Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2010
03/09/2010US7675073 Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities
03/09/2010US7674652 Methods of forming an integrated circuit package
03/09/2010US7673387 Manufacture of a layer including a component
03/09/2010CA2393222C Light-emitting or light-receiving semiconductor module and method for making the same
03/04/2010WO2010024777A1 Substrate arrangement
03/04/2010WO2010023840A1 Semiconductor light emitting device and backlight source, backlight source system, display device, and electronic device using the same
03/04/2010WO2010023812A1 Semiconductor device
03/04/2010WO2010023220A1 Improvements in or relating to solid-state lasers
03/04/2010WO2010000224A3 Method for producing a plurality of optoelectronic components
03/04/2010US20100055845 Power semiconductor module and method of manufacturing the same
03/04/2010US20100055837 Multi-chip module and methods
03/04/2010US20100052136 Three-Dimensional Package and Method of Making the Same
03/04/2010US20100052135 Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
03/04/2010US20100052132 Semiconductor package
03/04/2010US20100052096 Stacked-chip device
03/04/2010US20100052063 Method to improve dielectric quality in high-k metal gate technology
03/04/2010US20100052002 Micro-reflectors on a substrate for high-density led array
03/04/2010DE202009017107U1 Leitendes Gestell für erweiterte multidimensionale Leuchtsiliziumchips Managing frame for extended multidimensional fluorescent silicon chips
03/04/2010DE202009016910U1 Halterung für Siliziumchips mit parallelen Mehrfachschaltkreisen Holder for silicon chips with multiple parallel circuits
03/04/2010DE202009005224U1 Lichtemittierende Parallelschaltung einer parallelen lichtemittierenden Leuchtdiodenvorrichtung und dessen Leiterplatte Light emitting parallel connection of a parallel light emitting light emitting diode device and the circuit board
03/04/2010DE102009038706A1 Sensorbauelement Sensor device
03/04/2010DE102009035920A1 Halbleiterbauelement Semiconductor device
03/04/2010DE102008044986A1 Ein 3-D-integriertes Schaltungsbauelement mit einer internen Wärmeverteilungsfunktion A 3-D integrated circuit device with an internal heat distribution function
03/04/2010DE102008044835A1 LED module for use in vehicle headlight, has two assembly plates on which respective semiconductor light sources are arranged, and flexible mechanical and electrical connection i.e. cable, provided between assembly plates
03/04/2010DE102008041656A1 Method for manufacturing component, involves preparing two wafers, where contact opening extending perpendicular to main extension plane of former wafer is made in former wafer
03/04/2010DE102008041550A1 Im Diepadbereich strukuiertes Leadframe, dieses Leadframe umfassende mikrostruktuierte Bauteilanordnung und Verfahren zu deren Herstellung In strukuiertes leadframe die pad area, this lead frame comprehensive mikrostruktuierte component assembly and process for their preparation
03/04/2010DE102008039743A1 Light-activated thyristor for e.g. switching of load, has ignition stage including conductor structure with conductor segments, which are distanced from each other and electrically contact n-doped ignition stage emitter and P-doped base
03/03/2010EP2159841A2 A semiconductor device having a suspended isolating interconnect
03/03/2010EP2159780A2 Display device
03/03/2010EP2158605A2 Method for producing a set of chips mechanically interconnected by means of a flexible connection
03/03/2010EP2158604A2 Assemblage of radiofrequency chips
03/03/2010EP2158080A1 Light output device
03/03/2010CN201417773Y Encapsulating structure for T0220F outline triode product
03/03/2010CN201417772Y Power MOSFET module with gate pole resistance layout
03/03/2010CN201417771Y Power module with lower stray inductance
03/03/2010CN201417770Y Pressure equalizing transitional device used for high-power thyristor valve string
03/03/2010CN101663754A Led module with silicon platform
03/03/2010CN101661931A Semiconductor die support in an offset die stack
03/03/2010CN101661930A Electronic element wafer module and method for manufacturing electronic element wafer module and electronic information device
03/03/2010CN101661929A Stacked type chip package structure
03/03/2010CN101661928A 芯片封装体 Chip package
03/03/2010CN101661927A Chip package
03/03/2010CN101661926A Chip package
03/03/2010CN101661925A Chip package
03/03/2010CN100593271C Optoelectronic device packaging with hermetically sealed cavity and integrated optical element
03/02/2010US7673274 Datapipe interpolation device
03/02/2010US7671626 Versatile logic element and logic array block
03/02/2010US7671432 Dynamic quantity sensor
03/02/2010US7671373 LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same
03/02/2010US7670893 Membrane IC fabrication
03/02/2010US7670876 Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same
02/2010
02/25/2010WO2010022163A1 3d integrated circuit device fabrication
02/25/2010WO2010021410A1 Stacked memory chip, semiconductor integrated circuit device using same, and manufacturing method therefor
02/25/2010WO2010020437A1 3d integrated circuit device fabrication using interface wafer as permanent carrier
02/25/2010WO2009158533A3 Method of wire bonding a stackof semiconductor chips in an offset configuration and device obtained by such a method
02/25/2010WO2009154969A3 Four mosfet full bridge module
02/25/2010US20100044883 Plastic Semiconductor Package Having Improved Control of Dimensions
02/25/2010US20100044847 Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip
02/25/2010US20100043553 Acceleration sensor chip package
02/25/2010DE102009035358A1 Elektronikbauelement und Verfahren zu dessen Herstellung An electronics device and process for its preparation
02/25/2010DE102005046406B4 Halbleiteranordnung mit einem elektrischen Verbraucher und einer Halbleitereinrichtung zur Steuerung der Stärke eines elektrischen Stroms A semiconductor device comprising an electrical load and a semiconductor device for controlling the strength of an electric current
02/24/2010EP2157609A2 Light-emitting device having light-emitting diodes
02/24/2010EP2156469A1 Illuminant
02/24/2010EP2156468A2 Semiconductor device having multiple die redistribution layer
02/24/2010CN201413835Y LED cluster embedding structure
02/24/2010CN201413823Y Surface-mounted dual-chip diode rectifying device
02/24/2010CN201412712Y Densely-packaged LED light source
02/24/2010CN101657899A 功率半导体模块 Power semiconductor module
02/24/2010CN101656251A Method for lowering light attenuation of light emitting diode
02/24/2010CN101656250A Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates
02/24/2010CN101656249A Multilayer interconnection structure of wafer level package, manufacturing method and application
02/24/2010CN101656248A Chip-stacked package structure of substrate with groove and packaging method thereof
02/24/2010CN101656247A Semiconductor packaging structure
02/24/2010CN101656246A Chip-stacked package structure of substrate with opening and packaging method thereof
02/24/2010CN100592537C Luminescent material, especially for LED application
02/24/2010CN100592514C Organic light-emitting diode display device and method of fabricating the same
02/24/2010CN100592513C Chip assembly and method of manufacturing thereof
02/24/2010CN100592512C Semiconductor device with image pick-up element
02/24/2010CN100592511C Semiconductor package body
02/24/2010CN100592510C Light emitting device module
02/24/2010CN100592509C Semiconductor device and capsule type semiconductor package
02/23/2010US7667974 Module and mounted structure using the same
02/23/2010US7667318 Fan out type wafer level package structure and method of the same
02/23/2010US7667312 Semiconductor device including a heat-transmitting and electromagnetic-noise-blocking substance and method of manufacturing the same
02/23/2010US7667311 LSI package provided with interface module, and transmission line header employed in the package
02/23/2010US7667237 Light emitting device having light emitting elements
02/23/2010US7665861 Led module for illumination systems
02/23/2010US7665652 Electronic devices including metallurgy structures for wire and solder bonding
02/23/2010US7665209 Method manufacturing wiring substrate
02/23/2010US7665207 Method of making a multi-chip electronic package having laminate carrier
02/18/2010WO2010019889A1 Corrosion control of stacked integrated circuits
02/18/2010WO2010019663A1 System and method for excess voltage protection in a multi-die package
02/18/2010WO2010018779A1 Semiconductor device and manufacturing method therefor
02/18/2010WO2009119038A4 Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product
02/18/2010US20100038771 Integrated circuit package with open substrate
02/18/2010US20100038769 Wafer stacked package waving bertical heat emission path and method of fabricating the same
02/18/2010US20100038768 Integrated circuit package system for package stacking and manufacturing method thereof
02/18/2010US20100038767 Semiconductor device and method of manufacturing the same
02/18/2010US20100038766 Method for forming terminal of stacked package element and method for forming stacked package
02/18/2010US20100038765 Semiconductor package and method for manufacturing the same
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