Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
04/2010
04/07/2010CN101691911A Led封装模块 Led package module
04/07/2010CN101691910A LED packaging module and preparation method thereof
04/07/2010CN101691908A Led封装模块 Led package module
04/07/2010CN101691907A Led封装模块 Led package module
04/06/2010US7693703 Configuration of reconfigurable interconnect portions
04/06/2010US7693360 Optoelectronic hybrid integrated module and light input/output apparatus having the same as component
04/06/2010US7692444 Signal isolators using micro-transformers
04/06/2010US7692296 Semiconductor device and multilayer substrate therefor
04/06/2010US7692292 Packaged electronic element and method of producing electronic element package
04/06/2010US7692291 Circuit board having a heating means and a hermetically sealed multi-chip package
04/06/2010US7692287 Semiconductor device and wiring board
04/06/2010US7692282 Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
04/06/2010US7692206 Composite leadframe LED package and method of making the same
04/06/2010US7691673 Electronic parts packaging structure and method of manufacturing the same
04/01/2010WO2010036811A1 Device, system and method for directly generating alternating current electricity from photovoltaic cells
04/01/2010WO2010036347A1 Interposer including voltage regulator and method therefor
04/01/2010WO2010035867A1 Semiconductor element-mounting package substrate, and method for manufacturing package substrate
04/01/2010WO2010035866A1 Package substrate for mounting semiconductor element and method for manufacturing the package substrate
04/01/2010WO2010035865A1 Package substrate for mounting semiconductor element and method for manufacturing the package substrate
04/01/2010WO2010035864A1 Semiconductor element-mounting package substrate, method for manufacturing package substrate, and semiconductor package
04/01/2010WO2010035401A1 Electronic device and method for manufacturing same
04/01/2010WO2010035379A1 Semiconductor device and a method of fabricating the same
04/01/2010WO2010035377A1 Semiconductor device and method for manufacturing same
04/01/2010WO2010035376A1 Semiconductor device manufacturing method
04/01/2010WO2010035375A1 Semiconductor device and method for manufacturing the same
04/01/2010WO2010035269A2 Integrated solar powered device
04/01/2010WO2010034281A1 Optoelectronic component
04/01/2010WO2010034278A1 Optoelectronic module having a carrier substrate and a plurality of radiation-emitting semiconductor components and method for the production thereof
04/01/2010WO2010034274A1 Radiation emitting device
04/01/2010WO2010034132A1 A method of manufacturing the leds with symmetry axis
04/01/2010US20100079966 Memory module
04/01/2010US20100079246 Integrated circuit with a rectifier element
04/01/2010US20100079203 Semiconductor Device
04/01/2010US20100078830 Adhesive tape and semiconductor device using the same
04/01/2010US20100078809 Semiconductor Module with Micro-Buffers
04/01/2010US20100078793 Semiconductor device assemblies, electronic devices including the same and assembly methods
04/01/2010US20100078792 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
04/01/2010US20100078791 Semiconductor package having ink-jet type dam and method of manufacturing the same
04/01/2010US20100078790 Semiconductor device
04/01/2010US20100078787 Semiconductor device
04/01/2010DE112008001037T5 Filmbildungsverfahren, Wärmeleitelement, Leistungsmodul, Fahrzeuginverter und Fahrzeug Film-forming method, heat-conducting, power module, vehicle inverter and vehicle
04/01/2010DE102008049231A1 Schaltung und Verfahren zu deren Herstellung Circuit and method for their preparation
04/01/2010DE102008049188A1 Optoelektronisches Modul mit einem Trägersubstrat und einer Mehrzahl von strahlungsemittierenden Halbleiterbauelementen und Verfahren zu dessen Herstellung An optoelectronic module with a carrier substrate and a plurality of radiation-emitting semiconductor devices and method for its production
04/01/2010DE102008049069A1 Optoelectronic module is provided with carrier substrate, radiation emitting semiconductor component and electric component
04/01/2010DE102008048650A1 Strahlung emittierende Vorrichtung Radiation emitting device
04/01/2010CA2736903A1 Device, system and method for directly generating alternating current electricity from photovoltaic cells
03/2010
03/31/2010EP2170026A1 Metal ceramic substrate for electric components or modules, method for producing such a substrate and module with such a substrate
03/31/2010EP2169718A1 Power module
03/31/2010EP2169300A1 Light source with LED and crimp contacts
03/31/2010EP2168160A1 Semiconductor module
03/31/2010EP1301917B1 Passive radiation optical system module especially for use with light-emitting diodes
03/31/2010CN201435411Y high-power led packaging and mounting structures
03/31/2010CN201435407Y Novel substrate used for encapsulating LED
03/31/2010CN201435405Y LED packaging structure
03/31/2010CN201435387Y Support and LED seal structure for sealing LEDs
03/31/2010CN101690424A Electronic module and method for producing an electronic module
03/31/2010CN101689544A Side stacking apparatus and method
03/31/2010CN101689252A Memory card and method for manufacturing the same
03/31/2010CN101687393A Light output device
03/31/2010CN101687284A Solder material, process for producing the solder material, joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module
03/31/2010CN101686823A X-ray apparatus and detection unit for an x-ray apparatus
03/31/2010CN101686612A Manufacture of a layer including a component
03/31/2010CN101685816A Light-emitting module, light-emitting device having the light-emitting module, and lighting apparatus having the light-emitting device
03/31/2010CN101685815A Isolated encapsulated LED
03/31/2010CN101685814A Polydomain array method of multiple light-emitting diode chips under single lens
03/31/2010CN101685783A Light emitting diode chip package structure and making method thereof
03/31/2010CN101685764A System level module structure and production method thereof
03/31/2010CN101684900A LED package module
03/31/2010CN101684899A LED package module
03/30/2010US7687947 Electric motor comprising an electronic unit with a punched grid
03/30/2010US7687896 Semiconductor device having a stacked chip structure
03/30/2010US7687885 Semiconductor device with reduced parasitic inductance
03/30/2010US7687313 Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package
03/30/2010CA2513127C Method for producing microsystems
03/25/2010WO2010032729A1 Method for manufacturing semiconductor device
03/25/2010WO2010032534A1 Semiconductor device
03/25/2010WO2010032473A1 Inverter device
03/25/2010WO2010032192A1 Electric component with under-bump metallization and integrated confinement structure
03/25/2010WO2010032183A1 Colour mixing method for consistent colour quality
03/25/2010WO2010031845A1 Methods and systems for material bonding
03/25/2010WO2010031367A1 Illumination means
03/25/2010US20100075463 Method and apparatus for fabricating self-assembling microstructures
03/25/2010US20100073957 Optical irradiation device
03/25/2010US20100072604 Semiconductor device
03/25/2010US20100072603 Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages
03/25/2010US20100072602 Stacked integrated circuit package using a window substrate
03/25/2010US20100072601 Semiconductor device and manufacturing method of a semiconductor device
03/25/2010US20100072600 Fine-pitch oblong solder connections for stacking multi-chip packages
03/25/2010US20100072599 Semiconductor Device and Method of Forming a Wafer Level Package with Top and Bottom Solder Bump Interconnection
03/25/2010DE202009016396U1 Substrat für Leuchtdioden Substrate for light-emitting diodes
03/25/2010DE202009011954U1 3 Volt LED-Leuchte 3 Volt LED lamp
03/25/2010DE102009032995A1 Gestapelte Halbleiterchips Stacked semiconductor chips
03/24/2010CN201430161Y LED device package structure
03/24/2010CN201430140Y Semi-conductor thunder surge suppressor
03/24/2010CN201430139Y In-series thyristor valve section
03/24/2010CN201430138Y Totally enclosed compression-molded rectifying bridge
03/24/2010CN101682991A Light-emitting diode assembly without solder
03/24/2010CN101681908A Illuminant
03/24/2010CN101681907A Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
03/24/2010CN101681906A 功率模块 Power Modules
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