Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
05/2010
05/12/2010CN1983593B High-power active thin light-emitting diode
05/12/2010CN1960016B Light emitting diode
05/12/2010CN1941362B Semiconductor power module with excess current protection unit
05/12/2010CN1909363B 半导体功率器件和rf信号放大器 The semiconductor power device and the rf signal amplifier
05/12/2010CN1901186B Device and method for emitting output light using multiple light sources with photoluminescent material
05/12/2010CN1885577B Packaging assembly of SMD light emitting diodes and manufacturing method thereof
05/12/2010CN1841901B Micro electric power converter
05/12/2010CN1652333B High frequency circuit module
05/12/2010CN101707234A LED luminescence module and manufacture method thereof
05/12/2010CN101707197A Omnibearing luminous LED device
05/12/2010CN101179066B Chip embedding bury type packaging structure
05/12/2010CN101170104B Stacking chip encapsulation structure with multi-section bus bar in lead rack
05/12/2010CN101170103B Stacking wafer encapsulation structure with bus rack in lead rack
05/12/2010CN101154656B Multi-chip light emitting diode module group structure and method of producing the same
05/12/2010CN101114637B Semiconductor component packaging structure
05/12/2010CN101030571B Commutating diode device and its production
05/12/2010CN101030570B Semiconductor device
05/12/2010CN101009269B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/11/2010US7716617 Semiconductor device, method for making pattern layout, method for making mask pattern, method for making layout, method for manufacturing photo mask, photo mask, and method for manufacturing semiconductor device
05/11/2010US7714611 Permutable switching network with enhanced multicasting signals routing for interconnection fabric
05/11/2010US7714598 Contact carriers (tiles) for populating larger substrates with spring contacts
05/11/2010US7714447 Semiconductor chip arrangement
05/11/2010US7714446 Single mask via method and device
05/11/2010US7714232 Circuit device and method of manufacturing the same
05/11/2010US7712211 Method for packaging circuits and packaged circuits
05/06/2010WO2010050091A1 Semiconductor device
05/06/2010WO2010050087A1 Layered semiconductor device and manufacturing method therefor
05/06/2010WO2010049604A1 Method for mounting passive components on a portable object having a small thickness, and portable object thus obtained
05/06/2010WO2010049473A1 Connection arrangement for igbt power modules
05/06/2010US20100112760 Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof
05/06/2010US20100110610 Electronic device
05/06/2010US20100109732 Integrated circuit, control method, and use of a circuit for a sleep mode and an operating mode
05/06/2010US20100109164 Stacked integrated circuit package fabrication methods that use vias formed and filled after stacking, and related stacked integrated circuit package structures
05/06/2010US20100109139 Stack package made of chip scale packages
05/06/2010US20100109138 Wafer-level chip-on-chip package, package on package, and methods of manufacturing the same
05/06/2010US20100109096 Semiconductor integrated circuit device
05/06/2010DE102008054288A1 Verfahren zum Herstellen eines flexiblen Leuchtbands A method for manufacturing a flexible light-emitting bands
05/06/2010DE102008043345A1 Leuchtmodul Light module
05/06/2010DE102008008853B4 Schaltungsanordnung mit Bondverbindung Circuitry with bond
05/06/2010DE102004058732B4 Struktur von Plättchen von lichtemittierenden Dioden mit Wechselstrom Platelet structure of light emitting diodes with a voltage
05/05/2010EP2182783A2 Light-emitting module and illuminating apparatus
05/05/2010EP2182557A2 LED light module with silicon substrate
05/05/2010EP2182551A1 Connection arrangement for semiconductor power modules
05/05/2010EP2182550A1 Semiconductor device with screen for electromagnetic shielding
05/05/2010EP1362502B1 Arrangement with an integrated circuit mounted on a bearing means and a power supply module arrangement
05/05/2010CN201450665U Printed circuit board with thermal management and electronic component module thereof
05/05/2010CN201450339U 66kv optically controlled water-cooling thyristor valve group
05/05/2010CN201450022U High-power LED supporting stand capable of mounting voltage-regulator diode
05/05/2010CN201450006U Semi-conductor device of integrated memory chip and control chip
05/05/2010CN201450005U Three-end voltage stabilizer
05/05/2010CN201448655U Light-emitting diode structure
05/05/2010CN1961474B Convertor device
05/05/2010CN1954275B 生产系统 Production System
05/05/2010CN1901178B Relay board and semiconductor device having the relay board
05/05/2010CN1832212B LED component and method for fabricating the same
05/05/2010CN1779970B Optical rotation system for optoelectronic module
05/05/2010CN1735974B Light source module and method for production thereof
05/05/2010CN1705123B Semiconductor device
05/05/2010CN1630080B Multi-die processor
05/05/2010CN1595442B Memory card
05/05/2010CN1507065B Optical transmitter receiver
05/05/2010CN101702424A LED encapsulation structure with functions of integrated light distribution and heat dissipation
05/05/2010CN101073153B Component mounting apparatus and component mounting method
05/04/2010US7710148 Programmable switch circuit and method, method of manufacture, and devices and systems including the same
05/04/2010US7709942 Semiconductor package, including connected upper and lower interconnections
05/04/2010US7709941 Resin-sealed semiconductor device and method of manufacturing the same
05/04/2010US7709939 Metal-base circuit board and its manufacturing method
05/04/2010US7709935 Reversible leadless package and methods of making and using same
05/04/2010US7709728 Multiband semiconductor compositions for photovoltaic devices
05/04/2010US7709727 Circuit arrangement for a photovoltaic system
05/04/2010US7709379 Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof
05/04/2010CA2381081C Dual wafer attachment process
04/2010
04/29/2010WO2010047951A1 Lighting device using solid state light emitting devices having a transparent heat sink
04/29/2010WO2010047798A1 Array layout for color mixing
04/29/2010WO2010047366A1 Power converter and in-car electrical system
04/29/2010WO2010047228A1 Wiring board and method for manufacturing same
04/29/2010WO2010047227A1 Semiconductor device and method for manufacturing same
04/29/2010WO2010047186A1 Electronic circuit and communication function inspection method
04/29/2010WO2010047140A1 Integrated circuit device
04/29/2010WO2010047014A1 Multilayer semiconductor device and electronic device
04/29/2010WO2010047006A1 Semiconductor device and method for manufacturing the same
04/29/2010WO2010046563A1 Assembly of a grooved microelectronic chip with a toroidal wire element and method of assembling it
04/29/2010WO2010046339A1 Illumination apparatus with steps and an led array
04/29/2010US20100103605 multi-configuration processor-memory substrate device
04/29/2010US20100103604 Multi-configuration processor-memory substrate device
04/29/2010US20100102440 High density three dimensional semiconductor die package
04/29/2010US20100102434 Semiconductor memory device having improved voltage transmission path and driving method thereof
04/29/2010US20100102431 Power module and inverter for vehicles
04/29/2010US20100102428 Semiconductor package
04/29/2010US20100102427 Semiconductor packaging device
04/29/2010US20100102329 Light-emitting device having light-emitting elements with a shared electrode
04/29/2010DE112008001410T5 Halbleiterelementkühlstruktur Semiconductor element cooling structure
04/29/2010DE102009042319A1 Sensorknoten-Modul Sensor node module
04/29/2010DE102008036736B4 Elektrisches Installationsschaltgerät mit einer elektronischen Baugruppe Electrical service switching device with an electronic module,
04/28/2010EP2180532A2 Semiconductor light emitting device
04/28/2010EP2180507A2 Lighting Device
04/28/2010EP2180506A1 Light emitting diode device comprising a diode arrangement
04/28/2010CN201444478U Diamond LED module
04/28/2010CN1875481B Semiconductor device and process for fabricating the same
04/28/2010CN1620225B Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus