| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 01/12/2010 | US7646031 Light emitting device having light emitting elements |
| 01/12/2010 | US7646030 Flip chip type LED lighting device manufacturing method |
| 01/12/2010 | US7645997 Positioning of photodetection events |
| 01/12/2010 | US7645062 Light source and vehicle lamp |
| 01/12/2010 | US7645056 Optical irradiation device having LED and heat pipe |
| 01/12/2010 | CA2280065C Clamping arrangement for compression-mounted power electronic devices |
| 01/07/2010 | WO2010002645A1 Through silicon via bridge interconnect |
| 01/07/2010 | WO2010001715A1 Wiring forming method |
| 01/07/2010 | WO2010001597A1 Substrate on which element is to be mounted, semiconductor module, semiconductor device, method for producing substrate on which element is to be mounted, method for manufacturing semiconductor device, and portable device |
| 01/07/2010 | WO2010001549A1 Electronic circuit device |
| 01/07/2010 | WO2010001495A1 Laminated chip |
| 01/07/2010 | WO2010001202A1 Optical signaling for a package-on-package stack |
| 01/07/2010 | WO2010000988A2 Electronic device comprising a plurality of electronic components laid down on a substrate and associated infrared sensor |
| 01/07/2010 | WO2010000224A2 Method for producing a plurality of optoelectronic components |
| 01/07/2010 | WO2010000108A1 Concentrating photovoltaic cell system, wiring and aranging methods thereof |
| 01/07/2010 | US20100002871 Device provided with rewritable circuit, updating system, updating method, updating program and integrated circuit |
| 01/07/2010 | US20100002485 Configurable inputs and outputs for memory stacking system and method |
| 01/07/2010 | US20100001790 Semiconductor device |
| 01/07/2010 | US20100001763 Semiconductor integrated circuit, layout design method of semiconductor integrated circuit, and layout program product for same |
| 01/07/2010 | US20100001398 Semiconductor chip module and manufacturing method thereof |
| 01/07/2010 | US20100001393 Semiconductor device |
| 01/07/2010 | DE102008038302A1 System-in-Package Modul und dieses umfassendes mobiles Endgerät System-in-Package module and this comprehensive mobile device |
| 01/07/2010 | CA2727260A1 Through silicon via bridge interconnect |
| 01/06/2010 | CN201378600Y Light-emitting diode carrier board and backlight module with same |
| 01/06/2010 | CN101622709A semiconductor module and inverter apparatus |
| 01/06/2010 | CN101622708A Semiconductor module and inverter apparatus |
| 01/06/2010 | CN101622707A semiconductor module and inverter apparatus |
| 01/06/2010 | CN101621057A Active assembly array base plate |
| 01/06/2010 | CN101621056A Multi-chip module for power supply circuit and voltage regulator using same |
| 01/06/2010 | CN101621055A Multi-die integrated circuit device and method |
| 01/06/2010 | CN101621054A LED light source device |
| 01/06/2010 | CN101621053A System-in-package module and mobile terminal having the same |
| 01/06/2010 | CN101621052A LED encapsulating array, structure and method |
| 01/06/2010 | CN101621051A stack frame obtained by assembly |
| 01/06/2010 | CN101621050A Lead frame and semiconductor packaging structure as well as production methods thereof |
| 01/06/2010 | CN101621049A Image sensing module |
| 01/06/2010 | CN100578827C Apparatus with plastic member and LED, tool machine and component manufacturing method |
| 01/06/2010 | CN100578816C Method for forming contact and packaged integrated circuit component |
| 01/06/2010 | CN100578784C Organic light emitting display |
| 01/06/2010 | CN100578783C Reflective sensor |
| 01/06/2010 | CN100578782C Large power multi-chip encapsulation construction |
| 01/06/2010 | CN100578781C Light-emitting device |
| 01/06/2010 | CN100578780C LED array packaging structure with silicon carrier plate and its production method |
| 01/06/2010 | CN100578779C Micro-cell and semiconductor packaging with micro-cell |
| 01/06/2010 | CN100578778C Electronic device |
| 01/06/2010 | CN100578763C Semiconductor package and producing method thereof |
| 01/06/2010 | CN100578745C Making method for semiconductor device and semiconductor device |
| 01/06/2010 | CN100578536C 半导体存储卡 The semiconductor memory card |
| 01/06/2010 | CN100578075C Vehicle head light |
| 01/06/2010 | CN100578074C Vehicular headlamp |
| 01/05/2010 | US7642844 Semiconductor integrated circuit for voltage detection |
| 01/05/2010 | US7642835 System for substrate potential regulation during power-up in integrated circuits |
| 01/05/2010 | US7642637 Carrier for stacked type semiconductor device and method of fabricating the same |
| 01/05/2010 | US7642635 Stacked semiconductor package |
| 01/05/2010 | US7642517 Radiation imaging apparatus and radiation imaging system |
| 01/05/2010 | US7642131 Decoupling capacitor closely coupled with integrated circuit |
| 12/31/2009 | US20090325342 Method of fabricating stacked semiconductor package with localized cavities for wire bonding |
| 12/31/2009 | US20090322377 Method and system for sizing flow control buffers |
| 12/31/2009 | US20090321958 Semiconductor device having a simplified stack and method for manufacturing thereof |
| 12/31/2009 | US20090321921 Embedded wiring board, semiconductor package including the same and method of fabricating the same |
| 12/31/2009 | US20090321911 Semiconductor Package and Manufacturing Method Thereof |
| 12/31/2009 | US20090321784 Semiconductor Device and Method of Forming Lateral Power MOSFET with Integrated Schottky Diode on Monolithic Substrate |
| 12/31/2009 | US20090321756 LED Package Structure and Method of Packaging the Same |
| 12/31/2009 | US20090321613 Differential Source Follower Source Leader Addressable Node Readout Circuit |
| 12/31/2009 | DE202009014323U1 Leuchtdiodenstruktur mit mehreren Licht emitierenden Flächen Light-emitting structure with multiple light emitierenden surfaces |
| 12/31/2009 | DE10297225B4 Plättchenbefestigungsklebstoffe insbesondere für Halbleiteranwendungen Die attach adhesives, especially for semiconductor applications |
| 12/31/2009 | DE102008017454A1 Leistungshalbleitermodul mit hermetisch dichter Schaltungsanordnung und Herstellungsverfahren hierzu Power semiconductor module with hermetically sealed circuit and manufacturing method therefor |
| 12/31/2009 | DE10138711B4 Kühlanordnung für in einem Gehäuse angeordnete Verlustwärme erzeugende elektrische Bauteile und elektrisches Gerät mit einer derartigen Kühlanordnung Cooling arrangement arranged in a housing for loss heat generating electrical components and electrical apparatus having such a cooling arrangement |
| 12/30/2009 | WO2009158533A2 Wire on wire stitch bonding in a semiconductor device |
| 12/30/2009 | WO2009158289A1 Integrated tester chip using die packaging technologies |
| 12/30/2009 | WO2009158287A1 Active thermal control for stacked ic devices |
| 12/30/2009 | WO2009157208A1 Circuit module, method for manufacturing circuit module, and portable apparatus |
| 12/30/2009 | WO2009132922A3 Substrate-mounted circuit module comprising components in a plurality of contact planes |
| 12/30/2009 | EP2137772A1 Light source device and display device having the same |
| 12/30/2009 | CN201374644Y Flat package power factor corrector |
| 12/30/2009 | CN201374334Y Flat package double controllable silicon bridge-arm tube |
| 12/30/2009 | CN101617405A 照明装置和照明方法 Lighting device and lighting method |
| 12/30/2009 | CN101617404A 半导体装置 Semiconductor device |
| 12/30/2009 | CN101615612A Structure for encapsulating multichip LED |
| 12/30/2009 | CN101615611A Light-emitting diode chip and preparation method thereof |
| 12/30/2009 | CN101615610A Organic light emitting diode display and method of manufacturing the same |
| 12/30/2009 | CN101615609A Stacking structure for packaging chips |
| 12/30/2009 | CN100576597C Organic electroluminescent device and driving apparatus |
| 12/30/2009 | CN100576535C Light emitting device and illumination apparatus using said light emitting device |
| 12/30/2009 | CN100576534C Hybrid integrated circuit device and method for manufacturing same |
| 12/30/2009 | CN100576533C 半导体器件 Semiconductor devices |
| 12/30/2009 | CN100576532C Structure of semiconductor element embedding in carrier plate and its manufacture method |
| 12/30/2009 | CN100576531C 半导体封装及其制造方法 Semiconductor package and its manufacturing method |
| 12/30/2009 | CN100576517C Circuit device and producing method thereof |
| 12/30/2009 | CN100576483C Unmolded package for a semiconductor device |
| 12/30/2009 | CN100576476C Chip buried in semiconductor encapsulation base plate structure and its manufacturing method |
| 12/30/2009 | CA2726476A1 Active thermal control for stacked ic devices |
| 12/29/2009 | US7639500 Mounting plate for electronic components |
| 12/29/2009 | US7639061 Semiconductor device and capacitance regulation circuit |
| 12/29/2009 | US7638808 Micro-reflectors on a substrate for high-density LED array |
| 12/29/2009 | US7638707 Photovoltaic cell, photovoltaic cell module, method of fabricating photovoltaic cell and method of repairing photovoltaic cell |
| 12/29/2009 | US7638706 Fibril solar cell and method of manufacture |
| 12/29/2009 | US7638364 Multilayer integrated circuit for RF communication and method for assembly thereof |
| 12/29/2009 | US7638363 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages |
| 12/29/2009 | CA2456679C Semiconductor device and making method thereof |