Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2009
12/24/2009US20090318096 Semiconductor integrated circuit including a mixer and wireless communication apparatus
12/24/2009US20090315166 Stacked semiconductor devices and a method for fabricating the same
12/24/2009US20090315099 Method of making flash memory cells and peripheral circuits having sti, and flash memory devices and computer systems having the same
12/24/2009DE112008000533T5 Halbleitermodul und Wechselrichtervorrichtung Semiconductor module and inverter device
12/24/2009DE112008000229T5 Leistungshalbleitervorrichtung Power semiconductor device
12/24/2009DE102009018088A1 Light module has solid body-light source, which emits light of spectrum, and platform, which has recess, in which solid body-light source is arranged
12/24/2009DE102008028886A1 Strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelements The radiation-emitting device and method of manufacturing a radiation-emitting component
12/24/2009DE102008028654A1 Lichtmodul mit einem berührungslos auslesbaren Transponder Light module with a contactless readable transponder
12/24/2009DE102006025453B4 Halbleiterschaltungsanordnung Semiconductor circuitry
12/23/2009WO2009154969A2 Four mosfet full bridge module
12/23/2009WO2009154761A1 Stacking of wafer-level chip scale packages having edge contacts
12/23/2009WO2009152916A1 Led-module for general illumination
12/23/2009EP2136401A1 Process and apparatus for tri-dimensional interconnection of electronic devices
12/23/2009EP2135302A2 Light emitting diode for harsh environments
12/23/2009EP2135280A2 Chips having rear contacts connected by through vias to front contacts
12/23/2009EP1183740B1 Concentrically leaded power semiconductor device package
12/23/2009CN201369330Y LED high thermal conductivity power type electrode support
12/23/2009CN101611481A A semiconductor package
12/23/2009CN101609831A Light-emitting diode
12/23/2009CN101609828A Semiconductor device and method of manufacturing the same
12/23/2009CN101609826A Power semiconductor module and method of manufacturing the same
12/23/2009CN100573901C Organic EL display devices
12/23/2009CN100573868C Organic light-emitting display device and method for fabricating the same
12/23/2009CN100573861C Support construction of LED
12/23/2009CN100573854C Semiconductor device, circuit substrate and electronic apparatus
12/23/2009CN100573839C Electronic circuit device and method for manufacturing same
12/23/2009CN100573629C Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
12/22/2009US7635989 Integrated circuits with bus-based programmable interconnect structures
12/22/2009US7635642 Integrated circuit package and method for producing it
12/22/2009US7635639 Method for the interconnection of active and passive components and resulting thin heterogeneous component
12/22/2009US7635611 Semiconductor substrate for build-up packages
12/22/2009US7635610 Multi-chip stack package and fabricating method thereof
12/22/2009US7635203 Method and apparatus for LED panel lamp systems
12/17/2009WO2009152435A1 Apparatus and system for a single element solar cell
12/17/2009WO2009150875A1 Power module and control method therefore
12/17/2009US20090311816 Ac light emitting device having photonic crystal structure and method of fabricating the same
12/17/2009US20090310322 Semiconductor Package
12/17/2009US20090309206 Semiconductor package and methods of manufacturing the same
12/17/2009US20090309205 Semiconductor chip package and multichip package
12/17/2009US20090309162 Semiconductor device having different fin widths
12/17/2009DE112008000446T5 Halbleitermodule und Wechselrichtervorrichtung Semiconductor modules and inverter device
12/17/2009DE112007003208T5 Ein Halbleitergehäuse A semiconductor package
12/17/2009DE102008054306A1 Harzabgedichtete Halbleitervorrichtung und Herstellungsverfahren dafür Harzabgedichtete semiconductor device and manufacturing method thereof
12/17/2009DE102008027519A1 Flächige Leuchtkörper und ein Verfahren zum Kontaktieren flächiger Leuchtkörper Flat luminous element and a method for contacting a planar luminaire
12/17/2009DE10132455B4 Elektrische Anordnung mit einem Kühlkörper und Verfahren zu deren Herstellung An electrical assembly with a heat sink and method for the preparation thereof
12/17/2009DE10013255B4 Harzgekapselte elektronische Vorrichtung zur Verwendung in Brennkraftmaschinen Resin-encapsulated electronic device for use in internal combustion engines
12/16/2009EP2133915A1 Semiconductor assembly with specially formed bonds and method for manufacturing the same
12/16/2009EP2133854A1 Light emitting device
12/16/2009EP2132789A1 Optoelectronical component emitting electromagnetic radiation and method for producing an optoelectronical component
12/16/2009EP1213773B1 Bulk lens, light emitting body, lighting device and optical information system
12/16/2009CN101606237A Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof
12/16/2009CN101604724A Light emitting elements, light emitting devices including light emitting elements and methods for manufacturing such light emitting elements and/or devices
12/16/2009CN101604688A High-power LED oscillation package structure
12/16/2009CN101604687A Semiconductor light emitting device
12/16/2009CN101604686A Integrated circuit stacking construction with shimming assembly
12/16/2009CN101604685A Memory module
12/16/2009CN101604684A Staggered and stacked chip-packaging structure of lead frame with switching bonding pad on inner pins
12/16/2009CN101604678A Semiconductor device, stacked semiconductor device and interposer substrate
12/16/2009CN100570908C Light emitting diode device
12/16/2009CN100570907C Light-emitting structures
12/16/2009CN100570883C Light emitting device having multiple light emitting elements
12/16/2009CN100570871C Semiconductor device and method of producing the same
12/16/2009CN100570870C Cascade integrate circuit and semiconductor element
12/16/2009CN100570869C Lead free solar cell contacting layer
12/16/2009CN100570844C Package method for multiple chip integrated circuit
12/15/2009USRE41039 Stackable chip package with flex carrier
12/15/2009US7633159 Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages
12/15/2009US7633147 Semiconductor unit having two device terminals for every one input/output signal
12/15/2009US7633146 Semiconductor device and a method of manufacturing the same
12/15/2009US7633093 Method of making optical light engines with elevated LEDs and resulting product
12/10/2009WO2009148543A2 Light source with near field mixing
12/10/2009WO2009148483A1 Solid state lighting component
12/10/2009WO2009148007A1 Electronic circuit
12/10/2009WO2009148001A1 Method for manufacturing semiconductor device
12/10/2009WO2009147753A1 Semiconductor device
12/10/2009WO2009147148A1 Stacked electronic device and process for fabricating such an electronic device
12/10/2009WO2009147036A1 Led lighting array
12/10/2009WO2009146588A1 Bonding method for through-silicon-via based 3d wafer stacking
12/10/2009WO2009146587A1 Bongding method for through-silicon-via based 3d wafer stacking
12/10/2009WO2009119038A3 Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product
12/10/2009WO2009107085A3 Led lamp and method for its design
12/10/2009US20090304389 Semiconductor apparatuses having optical connections between memory controller and memory module
12/10/2009US20090302482 Structure and Method for Forming Hybrid Substrate
12/10/2009US20090302467 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
12/10/2009US20090302344 Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
12/10/2009DE102008026432A1 Integrated circuit for use in e.g. magnetoresistive RAM module, has set of resistance change memory elements, and set of memory element selection devices that are floating-body-selection devices such as FETs or thyristors
12/10/2009DE102008025398A1 SChutzumhüllung für ein LED-Band A protective casing for an LED-band
12/10/2009DE102008025318A1 Leuchtchip und Leuchtvorrichtung mit einem solchen Light chip and lighting device with such a
12/10/2009DE102005027371B4 Leuchtelementen-Bausatz Luminous elements kit
12/09/2009EP2131404A2 Bulk-shaped lens, light-emitting unit, lighting equipment and optical information system
12/09/2009EP2130224A2 Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components
12/09/2009CN201360003Y Memory with radiating fin and assembling tool thereof
12/09/2009CN101601137A Color tunable illumination source and method for controlled illumination
12/09/2009CN101599524A Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same
12/09/2009CN101599521A High power LED encapsulation structure
12/09/2009CN101599517A Light emitting diode (LED) packaging structure with electrostatic protection function and manufacturing method thereof
12/09/2009CN101599486A Mcm packages
12/09/2009CN101599485A Horizontal type high-power thyristor valve string voltage-sharing transition device
12/09/2009CN101599484A Resin sealed semiconductor device and manufacturing method therefor
12/09/2009CN101599483A Stacked die package
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