Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2010
03/24/2010CN101681905A Arc discharge device
03/24/2010CN101681904A 多芯片封装 A multi-chip package
03/24/2010CN101681903A Electronic package and manufacturing method thereof
03/24/2010CN101681902A Array of small contacts for solar cell fabrication
03/24/2010CN101681898A Structure for cooling semiconductor element
03/24/2010CN101681887A Method for producing a set of chips mechanically interconnected by means of a flexible connection
03/24/2010CN101681850A Bonding apparatus, and bonding method
03/24/2010CN101681849A Bonding apparatus, and bonding method
03/24/2010CN101681845A Adhesive film and semiconductor device obtained with the same
03/24/2010CN101677119A White light-emitting diode
03/24/2010CN101677098A 集成电路装置 The integrated circuit device
03/24/2010CN101677097A Optical package element, display device, and electronic apparatus
03/24/2010CN101677096A 半导体器件 Semiconductor devices
03/24/2010CN101677095A Luminescence device and semiconductor device
03/24/2010CN101677092A Chip packaging structure
03/24/2010CN100595919C LED combined light illuminating display device for generating optical flow beam
03/24/2010CN100595918C Module comprising radiation-emitting semiconductor bodies
03/24/2010CN100595917C 半导体器件 Semiconductor devices
03/24/2010CN100595916C LED chip packaging structure using ceramics as plaque and making method thereof
03/23/2010US7683654 Signal isolators using micro-transformers
03/23/2010US7683534 flexible substrate layer and plurality of cooperative barrier layers disposed on substrate layer; barrier layers further comprise one or more planarizing layers and one or more high-density layers; organic light-emitting diodes
03/23/2010US7683492 Semiconductor device
03/23/2010US7683404 Stacked memory and method for forming the same
03/23/2010US7683377 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
03/23/2010US7683337 Radiographic apparatus and control method therefor
03/23/2010US7683268 Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
03/23/2010US7682873 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages
03/23/2010US7681309 Method for interconnecting an integrated circuit multiple die assembly
03/23/2010US7681308 Fabrication method of semiconductor integrated circuit device
03/18/2010WO2010030580A1 Testing circuit split between tiers of through silicon stacking chips
03/18/2010WO2010030557A1 System and method utilizing redundancy in semiconductor chip interconnects
03/18/2010WO2010030532A1 Systems and methods for enabling esd protection on 3-d stacked devices
03/18/2010WO2010030474A1 Interconnect structures for stacked dies, including penetrating structures for through-silicon vias
03/18/2010WO2010029668A1 Integrated circuit device
03/18/2010WO2009020572A8 Stack packages using reconstituted wafers
03/18/2010US20100068851 Castellation wafer level packaging of integrated circuit chips
03/18/2010US20100068850 Semiconductor device and a method of manufacturing the same
03/18/2010US20100066401 Semiconductor device
03/18/2010US20100065955 Integrated Circuit Devices with Stacked Package Interposers
03/18/2010US20100065953 Semiconductor package
03/18/2010US20100065912 Stacked semiconductor device and related method
03/18/2010US20100065883 Process for making contact with and housing integrated circuits
03/18/2010US20100065859 Semiconductor device and method of manufacturing the same
03/18/2010DE10228793B4 Elektronisches Bauelement, welches aufgestapelte Mikrochips enthält Electronic component containing stacked microchips
03/18/2010DE102008046762A1 LED-Projektor LED Projector
03/18/2010DE102007032275B4 Verbundanordnung, die mehrere Vorrichtungen eingliedert, die unterschiedliche Lichtwellenlängen verwenden, und Verfahren zum Herstellen derselben A composite assembly, which incorporates a plurality of devices that use different wavelengths of light and methods of making the same
03/18/2010DE102005008775B4 Lichtemittierende Vorrichtung und Beleuchtungs-Vorrichtung Light-emitting device and illumination device
03/18/2010CA2735689A1 Systems and methods for enabling esd protection on 3-d stacked devices
03/17/2010EP2163145A1 Electronic module and method for producing an electronic module
03/17/2010EP2162915A1 Method of producing a via in a reconstituted substrate
03/17/2010EP2162913A1 Method for fabricating a security-protected electronic system, corresponding integrated circuit security protection device and corresponding electronic system
03/17/2010EP2162908A1 3d integration of vertical components in reconstituted substrates
03/17/2010EP2162907A1 Device including integrated components imbedded in cavities of a reception semi-conductor plate and corresponding method
03/17/2010EP1393375B1 Contact system
03/17/2010CN101675535A Optoelectronical component emitting electromagnetic radiation and method for producing an optoelectronical component
03/17/2010CN101675527A Low resistance tunnel junctions for high efficiency tandem solar cells
03/17/2010CN101675520A Semiconductor module for electric power
03/17/2010CN101675516A Chips having rear contacts connected by through vias to front contacts
03/17/2010CN101673802A Integrated metal matrix aluminium nitride film substrate, high-power LED module of heat pipe and manufacturing method thereof
03/17/2010CN101673732A Illuminating means
03/17/2010CN101673731A Double-module device
03/17/2010CN101673730A Stack assemblies containing semiconductor devices
03/17/2010CN101673729A 半导体器件 Semiconductor devices
03/17/2010CN100594609C Methods and systems for attaching die in stacked-die packages
03/17/2010CN100594608C High-density circuit module
03/17/2010CN100594607C Built-in type multifunctional conformity type structure and fabricating method thereof
03/17/2010CN100594606C Circuit device and its manufacturing method
03/17/2010CN100594605C Semiconductor device
03/17/2010CN100594595C Method and chip for integrating micro electromechanical system device and integrated circuit
03/16/2010US7679398 Reprogrammable instruction DSP
03/16/2010US7679179 Castellation wafer level packaging of integrated circuit chips
03/16/2010US7678991 Rigid integrated photovoltaic roofing membrane and related methods of manufacturing same
03/16/2010US7678990 Flexible integrated photovoltaic roofing membrane and related methods of manufacturing same
03/16/2010US7677943 Manufacturing of a photo-radiation source by binding multiple light emitting chips without use of solder or wiring bonding
03/16/2010US7676911 Method to reduce module inductance
03/11/2010WO2010027425A1 Method and system for converting light to electric power
03/11/2010WO2010025694A2 Optoelectronic component
03/11/2010WO2009154761A9 Stacking of wafer-level chip scale packages having edge contacts
03/11/2010US20100062568 Electronic module with a conductive-pattern layer and a method of manufacturing same
03/11/2010US20100059748 Method for manufacturing thin film integrated circuit, and element substrate
03/11/2010DE102008045925A1 Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils The optoelectronic device and method for producing an optoelectronic component
03/10/2010EP2161749A2 Layered semiconductor light emitting device and image forming apparatus
03/10/2010EP2161745A1 Stack assemblies containing semiconductor devices
03/10/2010EP2161739A1 Adhesive film and semiconductor device obtained with the same
03/10/2010EP2160762A1 An interconnect implementing internal controls
03/10/2010CN201421842Y Flexible connection structure for memory module packaging
03/10/2010CN201420973Y Multi-chip integration structure for LED light source arrays
03/10/2010CN101667571A 感测模块 Sensing module
03/10/2010CN101667570A 电路结构 Circuit configuration
03/10/2010CN101667569A 光电转换装置 The photoelectric conversion device
03/10/2010CN101667568A Refrigeration structure for three-dimensional encapsulation of micro-electronics and preparation method thereof
03/10/2010CN100593855C 半导体装置 Semiconductor device
03/10/2010CN100593854C Assembled structure of large area array infrared detector on cold platform and assembled method thereof
03/10/2010CN100593853C Semiconductor device and manufacturing method thereof
03/10/2010CN100593852C High power LED compatible integrating packaging module
03/09/2010US7675357 Multi-system module having functional substrate
03/09/2010US7675321 Dual-slice architectures for programmable logic devices
03/09/2010US7675227 Image display device and light emission device
03/09/2010US7675165 Mount for a programmable electronic processing device
03/09/2010US7675152 Package-on-package semiconductor assembly
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