| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/28/2010 | CN1451181B Method and device for transferring spin-polarized charge carriers |
| 04/28/2010 | CN101699623A 半导体装置 Semiconductor device |
| 04/27/2010 | US7706596 Method and apparatus for automating an inspection procedure |
| 04/27/2010 | US7705868 Light emitting array with improved characteristics, optical writing unit, and image forming apparatus |
| 04/27/2010 | US7705629 Permutable switching network with enhanced interconnectivity for multicasting signals |
| 04/27/2010 | US7705628 Programmable logic device having logic elements with dedicated hardware to configure look up tables as registers |
| 04/27/2010 | US7705450 Decoupling capacitor closely coupled with integrated circuit |
| 04/27/2010 | US7705309 Radiation detector with extended dynamic range |
| 04/27/2010 | US7705234 Solar module having a connecting element |
| 04/27/2010 | US7704799 Method of manufacturing wiring substrate |
| 04/27/2010 | US7704794 Method of forming a semiconductor device |
| 04/27/2010 | US7704762 Lamp and method of producing a lamp |
| 04/22/2010 | WO2010045413A1 Electrostatic discharge (esd) shielding for stacked ics |
| 04/22/2010 | WO2010044741A1 Method for making via interconnection |
| 04/22/2010 | WO2010044315A1 Through electrode substrate, method for manufacturing the through electrode substrate, and semiconductor device using the through electrode substrate |
| 04/22/2010 | US20100096761 Semiconductor substrate for build-up packages |
| 04/22/2010 | US20100096758 Electric power semiconductor device |
| 04/22/2010 | US20100096741 Chip-Stacked Package Structure and Method for Manufacturing the Same |
| 04/22/2010 | US20100096740 Stacked type chip package structure |
| 04/22/2010 | US20100096739 Stacked semiconductor module |
| 04/22/2010 | US20100096738 Ic die having tsv and wafer level underfill and stacked ic devices comprising a workpiece solder connected to the tsv |
| 04/22/2010 | US20100096710 Semiconductor fingerprint apparatus with flat touch surface |
| 04/22/2010 | US20100096629 Multi-chip module for automatic failure analysis |
| 04/22/2010 | DE102008062307A1 Optoelektronische Komponente basierend auf Premold-Technologie Optoelectronic component based on premold technology |
| 04/22/2010 | DE102008051256A1 Halbleiter-Strahlungsquelle Semiconductor radiation source |
| 04/22/2010 | DE102004009056B4 Verfahren zur Herstellung eines Halbleitermoduls aus mehreren stapelbaren Halbleiterbauteilen mit einem Umverdrahtungssubstrat A process for producing a semiconductor module of a plurality of stackable semiconductor devices with a rewiring substrate |
| 04/21/2010 | EP2176885A1 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods |
| 04/21/2010 | CN201440414U Thyristor power assembly for paper machine |
| 04/21/2010 | CN201440413U Encapsulation structure |
| 04/21/2010 | CN201439894U Light-emitting module capable of being combined randomly so as to generate area light source with predetermined shape |
| 04/21/2010 | CN1937222B LED package and illuminating device |
| 04/21/2010 | CN1519930B Semiconductor device, electronic apparatus. their manufacture method and electronic instrument |
| 04/21/2010 | CN101697367A Method for preparing LED by using transparent ceramics |
| 04/21/2010 | CN101697349A A surface geometry for mos-gated device |
| 04/21/2010 | CN101697348A Small-carrier flat-four-side pin-less packaging part and preparation method thereof |
| 04/21/2010 | CN101465398B preparation method of single electrode white light LED based on secondary substrate transfer technology |
| 04/21/2010 | CN101315923B Chip stack package structure |
| 04/21/2010 | CN101174616B 电路装置 Circuit device |
| 04/20/2010 | US7703062 Semiconductor integrated circuit and method of designing layout of the same |
| 04/20/2010 | US7701743 Electronic circuit package |
| 04/20/2010 | US7701252 Stacked die network-on-chip for FPGA |
| 04/20/2010 | US7701251 Methods and apparatus for implementing a stacked memory programmable integrated circuit system in package |
| 04/20/2010 | US7701066 Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same |
| 04/20/2010 | US7701045 Point-to-point connection topology for stacked devices |
| 04/20/2010 | US7700957 Process for making contact with and housing integrated circuits |
| 04/20/2010 | US7700869 Solar cell low iron patterned glass and method of making same |
| 04/20/2010 | US7700409 Method and system for stacking integrated circuits |
| 04/15/2010 | WO2010041589A1 Composite module |
| 04/15/2010 | WO2010041177A1 Lighting device |
| 04/15/2010 | WO2010040342A1 Optoelectronic component |
| 04/15/2010 | WO2010015878A3 Process for joining and separating substrates |
| 04/15/2010 | WO2010000988A3 Electronic device comprising a plurality of electronic components laid down on a substrate and associated infrared sensor |
| 04/15/2010 | US20100090338 Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same |
| 04/15/2010 | US20100090327 Semiconductor device with improved resin configuration |
| 04/15/2010 | US20100090326 Stack package |
| 04/15/2010 | US20100090325 Semiconductor device |
| 04/15/2010 | DE202010000020U1 Elektronikbaugruppe Electronics assembly |
| 04/15/2010 | DE202008016023U1 Tageslicht-LED-Cluster Daylight LED cluster |
| 04/15/2010 | DE102009041463A1 Halbleitervorrichtung mit mehreren Halbleitersubstraten und Verfahren zu deren Fertigung A semiconductor device comprising a plurality of semiconductor substrates and methods for their production |
| 04/15/2010 | DE102009026480A1 Modul mit einer gesinterten Fügestelle Module with a sintered joint |
| 04/15/2010 | DE102009021021A1 Bauelement mit verringerter freier Ladungsträger-Lebensdauer Component with a reduced free charge carrier lifetime |
| 04/15/2010 | DE102008051050A1 Opto-electronic semiconductor module for e.g. projection application, has semiconductor segments characterized by operating voltages, where one of voltage range includes weighted sum of natural numbers with different voltage ranges |
| 04/15/2010 | DE102008051044A1 Optoelektronisches Bauteil The optoelectronic device |
| 04/15/2010 | DE102008047579A1 Leuchtmittel Lamp |
| 04/15/2010 | DE102008042810A1 Verfahren zur Herstellung eines mit elektrischen Elementen versehenen Substrats A method for preparing a substrate provided with electric elements |
| 04/15/2010 | DE102006037512B4 Modul und Verfahren zur Herstellung eines Moduls mit übereinander gestapelten Bauelementen Module and method for manufacturing a module having stacked components |
| 04/15/2010 | DE102005053396B4 Schaltungseinrichtung, insbesondere Frequenzumrichter Circuit means, in particular frequency |
| 04/15/2010 | DE10062108B4 Leistungsmodul mit verbessertem transienten Wärmewiderstand Power module with improved transient thermal resistance |
| 04/14/2010 | EP2174350A2 Arrangement comprising at least one semiconductor component, in particular a power semiconductor component for the power control of high currents |
| 04/14/2010 | CN201438466U ultra-fast recovery diode |
| 04/14/2010 | CN201438463U Encapsulated PIN-FET optical receiving component with eight pins |
| 04/14/2010 | CN201438462U Lighting protection light-emitting diode |
| 04/14/2010 | CN201438461U Novel CMOS image sensor module |
| 04/14/2010 | CN201438460U Packaging structure of semiconductor |
| 04/14/2010 | CN101211905B Press-loading valve stack for large power all-controlled semiconductor device |
| 04/14/2010 | CN101188231B Semiconductor device and semiconductor wafer and method for manufacturing the same |
| 04/13/2010 | US7698470 Integrated circuit, chip stack and data processing system |
| 04/13/2010 | US7696610 Apparatus for shielding integrated circuit devices |
| 04/13/2010 | US7696015 Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips |
| 04/13/2010 | US7696005 Method for manufacturing an electronic module in an installation base |
| 04/08/2010 | WO2010040121A1 Production process for surface-mounting ceramic led package, surface-mounting ceramic led package produced by said production process, and mold for producing said package |
| 04/08/2010 | WO2010038871A1 Semiconductor device |
| 04/08/2010 | WO2010038454A1 Alignment apparatus and alignment method |
| 04/08/2010 | WO2010037474A2 A semiconductor device comprising an in-chip active heat transfer system |
| 04/08/2010 | US20100084754 Semiconductor package |
| 04/08/2010 | DE202009016620U1 Kompositstruktur für eine polygonale lichtemittierende Diode The composite structure of a polygonal light-emitting diode |
| 04/08/2010 | DE19928075B4 Speichermodul mit Wärmeableiter Memory module with heatsink |
| 04/08/2010 | DE10257707B4 Verfahren zum Herstellen eines gestapelten Chip-Paketes A method of manufacturing a stacked chip package |
| 04/08/2010 | DE10238320B4 Keramische Leiterplatte und Verfahren zu ihrer Herstellung Ceramic printed circuit board and process for its preparation |
| 04/08/2010 | DE102009040176A1 Halbleiter-Bauelement Semiconductor component |
| 04/08/2010 | DE102008049726A1 Halbleiterbauelement mit einem chipinternen aktiven Wärmeübertragungssystem A semiconductor device comprising an on-chip active heat transfer system |
| 04/08/2010 | DE10133869B4 Leuchtvorrichtung, insbesondere ein Scheinwerfer oder Leuchte für Kraftfahrzeuge, mit einer Anordnung von punktförmigen elektrolumineszenten Lichtquellen Illuminating device, in particular a headlight or lamp for motor vehicles, with an arrangement of dot-shaped electroluminescent light sources |
| 04/07/2010 | EP2172971A2 Cooling assembly |
| 04/07/2010 | EP2172702A1 A light-emitting diode lighting device |
| 04/07/2010 | CN201436682U Chip package with inductance element |
| 04/07/2010 | CN101692448A Multi-chip LED centralized-encapsulated radiating structure and encapsulation technology thereof |
| 04/07/2010 | CN101692447A Multi-CCD super field of view image mosaic photoelectric system |
| 04/07/2010 | CN101692446A Organic electro-stimulation luminous element encapsulation and encapsulating method thereof |
| 04/07/2010 | CN101692445A Photovoltaic sun-seeking detector |
| 04/07/2010 | CN101692444A 半导体器件 Semiconductor devices |