Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
02/2010
02/18/2010US20100038539 Pixel Interconnect Insulators and Methods Thereof
02/18/2010DE102008036736A1 Elektrisches Installationsschaltgerät mit einer elektronischen Baugruppe Electrical service switching device with an electronic module,
02/18/2010DE102008035993A1 Power semiconductor module for switching electrical load, has active and passive electrical elements made of semiconductor materials, and arranged on substrate common with power semiconductor or on homogeneous substrate as semiconductor
02/18/2010DE102008026347A1 Power-electronic arrangement, has electrically conducting regions arranged in edge region, where arrangement between one of conducting regions and base body comprises electrically conductive connection
02/17/2010EP2154722A2 Light-emitting device having light-emitting diodes
02/17/2010EP2154721A2 Light-emitting device having light-emitting diodes
02/17/2010EP2153706A1 Electronic circuit device
02/17/2010EP2153465A1 Packaged system of semiconductor chips having a semiconductor interposer
02/17/2010EP2153464A2 Method of producing a wafer scale package
02/17/2010CN201408760Y Spherically encapsulated LED with multiple chips and large-angle light emission
02/17/2010CN201408759Y IGBT power module
02/17/2010CN201408758Y Semiconductor finished product block
02/17/2010CN201408757Y Carrier plate chip packaging structure for SiP system packaging
02/17/2010CN201408756Y Photo-thyristor valve body for radiating heat of thermotube
02/17/2010CN201407500Y Multi-core integrated LED illuminating lamp
02/17/2010CN101651136A Semiconductor light emitting device
02/17/2010CN101651135A 66kV optically-controlled water-cooling thyristor valve box
02/17/2010CN101651134A Observing an internal link via a second link
02/17/2010CN100590869C High-power LED encapsulation structure
02/17/2010CN100590868C Liquid crystal display apparatus
02/17/2010CN100590867C Multi-chip stacked encapsulation structure
02/17/2010CN100590866C Stacking encapsulation structure with symmetric multi-chip migration up and down
02/17/2010CN100590865C Packaging element
02/16/2010US7663252 Electric power semiconductor device
02/16/2010US7663223 Coupling substrate for semiconductor components and method for producing the same
02/16/2010US7663221 Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
02/16/2010US7663215 Electronic module with a conductive-pattern layer and a method of manufacturing same
02/16/2010US7663200 Integrated circuit device packaging structure and packaging method
02/11/2010WO2010017523A1 Color tunable light source
02/11/2010WO2010015825A1 Thermally optimised led chip-on-board module
02/11/2010US20100033239 Semiconductor device
02/11/2010US20100032828 Semiconductor assembly with component attached on die back side
02/11/2010DE102009033321A1 Leistungshalbleitervorrichtung Power semiconductor device
02/11/2010DE102009029830A1 Leuchtdioden-Chipbaugruppe LED chip module
02/11/2010DE102009018603A1 Leuchtvorrichtungen, dieselben enthaltende Pakete und Systeme und Herstellungsverfahren derselben Light emitting devices, and systems containing the same packages and production method thereof
02/11/2010DE102009012538A1 Lichtschranke und Verfahren zur Herstellung derselben Light barrier and method of manufacturing the same
02/11/2010DE102005050254B4 Verfahren zur Herstellung einer flexiblen Leuchteinrichtung als Mehrfachanordnung A method for manufacturing a flexible light-emitting device as a multiple arrangement
02/11/2010DE102005014674B4 Halbleitermodul mit Halbleiterchips in einem Kunststoffgehäuse in getrennten Bereichen und Verfahren zur Herstellung desselben The same semiconductor module with the semiconductor chip in a plastic housing in separate areas and methods for preparing
02/11/2010CA2730719A1 Color tunable light source
02/10/2010EP2151865A1 Electroluminescence device, electroluminescence apparatus, and production methods thereof
02/10/2010EP2151864A2 IC having in-trace antenna elements
02/10/2010EP2151148A2 Method for producing a circuit board having a cavity for the integration of components and circuit board and application
02/10/2010EP2150178A1 X-ray apparatus and detection unit for an x-ray apparatus
02/10/2010CN201402807Y Integrated circuit encapsulated in double-surface and overlapping
02/10/2010CN201402802Y Substrate for setting light emitting diode
02/10/2010CN101647116A Electrical connection for semiconductor structures, method for the production thereof, and use of such a connection in a luminous element
02/10/2010CN101645444A Multichip module containing an integrated passive device
02/10/2010CN101645443A Semiconductor device, semiconductor package containing the semiconductor device and preparation method thereof
02/10/2010CN101645442A Light-emitting diode devices
02/10/2010CN101645441A Multi-cell connected high-power photoelectric device with single-cell failure self-protecting function
02/10/2010CN101645440A Multi-cell connected high-power photoelectric device with function of preventing single-cell thermoelectric damage
02/10/2010CN101645439A Light-emitting diode
02/10/2010CN101645438A Heat-conducting engine radiating device for high-brightness light-emitting diode and lamp combined with the same
02/10/2010CN101645437A Light-emitting diode packaging structure and application thereof
02/10/2010CN100589245C Method for packaging multiple chip packaging structure
02/09/2010US7660923 Embedded system design through simplified add-on card configuration
02/09/2010US7659623 Semiconductor device having improved wiring
02/09/2010US7659620 Integrated circuit package employing a flexible substrate
02/09/2010US7659547 LED array
02/09/2010US7659474 Solar cell array with isotype-heterojunction diode
02/04/2010WO2010014073A1 System and method for utility pole distributed solar power generation
02/04/2010WO2010013588A1 Metal nano-ink, process for producing the metal nano-ink, and die bonding method and die bonding apparatus using the metal nano-ink
02/04/2010WO2009107993A3 High current control circuit including metal-insulator transition device, and system including the high current control circuit
02/04/2010WO2009107948A3 Circuit for preventing self-heating of metal-insulator-transition (mit) device and method of fabricating integrated-device for the same circuit
02/04/2010US20100027577 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
02/04/2010US20100025838 Electronic device protected against electro static discharge
02/04/2010US20100025837 Composite semiconductor device, semiconductor package and spacer sheet used in the same, and method for manufacturing composite semiconductor device
02/04/2010US20100025582 Remote sensing of subsurface artifacts by use of visual and thermal imagery
02/04/2010US20100025581 Infrared imaging apparatus
02/04/2010DE102009034083A1 Halbleiterbauelement Semiconductor device
02/04/2010DE102008017454B4 Leistungshalbleitermodul mit hermetisch dichter Schaltungsanordnung und Herstellungsverfahren hierzu Power semiconductor module with hermetically sealed circuit and manufacturing method therefor
02/04/2010CA2699636A1 System and method for utility pole distributed solar power generation
02/03/2010EP2149907A2 Light-emitting device having light-emitting diodes
02/03/2010EP2149906A2 Light-emitting device having light-emitting diodes
02/03/2010EP2149905A2 Light-emitting device having light-emitting diodes
02/03/2010EP2149903A1 Semiconductor module for electric power
02/03/2010EP2149902A1 Arc discharge device
02/03/2010EP2149007A1 Sealing and thermal accommodation arrangement in led devices
02/03/2010CN201397815Y Semiconductor structure
02/03/2010CN101640195A Light emitting diode chip package
02/03/2010CN101640194A Semiconductor device and method of designing the same
02/03/2010CN100587982C Optoelectronic component
02/03/2010CN100587953C Bonding pad structure for optoelectronic device and fabricating method thereof
02/03/2010CN100587560C Assembly for lighting device, lighting device, back side lighting device and display
02/02/2010US7656672 Power module
02/02/2010US7656189 Trust controller for detecting unauthorized logic in a circuit design
02/02/2010US7656083 Light emitting device having a backside electrode portion and same thickness protrusion and method of manufacturing the same
02/02/2010US7656032 Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
02/02/2010US7656016 Power semiconductor device
02/02/2010US7655859 Connector for a solar module
02/02/2010US7655552 Double density method for wirebond interconnect
02/02/2010US7655504 Semiconductor device and method of manufacturing the same
01/2010
01/28/2010WO2010010813A1 Wire forming method
01/28/2010WO2010010769A1 Semiconductor device
01/28/2010US20100019391 Semiconductor Device
01/28/2010US20100019368 Semiconductor chip package, stacked package comprising semiconductor chips and methods of fabricating chip and stacked packages
01/28/2010US20100019338 Stack type semiconductor chip package having different type of chips and fabrication method thereof
01/28/2010US20100019254 Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device
01/28/2010DE112008000452T5 Halbleitermodul und Wechselrichtervorrichtung Semiconductor module and inverter device
01/28/2010DE102009025185A1 Lichtemittierendes Bauelement, lichtemittierende Vorrichtung und Verfahren zur Herstellung und zum Betrieb eines derartigen Lichtbauelements A light emitting device, light emitting device and method for the production and operation of such a light component