Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
06/2010
06/09/2010CN101015056B Integrated transistor module and method of fabricating same
06/08/2010US7735046 E-fuse and method
06/08/2010US7733125 Programmable logic device with embedded switch fabric
06/08/2010US7732929 Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same
06/08/2010US7732906 Semiconductor device
06/08/2010US7732904 Multi-surface contact IC packaging structures and assemblies
06/08/2010US7732254 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
06/03/2010WO2010060420A1 Optoelectronic lamp
06/03/2010WO2010060417A1 Light diode module and light diode component
06/03/2010WO2010060404A1 Radiation-emitting semiconductor chip
06/03/2010US20100136726 Led array
06/03/2010US20100133677 Semiconductor chip stacked body and method of manufacturing the same
06/03/2010US20100133676 A power semiconductor arrangement and a semiconductor valve provided therewith
06/03/2010US20100133664 Module and mounted structure using the same
06/03/2010US20100133589 Analog circuit cell array and analog integrated circuit
06/03/2010US20100133558 Flip chip type led lighting device manufacturing method
06/02/2010EP2192613A1 Semiconductor device and its fabrication method
06/02/2010EP2192612A2 Method for stacking and interconnecting integrated circuits
06/02/2010EP2192420A1 Optical send and receive component and sensor with such
06/02/2010EP2191507A2 Stacked microelectronic devices and methods for manufaturing staked microelectronic devices
06/02/2010DE102009051627A1 Mehrschichtverstärkermodul Multilayer amplifier module
06/02/2010DE102008059552A1 Leuchtdiodenmodul und Leuchtdiodenbauteil LEDs and LED module component
06/02/2010DE102006012645B4 Verfahren zum Verpacken von integrierten Schaltungen auf Waferniveau, zusammengesetzter Wafer und Packung auf Waferniveau A method of packaging integrated circuits at the wafer level, composite wafer, and wafer-level package
06/02/2010CN201499085U Minitype encapsulation power factor corrector
06/02/2010CN201498529U Light emitting diode
06/02/2010CN201498515U Flat package type bridge arm component with bidirectional thyristor
06/02/2010CN201498514U Full-range light-emitting LED device
06/02/2010CN201496833U LED lighting source of projector
06/02/2010CN101719719A Novel thyristor converter valve module
06/02/2010CN101719492A Encapsulating structure of light-emitting diode (LED) and encapsulating method thereof
06/02/2010CN101719491A Structure and method for encapsulating light-emitting diode
06/02/2010CN101719490A Multifunctional LED encapsulating structure
06/02/2010CN101452927B A self-cooling type thyratron transistor valve
06/02/2010CN101431066B Semiconductor packaging stack combination construction with movable outer terminal
06/02/2010CN101393948B Front-back enclosing type LED encapsulation construction and encapsulation method
06/02/2010CN101359661B High effective packaging structure of multi-chip dc-dc reduced power converter
06/02/2010CN101350346B Light emitting device and method of manufacturing the same
06/02/2010CN101345237B Embedded tenon type packaging structure and manufacturing method thereof
06/02/2010CN101330075B Stereo encapsulation structure
06/02/2010CN101315927B High power LED phase transition heat sink structure
06/02/2010CN101312162B Method for manufacturing semiconductor device
06/02/2010CN101308838B Flip LED integrated chip with high break-over voltage and production method
06/02/2010CN101299427B Luminescence module
06/02/2010CN101290931B Self-cooled thyristor valve of high power and mounting vehicle
06/02/2010CN101281875B Sstack type encapsulation structure as well as manufacturing method thereof
06/02/2010CN101281874B Encapsulation structure as well as manufacturing method thereof
06/02/2010CN101232783B Printed circuit board productttion mthod
06/02/2010CN101232012B Stack type semiconductor packaging structure
06/02/2010CN101232010B Thick film mixed circuit device
06/02/2010CN101231196B Temperature detection method of semiconductor device and power conversion apparatus
06/02/2010CN101217251B A monocycle feedforward switch control circuit
06/02/2010CN101207117B System grade encapsulation body and fabrication methods thereof
06/02/2010CN101207115B Semiconductor integrated circuit
06/02/2010CN101202272B Sealing structure for MEMS devices and method of the same
06/02/2010CN101183677B Packaging structure and method for manufacturing the packaging structure
06/02/2010CN101174619B Power semiconductor device
06/02/2010CN101170106B Laminate chip packages and its manufacture method and system
06/02/2010CN101150123B Semiconductor encapsulation structure with electromagnetic shielding cover
06/02/2010CN101110374B Module and method of manufacturing the same
06/01/2010US7728626 Memory utilizing oxide nanolaminates
06/01/2010US7728625 Serial interface for programmable logic devices
06/01/2010US7728624 Circuit architecture for an integrated circuit
06/01/2010US7727804 Method and apparatus for fabricating self-assembling microstructures
06/01/2010US7727803 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device
06/01/2010US7727799 Integrated circuit package
05/2010
05/27/2010WO2010058646A1 Semiconductor package and method for manufacturing same
05/27/2010WO2010058503A1 Semiconductor device and method of manufacturing same
05/27/2010WO2010057808A1 Semiconductor device having stacked components
05/27/2010WO2010057682A1 Ready-to-connect led module body
05/27/2010WO2010057339A1 Semiconductor chip with through-silicon-via and sidewall pad
05/27/2010US20100127768 Semiconductor device and electronic instrument
05/27/2010US20100127402 Interconnect System without Through-Holes
05/27/2010US20100127383 Power semiconductor module
05/27/2010US20100127374 Multi-stack semiconductor package, semiconductor module and electronic signal processing system including thereof
05/27/2010DE202009017816U1 Leistungshalbleitermodul The power semiconductor module
05/27/2010DE202009016875U1 Lichtemitteranordnung für einstellbare optische Leistungsabstrahlung und Wellenlängenverteilung Light emitter array for adjustable optical power radiation and wavelength distribution
05/27/2010DE102009044967A1 System auf einem Chip mit HF-Abschirmung auf dem Chip System on a chip with RF shield on the chip
05/27/2010DE102009040557A1 Bauelement mit zwei Montageoberflächen Component with two mounting surfaces
05/27/2010DE102008058482A1 Waferseitiges heterogenes Massen-Packaging von optischen Zwischenverbindungen Wafer-page heterogeneous mass packaging of optical interconnects
05/27/2010DE102008057832A1 Leistungshalbleitermodul mit vorgespannter Hilfskontaktfeder Power semiconductor module with auxiliary pre-stressed contact spring
05/26/2010EP2190016A1 Semiconductor module with control functionality and integrated transformer
05/26/2010EP2190015A1 Power semiconductor chip, power semiconductor module, inverter device, and inverter-integrated type motor
05/26/2010EP2188839A1 Electrical device and drive
05/26/2010EP1761964B1 Chip with a power supply device
05/26/2010CN201490227U Package structure of light emitting diode
05/26/2010CN201490226U Package structure of light emitting diode
05/26/2010CN201490192U Light emitting diode module
05/26/2010CN201490191U Improved 3528RGB three-in-one LED sealing structure for LED electronic display screen
05/26/2010CN201490190U Control module for semiconductor device
05/26/2010CN201490184U Integrated circuit chip with microfluid cooling channel and encapsulating structure thereof
05/26/2010CN201487679U LED color temperature variable milky white cavity lamp
05/26/2010CN201487634U Luminous structure capable of generating annular light source
05/26/2010CN201487611U Lamp adopting LED lamp core
05/26/2010CN201487608U LED unit, LED module and an LED display device
05/26/2010CN1983590B High luminance light emitting diode and liquid crystal display using the same
05/26/2010CN1953639B A wiring structure and method to reduce the far-end cross talk between parallel signal circuits
05/26/2010CN1949506B Hybrid module and its manufacturing process
05/26/2010CN1855477B Circuit device
05/26/2010CN1835056B Electrical appliance
05/26/2010CN1706051B Optoelectronic hybrid integrated module and light input/output apparatus having the same as component
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