导体器件 Semiconductor devices
12/09/2009	CN100568501C Electronic apparatus
12/09/2009	CN100568489C 电路模块及其制造方法 Circuit module and manufacturing method thereof
12/08/2009	US7629695 Stacked electronic component and manufacturing method thereof
12/08/2009	US7629193 Method of producing acceleration sensor chip package
12/08/2009	US7629188 Flip chip type LED lighting device manufacturing method
12/03/2009	WO2009145196A1 Semiconductor chip, intermediate substrate and semiconductor device
12/03/2009	WO2009143802A1 Led array with means for reducing optical crosstalk
12/03/2009	WO2009143676A1 Multi-chip package
12/03/2009	US20090298230 Stacked Module Systems and Methods
12/03/2009	US20090294947 Chip package structure and manufacturing method thereof
12/03/2009	US20090294946 Package-Borne Selective Enablement Stacking
12/03/2009	US20090294860 In situ formed drain and source regions in a silicon/germanium containing transistor device
12/03/2009	DE102009016649A1 Halbleitervorrichtung und Verfahren mit einem ersten und zweiten Träger A semiconductor device and method having a first and second support
12/03/2009	DE102008039147A1 Optoelektronisches Modul und optoelektronische Anordnung The optoelectronic module and optoelectronic device
12/03/2009	DE102008026216A1 Elektronische Schaltung Electronic circuit
12/03/2009	DE102008025864A1 LED Modul für die Allgemeinbeleuchtung LED Module for General Lighting
12/03/2009	DE102008025693A1 Optoelectronic device for use in projection system in e.g. LED Beamer, has two electrical conductors that are arranged on respective side surfaces of bar for electrically contacting respective semiconductor components
12/03/2009	DE102008025182A1 Lighting element i.e. office lamp, has protective layer made of electrically isolating material and applied on main side of carrier substrate, where protective layer covers all energized parts and cord grip
12/03/2009	DE102008024481A1 Elektrische Bauelementanordnung Electrical component assembly
12/03/2009	DE102008024480A1 Elektrische Bauelementanordnung Electrical component assembly
12/03/2009	DE102008024479A1 Elektrische Bauelementanordnung Electrical component assembly
12/02/2009	EP2128900A2 Illumination device
12/02/2009	EP2126982A1 Assembly and method for generating mixed light
12/02/2009	EP2126969A1 Method of interconnecting electronic wafers
12/02/2009	EP2126968A1 Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof
12/02/2009	CN201355612Y Multi-level light emitting diode array
12/02/2009	CN101595563A Semiconductor device having semiconductor structure bodies on upper and lower surfaces thereof, and method of manufacturing the same
12/02/2009	CN101595562A Stacked packages
12/02/2009	CN101595561A Thin film photovoltaic module wiring for improved efficiency
12/02/2009	CN101594739A Embedded circuit board radiating device and processing method of element
12/02/2009	CN101594730A Circuit board with conductive structure
12/02/2009	CN101593803A Light-emitting diode radiating component, composite type light-emitting diode and light-emitting diode lamp
12/02/2009	CN101593749A Photoelectric converter
12/02/2009	CN101593748A Cascade connected thyristor valve section in jacking connection
12/02/2009	CN101593747A A semiconductor device assembly and a method of establishing electric connection in the semiconductor device assembly
12/02/2009	CN101593741A On-chip system chip
12/02/2009	CN101593736A Semiconductor device and manufacturing method therefor
12/02/2009	CN101593709A Module including a sintered joint
12/02/2009	CN101592291A Method for manufacturing color temperature tunable LED lamp and LED lamp
12/02/2009	CN101591472A Curable resin material composition, optical material, light-emitting device, method for producing light-emitting device, and electronic device
12/02/2009	CN100566511C Method for embedding a component in a base and forming a contact
12/02/2009	CN100566089C Rectifier of AC generator for vehicle
12/02/2009	CN100565946C Illumination system
12/02/2009	CN100565944C Lighting module and method for the production thereof
12/02/2009	CN100565939C Photovoltaic device, photovoltaic system and photogeneration method
12/02/2009	CN100565873C LED luminescent device combined with rectifying circuit on secondary carrier and its production
12/02/2009	CN100565872C 高亮度发光二极管设备 High-brightness light-emitting diode device
12/02/2009	CN100565871C Power semiconductor module with connecting elements which are arranged with material binding
12/02/2009	CN100565858C Power semiconductor module with auxiliary connector
12/02/2009	CN100565830C Spatial packaging structure and method of manufacturing the same
12/01/2009	US7626277 Integrated circuit package with open substrate
12/01/2009	US7626273 Low profile stacking system and method
12/01/2009	US7626252 Multi-chip electronic package and cooling system
12/01/2009	US7625809 Semiconductor device and method of manufacturing the same
12/01/2009	US7625513 Providing press mold having nano pattern defined therein, aligning mold with polymer thin film, heating polymer thin film to temperature above glass transition temperature of film, introducing alcohol vapor into contact with mold, pressing mold into heated polymer thin film, cooling, separating
11/2009
11/26/2009	WO2009142675A2 Solid state lighting component
11/26/2009	WO2009140895A1 Power amplification device and signal transceiver system
11/26/2009	WO2009088869A4 Multiple access over proximity communication
11/26/2009	WO2009034008A3 Continuous method for electronic components, modules and led applications
11/26/2009	US20090291573 Probe card assembly and kit, and methods of making same
11/26/2009	US20090289701 Self-Identifying Stacked Die Semiconductor Components
11/26/2009	US20090289374 Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module
11/26/2009	US20090289099 Wire bonding method
11/26/2009	DE102009022221A1 Halbleitervorrichtung mit beidseitiger Wärmeabstrahlungsstruktur und Verfahren zur Fertigung der Vorrichtung A semiconductor device with double-sided heat-radiating structure and method of manufacturing the device
11/26/2009	DE102008049777A1 Optoelektronisches Modul The optoelectronic module
11/26/2009	DE102008016525A1 Monolithic optoelectronic semiconductor body, useful for illumination, includes layer sequence divided into partial segments and at least three contact pads and conductor planes
11/26/2009	DE102007050417B4 Leistungsmodul mit einem in sich geschlossenen Kühlungssystem Power module with a self-contained cooling system
11/26/2009	DE102004020703B4 Verfahren zur Herstellung einer LED-Baugruppe A method of manufacturing a LED package
11/26/2009	DE10056832B4 Halbleiterbauteil-Moduleinheit Semiconductor device module unit
11/25/2009	EP2124257A1 Power semiconductor device
11/25/2009	EP2124255A1 Light source unit and lighting system
11/25/2009	EP2122697A1 Radiation emitting semi-conductor body having an electrically conductive contact layer permeable to the emitted radiation
11/25/2009	EP2122688A1 Spectrally adaptive multijunction photovoltaic thin film device and method of producing same
11/25/2009	EP2122682A1 Semiconductor module
11/25/2009	EP2122681A1 Sealed ball grid array package
11/25/2009	CN101587887A Light-emitting diode structure
11/25/2009	CN101587886A Electronic device package and fabrication method thereof
11/25/2009	CN101587885A Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module
11/25/2009	CN101587884A Stacked chip packaging structure and manufacturing method thereof
11/25/2009	CN101587883A Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof
11/25/2009	CN101587882A Encapsulation structure of luminous diode chip
11/25/2009	CN101587881A Module integrated circuit packaging structure with temperature compensation and control quartz oscillator
11/25/2009	CN101587875A Vertically electrically connected three-dimensional stacked chip packaging structure and manufacturing method thereof
11/25/2009	CN101587869A Reversible leadless package and methods of making and using same
11/25/2009	CN101587867A Substrate for insulated gate bipolar type transistor module
11/25/2009	CN101587845A Packaging method and packaging structure of electronic volume label and personnel management-control method in dust free room
11/25/2009	CN101587844A Packaging structure and packaging method
11/25/2009	CN100563405C Stereoscopic electronic circuit device, and relay board and relay frame used therein
11/25/2009	CN100563005C Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
11/25/2009	CN100563003C Solar-powered illuminator
11/25/2009	CN100563002C Structure and method for packing LED chip

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