Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
05/2010
05/26/2010CN1565053B Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads
05/26/2010CN1531084B Semiconductor assembly
05/26/2010CN101714823A Power transducer
05/26/2010CN101714545A 半导体装置 Semiconductor device
05/26/2010CN101714544A Integrated triode and manufacturing method thereof
05/26/2010CN101714543A Ceramic substrate for three-dimensional packaging of multi-chip system and packaging method thereof
05/26/2010CN101714542A Circuit device
05/26/2010CN101714541A Semiconductor device and method for manufacturing same
05/26/2010CN101714516A Process for making contact with and housing integrated circuits
05/26/2010CN101714513A Adhesive sheet, semiconductor device, and method for producing the semiconductor device
05/26/2010CN101714512A Method of fabricating semiconductor device having three-dimensional stacked structure
05/26/2010CN101713521A Alternating-current light emitting diode structure
05/26/2010CN101281902B High power LED lighting lamp and radiating module thereof
05/26/2010CN101246878B LED chip packaging structure with ceramic as substrate and its production method
05/26/2010CN101162717B Stacked structures and methods of fabricating stacked structures
05/26/2010CN101154653B 功率半导体模块 Power semiconductor module
05/26/2010CN101120438B Semiconductor device manufacturing method and semiconductor device
05/26/2010CN101091243B Single mask via method and device
05/26/2010CN101057327B IC chip, antenna, and manufacturing method of the ic chip and the antenna
05/26/2010CN101047172B Compact type power semi-conductor module with connecting device
05/26/2010CN101047054B Varistor and light-emitting apparatus
05/25/2010US7724031 Staggered logic array block architecture
05/25/2010US7723846 Power semiconductor module and method of manufacturing the same
05/25/2010US7723838 Package structure having semiconductor device embedded within wiring board
05/25/2010US7723835 Semiconductor device package structure
05/25/2010US7723832 Semiconductor device including semiconductor elements mounted on base plate
05/25/2010US7723733 Roll-to-roll fabricated electronically active device
05/25/2010US7723244 Method for internal electrical insulation of a substrate for a power semiconductor module
05/20/2010WO2010056464A1 Flexible wind deflector for photovoltaic array perimeter assembly
05/20/2010WO2010055614A1 Semiconductor device
05/20/2010WO2010054875A1 Arrangement of at least two wafers with a bonding connection and method for producing such an arrangement
05/20/2010WO2010054622A2 Optoelectronic component
05/20/2010WO2010054478A1 Solid state drive or other storage apparatus that includes a plurality of encapsulated semiconductor chips
05/20/2010US20100123481 Semiconductor integrated circuit
05/20/2010US20100123237 Semiconductor package of multi stack type
05/20/2010US20100123236 Semiconductor package having adhesive layer and method of manufacturing the same
05/20/2010DE112008001023T5 Leistungs-Halbleitermodul Power semiconductor module
05/20/2010DE102009046549A1 Semiconductor device e.g. acceleration sensor, for vehicle, has semiconductor chip with trench present within connecting edge if bump edge present at edge section of contact surface of contact area and bump is defined as connecting edge
05/20/2010DE102009025564A1 Beleuchtungsanordnung mit einem LED-Array Lighting arrangement with an LED array
05/20/2010DE102008057347A1 Optoelektronische Vorrichtung Optoelectronic device
05/20/2010DE102008057140A1 Optoelektronisches Bauelement Optoelectronic component
05/20/2010DE102004016416B4 Fahrzeugscheinwerfer und Halbleiterlichtemissionselement Vehicle headlights and semiconductor light emitting element
05/19/2010EP2187438A1 Interposer and manufacturing method of the interposer
05/19/2010EP2186135A1 Packaged integrated circuit devices with through- body conductive vias, and methods of making same
05/19/2010EP2186134A2 Reconstituted wafer stack packaging with after-applied pad extensions
05/19/2010EP2186131A2 Stack packages using reconstituted wafers
05/19/2010CN201478310U Solar battery assembly
05/19/2010CN201478309U Light emitting diode modified structure
05/19/2010CN201478308U Miniature encapsulated half-controlled bridge wall device
05/19/2010CN201478307U Flat type packaged double-gate field effect transistor
05/19/2010CN201478306U Flat type packaged double-gate field effect transistor
05/19/2010CN201478305U Flat type packaged dual insulated-gate bipolar transistor device
05/19/2010CN201478304U Flat type packaged dual insulated-gate bipolar transistor
05/19/2010CN201478303U Anti-parallel double diode
05/19/2010CN201478302U Encapsulation structure of luminous element
05/19/2010CN1971905B Power semiconductor module with coupling element
05/19/2010CN101711430A assemblage of radiofrequency chips
05/19/2010CN101710583A Integrated circuit with built-in electrical inductor
05/19/2010CN101313404B Apparatus and methods for solar energy conversion using nanoscale cometal structures
05/19/2010CN101297606B Lighting structure comprising at least one light-emitting diode, method for making same and uses thereof
05/19/2010CN101246876B LED lamp and method for acquiring the same
05/19/2010CN101236959B Encapsulation structure for multi-chip interleaving stack
05/19/2010CN101228627B Electronic module assembly with heat spreader, portable electronic communication device and printed circuit board
05/19/2010CN101223644B 半导体装置 Semiconductor device
05/19/2010CN101217249B Detachable transducer of comparatively better efficiency
05/19/2010CN101207169B Luminous chip encapsulation body and light source component
05/19/2010CN101207110B Light emitting diode module
05/19/2010CN101207102B High-power diode supporting structure and encapsulation combination
05/19/2010CN101147249B 电子部件安装方法和电子电路装置 Electronic component mounting method and an electronic circuit device
05/19/2010CN101142678B Module board
05/19/2010CN101120446B Semiconductor module and device
05/19/2010CN101107710B Semiconductor device and its manufacturing method
05/18/2010US7719851 Electronics module and method for manufacturing the same
05/18/2010US7719850 Arrangement with an integrated circuit mounted on a bearing means and a power supply module arrangement
05/18/2010US7719105 High speed electrical interconnects and method of manufacturing thereof
05/18/2010US7719102 Semiconductor device
05/18/2010US7719023 Light emitting device
05/18/2010US7718888 Solar cell having polymer heterojunction contacts
05/18/2010US7718025 Method of forming folded-stack packaged device using progressive folding tool
05/18/2010CA2313611C Semiconductor device
05/14/2010WO2010054209A1 A method for manufacture and structure of multiple electrochemistries and energy gathering components within a unified structure
05/14/2010WO2010053038A1 Mounting-type electronic circuit module
05/14/2010WO2010035269A3 Integrated solar powered device
05/14/2010WO2010025694A3 Optoelectronic component
05/13/2010US20100118502 Printed circuit board
05/13/2010US20100117451 Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
05/13/2010US20100117212 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
05/13/2010US20100117211 Integrated circuit package
05/13/2010US20100117056 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
05/12/2010EP2183779A2 Semiconductor component and method for producing a semiconductor component
05/12/2010DE102008054235A1 Optoelectronic component for optoelectronic unit for cycle stable connection with circuit carrier, has carrier with base, where base is made up of plastic material and through contacts are arranged in base
05/12/2010DE102007002961B4 Speichervorrichtung und Verfahren zu deren Herstellung Storage device and process for their preparation
05/12/2010CN201466961U rectifier
05/12/2010CN201466062U Integrated fine-pitch pin LED drive circuit packaging structure
05/12/2010CN201466026U Power module with direct bonding power terminal
05/12/2010CN201466025U Air-cooled silicon-controlled valve string structure
05/12/2010CN201466024U Light-emitting diode electrode holder with platform
05/12/2010CN201466023U Photoelectricity-thermoelectricity compound type solar cell
05/12/2010CN201452597U Solar cold and warm water cup
05/12/2010CN1996592B Encapsulation of the image sensing and detecting apparatus
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