| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/27/2015 | US8941139 Light-emitting element mounting package, light-emitting element package, and method of manufacturing the same |
| 01/27/2015 | US8941134 Leadframe-based packages for solid state light emitting devices having heat dissipating regions in packaging |
| 01/27/2015 | US8941129 Using an LED die to measure temperature inside silicone that encapsulates an LED array |
| 01/27/2015 | US8940636 Through hole vias at saw streets including protrusions or recesses for interconnection |
| 01/27/2015 | US8940584 Semiconductor packages and methods of forming the same |
| 01/27/2015 | US8940581 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
| 01/27/2015 | US8940557 Method of fabricating wafer level package |
| 01/27/2015 | US8940552 Methods and ophthalmic devices with organic semiconductor layer |
| 01/27/2015 | US8938880 Method of manufacturing an integrated cold plate for electronics |
| 01/22/2015 | WO2015010039A1 Method and system for an immersion boiling heat sink |
| 01/22/2015 | WO2015009801A1 Bonded wafer system and method for bonding and de-bonding thereof |
| 01/22/2015 | WO2015009702A1 Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation |
| 01/22/2015 | WO2015008768A1 Printed circuit board |
| 01/22/2015 | WO2015008476A1 Lighting device |
| 01/22/2015 | WO2015008385A1 Power module |
| 01/22/2015 | WO2015008360A1 Diode device for solar cell module |
| 01/22/2015 | WO2015008333A1 Semiconductor device |
| 01/22/2015 | WO2015007507A1 Power semiconductor module |
| 01/22/2015 | WO2015007424A1 Lighting unit with light-emitting component |
| 01/22/2015 | WO2015006936A1 Multilayer stacking structure of silicon-based led module, and manufacturing method |
| 01/22/2015 | US20150024548 Computer readable medium encoded with a program for fabricating 3d integrated circuit device using interface wafer as permanent carrier |
| 01/22/2015 | US20150024547 EMI Package and Method for Making Same |
| 01/22/2015 | US20150024546 System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack |
| 01/22/2015 | US20150024545 Stacked package structure and method of manufacturing a package-on-package device |
| 01/22/2015 | US20150023570 Finger biometric sensor including stacked die each having a non-rectangular shape and related methods |
| 01/22/2015 | US20150023084 Semiconductor module |
| 01/22/2015 | US20150023081 Power semiconductor module and power conversion device |
| 01/22/2015 | US20150021787 Semiconductor package |
| 01/22/2015 | US20150021786 Bonded Semiconductor Structures |
| 01/22/2015 | US20150021761 Multi-chip package |
| 01/22/2015 | US20150021755 Stacked package and method of manufacturing the same |
| 01/22/2015 | US20150021632 Led with multiple bonding methods on flexible transparent substrate |
| 01/22/2015 | US20150021629 Using An LED Die To Measure Temperature Inside Silicone That Encapsulates An LED Array |
| 01/22/2015 | DE10301091B4 Leistungs-Halbleiterbauelement und Verfahren zur Verbindung von einem gemeinsamen Substratträger zugeordneten Halbleitereinrichtungen Power semiconductor device and process for connecting a common substrate carrier associated semiconductor devices |
| 01/22/2015 | DE102014109571A1 Verfahren zum packaging integrierter schaltungen und ein geformtes substrat mit in eine formmasse eingebetteten nicht funtionalen platzhaltern A method for packaging integrated circuits and a molded substrate with not a molding material embedded space holders funtionalen |
| 01/22/2015 | DE102014109230A1 Infrarot-dämpfende oder blockierende Schicht in optischem Nähesensor Infrared-absorbing or blocking layer in optical proximity sensor |
| 01/22/2015 | DE102013216035B3 Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls The power semiconductor module and method of producing a power semiconductor module |
| 01/22/2015 | DE102013214235A1 Leuchtvorrichtung mit Halbleiterlichtquellen und umlaufendem Damm Lighting device with semiconductor light sources and circulating dam |
| 01/22/2015 | DE102013107722A1 Optoelektronisches Halbleiterbauteil und Verfahren zum Betreiben eines optoelektronischen Halbleiterbauteils An optoelectronic semiconductor device and method of operating an optoelectronic semiconductor component |
| 01/22/2015 | DE102013107613A1 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements Optoelectronic component and process for producing an optoelectronic component |
| 01/22/2015 | DE102007015534B4 Leistungshalbleitermodul The power semiconductor module |
| 01/22/2015 | DE102006009021B4 Halbleiterbauelement mit Elektrodenteil A semiconductor device having electrode part |
| 01/21/2015 | EP2827388A1 Light emitting device and method of manufacturing the same |
| 01/21/2015 | EP2827366A1 Power semiconductor module |
| 01/21/2015 | EP2827364A1 Semiconductor device |
| 01/21/2015 | EP2826668A1 Light device for a motor vehicle |
| 01/21/2015 | CN204118128U 一种表面贴装型led A surface mount led |
| 01/21/2015 | CN204118118U 双头led灯架及用双头led灯架制成的led灯 Double Double led led lighthouse and lighthouse made with led lights |
| 01/21/2015 | CN204118113U 一种内置驱动全角度发光led光源 A built-driven whole point of light led light |
| 01/21/2015 | CN204118112U 半导体发光器件 Semiconductor light emitting device |
| 01/21/2015 | CN204118068U 一种led发光器件 One kind of led light-emitting devices |
| 01/21/2015 | CN204118067U 直接封装于散热器的led芯片封装架构 Led directly encapsulated in the chip package structure of the radiator |
| 01/21/2015 | CN204118066U 基于透明基板的半导体发光器件封装结构 Based semiconductor light-emitting device package structure of a transparent substrate |
| 01/21/2015 | CN204118064U 一种芯片倾斜堆叠的圆片级封装单元 A chip wafer level package inclined stacking unit |
| 01/21/2015 | CN204118063U 一种芯片倾斜堆叠的圆片级封装单元 A chip wafer level package inclined stacking unit |
| 01/21/2015 | CN104303412A 冷却构造体和电力转换装置 Cooling structure and the power conversion means |
| 01/21/2015 | CN104303299A 半导体装置的制造方法及半导体装置 The method of manufacturing a semiconductor device and semiconductor device |
| 01/21/2015 | CN104303298A 白色发光模块 White light-emitting module |
| 01/21/2015 | CN104303297A 电力用半导体模块 Power semiconductor module |
| 01/21/2015 | CN104303289A 电子模块及其制造方法 Electronic module and manufacturing method thereof |
| 01/21/2015 | CN104300071A 一种新型led灯珠 A novel led lamp beads |
| 01/21/2015 | CN104300070A 一种可弯折的led灯丝及其灯泡结构 Led filament bulb and a bendable structure |
| 01/21/2015 | CN104300067A 可挠式led封装 Flexible style led package |
| 01/21/2015 | CN104299964A 一种层叠封装结构及其制备方法 A laminated packaging structure and its preparation method |
| 01/21/2015 | CN102945845B 一种显示屏用的led器件及显示模组 One kind of led display with the device and display module |
| 01/21/2015 | CN102290405B 一种用于模块化多电平电压源换流器的晶闸管压装结构 SCR press-fit structure of a modular multi-level voltage source inverter for the |
| 01/21/2015 | CN102280420B 半导体模块以及半导体装置 The semiconductor module and semiconductor device |
| 01/21/2015 | CN102160177B 半导体装置的制造方法 The method of manufacturing a semiconductor device |
| 01/21/2015 | CN102062912B 光互连装置及其制造方法 Optical interconnection device and manufacturing method |
| 01/20/2015 | US8937392 Semiconductor device |
| 01/20/2015 | US8937371 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV |
| 01/20/2015 | US8937370 Memory device and fabricating method thereof |
| 01/20/2015 | US8937328 Light emitting device and manufacturing method thereof |
| 01/20/2015 | US8937327 Light emitting device having plurality of light emitting cells and method of fabricating the same |
| 01/20/2015 | US8937324 Light-emitting device array with individual cells |
| 01/20/2015 | US8937321 Luminous devices, packages and systems containing the same, and fabricating methods thereof |
| 01/20/2015 | US8937310 Detection method for semiconductor integrated circuit device, and semiconductor integrated circuit device |
| 01/20/2015 | US8937309 Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication |
| 01/20/2015 | US8936957 Light emitting device with planar current block structure |
| 01/20/2015 | US8936953 Light emitting diode thermally enhanced cavity package and method of manufacture |
| 01/20/2015 | US8936405 Multi-channel optical receiver module |
| 01/20/2015 | US8935850 Method of manufacturing printed wiring board |
| 01/15/2015 | WO2015006478A1 Variable-beam light source and related methods |
| 01/15/2015 | WO2015006000A1 Micro light emitting diode device with post |
| 01/15/2015 | WO2015005181A1 Power conversion member |
| 01/15/2015 | WO2015004990A1 Power semiconductor module |
| 01/15/2015 | WO2015004832A1 Power module |
| 01/15/2015 | WO2015003525A1 Method for manufacturing semiconductor display panel |
| 01/15/2015 | US20150016107 Led module having a highly reflective carrier |
| 01/15/2015 | US20150014863 Dam Structure for Enhancing Joint Yield in Bonding Processes |
| 01/15/2015 | US20150014860 Semiconductor chip connecting semiconductor package |
| 01/15/2015 | US20150014837 Image forming apparatus, chip, and chip package |
| 01/15/2015 | US20150014830 Semiconductor device utilzing redistribution layers to couple stacked die |
| 01/15/2015 | US20150014793 Pressure sensor having down-set flag |
| 01/15/2015 | US20150014717 Light emitting diode package |
| 01/15/2015 | US20150014715 White light led module structure including ultraviolet light |
| 01/15/2015 | US20150014714 Light emitting semiconductor |
| 01/15/2015 | US20150014713 Light emitting device and lighting apparatus including the same |
| 01/15/2015 | US20150014708 Package for light emitting and receiving devices |
| 01/15/2015 | US20150014554 Packaging for high power integrated circuits and infrared emitter arrays |