| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/28/2010 | DE102008048420A1 Chip-Anordnung und Verfahren zum Herstellen einer Chip-Anordnung Chip arrangement and method of manufacturing a chip arrangement |
| 01/28/2010 | DE102008040676A1 Abdichtrahmen sowie Verfahren zum Abdecken eines Bauteils Sealing frame and method for covering a component |
| 01/28/2010 | DE102008030842A1 Integrated module for use in micro-electro-mechanical system, comprises plastic body made of thermoplastic with even lower surface, and recess is provided in lower surface of plastic body |
| 01/28/2010 | DE10019839B4 Mehrschichtkondensator, Vewendung des Mehrschichtkondensators, Schaltungsanordnung und Verdrahtunssubstrat damit A multilayer capacitor, Vewendung of the multilayer capacitor, the circuit arrangement and so Verdrahtunssubstrat |
| 01/27/2010 | EP2148557A2 Assembly with a semiconductor module and with a connection device |
| 01/27/2010 | EP2148369A1 LED Base Structure with enhanced light-mixing effect |
| 01/27/2010 | EP2148368A1 High performance semiconductor module |
| 01/27/2010 | EP2148367A1 Semiconductor power module |
| 01/27/2010 | EP2148365A2 Semiconductor device and manufacturing method thereof |
| 01/27/2010 | EP2148363A2 Nobel metal based connection means with a solid fraction and a fluid fraction and application method for same |
| 01/27/2010 | EP2147739A2 Nobel metal based connection means in the form of a foil with a solid faction and a liquid fraction and application and production method for same |
| 01/27/2010 | EP1573799B1 Three-dimensional device fabrication method |
| 01/27/2010 | CN201392836Y Flatly packaged half-control bridge arm device |
| 01/27/2010 | CN201392835Y Memory adopting stacking type wafer structure |
| 01/27/2010 | CN201392834Y Multilayer microwave integrated circuit |
| 01/27/2010 | CN201392833Y Heat tube radiation system of high-power rectifying device of four-inch thyristor |
| 01/27/2010 | CN201392832Y Improved SOT encapsulation structure |
| 01/27/2010 | CN201391790Y High color rendering LED device |
| 01/27/2010 | CN101636839A Light emitting module and method for the production of a light emitting module |
| 01/27/2010 | CN101635296A Organic electro-luminescence display device and manufacturing method thereof |
| 01/27/2010 | CN101635295A Quantum well infrared focal plane array and manufacturing method |
| 01/27/2010 | CN101635294A Light emission device |
| 01/27/2010 | CN101635293A Wafer-to-wafer stacking |
| 01/27/2010 | CN100585890C Luminous chip packaging body and manufacturing method therefor |
| 01/27/2010 | CN100585850C Image sensing module having crystal three-dimensional stacking construction |
| 01/27/2010 | CN100585849C Integrated passive devices |
| 01/27/2010 | CN100585848C Module and electronic device |
| 01/27/2010 | CN100585820C Luminous diode encapsulation method with high efficiency light emitting effect and its packaging structure |
| 01/26/2010 | US7652493 Test arrangement having chips of a first substrate on a second substrate and chips of the second substrate on a third substrate |
| 01/26/2010 | US7652381 Interconnect system without through-holes |
| 01/26/2010 | US7652298 Flip chip type LED lighting device manufacturing method |
| 01/26/2010 | US7652250 Noise reduction method for imaging devices |
| 01/26/2010 | US7652179 Gas for plasma reaction, process for producing the same, and use thereof |
| 01/26/2010 | US7651880 Ge short wavelength infrared imager |
| 01/26/2010 | US7650982 Production system |
| 01/26/2010 | CA2464078C Semiconductor device and method of manufacturing the same |
| 01/21/2010 | WO2010008974A1 Grounding system and apparatus |
| 01/21/2010 | WO2010006988A1 Solar panel |
| 01/21/2010 | WO2010006586A1 Luminous device and method for grouping radiation-emitting semiconductor chips |
| 01/21/2010 | WO2009142675A3 Solid state lighting component |
| 01/21/2010 | US20100017775 Semiconductor integrated circuit device |
| 01/21/2010 | US20100015760 Semiconductor device and manufacturing method thereof |
| 01/21/2010 | US20100014261 Printed circuit board and method of manufacturing printed circuit board |
| 01/21/2010 | US20100013075 Stacked-type semiconductor device package |
| 01/21/2010 | US20100013072 Stacked package and method for forming stacked package |
| 01/21/2010 | US20100013065 Stackable molded packages and methods of making the same |
| 01/21/2010 | US20100012841 Imaging apparatus and methods |
| 01/21/2010 | DE102009030524A1 Baugruppe und Verfahren für eine integrierte Schaltung mit mehreren Chiplagen Assembly and method for an integrated circuit chip having a plurality of layers |
| 01/21/2010 | DE102009011233A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation |
| 01/21/2010 | DE102008051132A1 Organic electronic component e.g. organic light-emitting diode, organic photodetector and/or organic solar cell, comprises transparent electrodes, and organic layer sequence having charge carrier transport layers and active region |
| 01/21/2010 | DE102008033391A1 Leuchtvorrichtung und Verfahren zur Gruppierung von Strahlung emittierenden Halbleiterchips Lighting apparatus and method for grouping of radiation-emitting semiconductor chips |
| 01/20/2010 | EP2146375A1 Semi-conductor module |
| 01/20/2010 | EP2146373A2 Assembly with a semiconductor module and production method for same |
| 01/20/2010 | CN201387884Y Double crystal plate covered crystalloid |
| 01/20/2010 | CN201387883Y 芯片电路结构 Chip circuit structure |
| 01/20/2010 | CN101630679A Luminous chip package structure with embedded static protective function and manufacturing method thereof |
| 01/20/2010 | CN101630678A Luminous device and method for manufacturing same |
| 01/20/2010 | CN101630677A High-frequency quick-recovery diode |
| 01/20/2010 | CN101630676A Novel isolated gate bipolar transistor module distributed with direct bonded copper base plates |
| 01/20/2010 | CN101630675A High pressure and high power series thyristor self-cold and hot pipe radiator unit and method therefor |
| 01/20/2010 | CN100583470C LED radiating device combination |
| 01/20/2010 | CN100583433C Uninsulated double tower type diode module |
| 01/20/2010 | CN100583432C A method of assembly and assembly thus made |
| 01/20/2010 | CN100583431C Manufacture method of stacking chip encapsulation structure |
| 01/20/2010 | CN100583430C Connecting member used for semiconductor device and semiconductor device provided with the same |
| 01/20/2010 | CN100583428C Selective reference plane bridge(s) on folded package |
| 01/19/2010 | US7649770 Programming matrix |
| 01/19/2010 | US7649386 Field programmable gate array utilizing dedicated memory stacks in a vertical layer format |
| 01/19/2010 | US7649252 Ceramic multilayer substrate |
| 01/19/2010 | US7649140 Photovoltaic module with full utilization of surface area |
| 01/14/2010 | WO2010004802A1 Power semiconductor module |
| 01/14/2010 | WO2010004609A1 Power semiconductor device |
| 01/14/2010 | WO2009090123A3 Using 3d integrated diffractive gratings in solar cells |
| 01/14/2010 | WO2009079772A8 Method for stacking serially-connected integrated circuits and multi-chip device made from same |
| 01/14/2010 | US20100009498 Planar interconnect structure for hybrid circuits |
| 01/14/2010 | US20100008056 Stereoscopic electronic circuit device, and relay board and relay frame used therein |
| 01/14/2010 | US20100007535 Circuit with Calibration Circuit Portion |
| 01/14/2010 | US20100007014 Semiconductor device |
| 01/14/2010 | US20100006972 Wafer scale membrane for three-dimensional integrated circuit device fabrication |
| 01/14/2010 | DE112008000743T5 Leistungsmodul und Wechselrichter für Fahrzeuge Power module and inverter for vehicles |
| 01/14/2010 | DE102008040290A1 Hybrid circuit structure for use in automotive-area, has low-current substrate for carrying low current components, and power substrate comprising front side with contact surface section, where low-current substrate is fastened to section |
| 01/14/2010 | DE102008032346A1 Lighting unit for motor vehicle, has semiconductor source of light and circuit carrier, on which group of electrical component is arranged, where group has resistance and semiconductor source of light |
| 01/14/2010 | DE102008031786A1 LED-Modul mit einem Kühlkörper LED module to a heat sink |
| 01/14/2010 | DE102008030723A1 Transport device for multiple electronic components, particularly radio-frequency identification chips, has receiving or storing unit for receiving certain number of electronic components of transport elements |
| 01/14/2010 | DE102008028611A1 Leuchtelement mit Kunststoffhalterung Lamp unit with plastic holder |
| 01/13/2010 | EP2144286A2 Light emitting element with a plurality of light emitting diodes bonded, method of manufacturing the same, and light emitting device using the same |
| 01/13/2010 | EP2144282A1 Method for bonding semiconductor wafers and method for manufacturing semiconductor device |
| 01/13/2010 | EP2142841A1 Light output device |
| 01/13/2010 | CN101627474A Thermal isolation of electronic devices in submount used for leds lighting applications |
| 01/13/2010 | CN101626017A Organic light emitting display device |
| 01/13/2010 | CN101626016A Wafer treating method |
| 01/13/2010 | CN101626015A Package structure and method for forming and manufacturing thereof, chip piling structure |
| 01/13/2010 | CN101626014A Semiconductor chip module and method for manufacturing same |
| 01/13/2010 | CN100580923C Quanta trap infrared detector for multi-folded light dispersion coupling |
| 01/13/2010 | CN100580922C Semiconductor device |
| 01/13/2010 | CN100580921C Semi-conductor light source device |
| 01/12/2010 | US7646237 Configurable clock network for programmable logic device |
| 01/12/2010 | US7646217 Programmable logic device with serial interconnect |
| 01/12/2010 | US7646216 Low power mode |
| 01/12/2010 | US7646102 Wafer level pre-packaged flip chip systems |