Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
06/2010
06/16/2010CN101740558A Light-emitting element head, light-emitting element chip, image forming apparatus and signal supply method
06/16/2010CN101740557A Vertical-type alternative-current light emitting diode
06/16/2010CN101740556A Hybrid microwave integrated circuit
06/16/2010CN101740555A Ultrahigh pressure pulse silicon rectifier stack
06/16/2010CN101740554A Power semiconductor module with control function and integrated converter
06/16/2010CN101740553A cooling channels in 3dic stacks
06/16/2010CN101740552A Multi-chip packaging structure and manufacturing method thereof
06/16/2010CN101740551A Laminated die package structure for semiconductor element and method thereof
06/16/2010CN101740550A Shielded electronic components and method of manufacturing the same
06/16/2010CN101740530A 集成电路基底 IC substrate
06/16/2010CN101740528A Radiating-enhanced outer pin-free semiconductor packaging structure and combination thereof
06/16/2010CN101740421A Wafer and manufacturing method, system-level package structure and package method thereof
06/16/2010CN101740417A Method for producing stackable dies
06/16/2010CN101740415A Integrated circuit structure and method of forming the same
06/16/2010CN101737662A Method for manufacturing integrated packaged high-power LED illuminating light source, and LED illuminating lamp
06/16/2010CN101414651B Luminous diode component for apparatus stacked by high refractive index nanometer particles and manufacturing method thereof
06/16/2010CN101330077B Stacked semiconductor package and method for manufacturing the same
06/16/2010CN101330076B Through silicon channel chip stack package
06/16/2010CN101320727B Light emitting device and camera-equipped cellular phone incorporating the same
06/16/2010CN101281904B Semiconductor module for inverter circuit
06/16/2010CN101266965B Overlapping structure for semiconductor encapsulation body and its making method
06/16/2010CN101261982B LED encapsulation structure and its making method
06/16/2010CN101257008B Semiconductor device
06/16/2010CN101246945B Edge transmitting type LED packaging structure
06/16/2010CN101241903B Semiconductor device having wiring board
06/16/2010CN101150121B Flexible circuits having improved reliability and thermal dissipation
06/16/2010CN101124674B Electronic component module
06/16/2010CN101114623B Packaging module and electronic device
06/16/2010CN101106125B Composite assembly that incorporates multiple devices that use different wavelengths of light and method for making the composite assembly
06/16/2010CN101060116B LDD package
06/16/2010CN101017812B Communication semiconductor chip, calibration method, and equipment
06/15/2010US7737726 Hybrid resistor/FET-logic demultiplexer architecture design for hybrid CMOS/nanodevice circuits
06/15/2010US7737724 Universal digital block interconnection and channel routing
06/15/2010US7737543 Semiconductor device and method of manufacturing the same
06/15/2010US7737473 Integrated circuit device and method for forming the same
06/15/2010US7737369 Semiconductor module
06/15/2010US7737356 Solar cell device
06/15/2010US7737355 Electrical junction and joint box for a solar cell module
06/10/2010WO2010065388A1 Device, system, and method for managing an application of power from photovoltaic arrays
06/10/2010WO2010037474A3 A semiconductor device comprising an in-chip active heat transfer system
06/10/2010US20100141621 Semiconductor device
06/10/2010US20100141229 Semiconductor Device
06/10/2010US20100140810 Chip package with coplanarity controlling feature
06/10/2010US20100140776 Triaxial through-chip connecton
06/10/2010US20100140774 Method of producing external pads on a semiconductor device, and semiconductor device
06/10/2010US20100140736 Semiconductor Device and Method of Embedding Integrated Passive Devices into the Package Electrically Interconnected Using Conductive Pillars
06/09/2010EP2194769A2 Semiconductor module with pre-tensioned auxiliary contact spring
06/09/2010EP2194590A2 Light emitting device and display
06/09/2010EP2194588A2 Light emitting device and method for manufacturing same
06/09/2010EP2194577A1 Power semiconductor module
06/09/2010EP2194576A1 Laminated mounting structure and method for manufacturing laminated mounting structure
06/09/2010EP2194488A1 Data carrier with electric destruction device
06/09/2010EP2193551A1 Arrangement comprising an optoelectronic component
06/09/2010EP2193539A1 Carrier chip with cavity
06/09/2010CN201503871U High power LED structure with rapid heat dissipation
06/09/2010CN201503870U LED heat dissipation base
06/09/2010CN201503861U Light-emitting diode packaging structure capable of lightening light source in areas
06/09/2010CN1825637B Light source apparatus and manufacture method thereof
06/09/2010CN1739202B Light emitting device
06/09/2010CN101728475A Optoelectronic component
06/09/2010CN101728467A Light-emitting device, backlight module and LCD
06/09/2010CN101728466A High-power LED ceramic packaging structure and manufacturing method thereof
06/09/2010CN101728379A Package for a saw blade or similar product
06/09/2010CN101728378A Organic light emitting diode display device and manufacturing method thereof
06/09/2010CN101728377A High speed magnetic electricity isolating signal coupling device compatible with photoelectric coupler
06/09/2010CN101728376A Top emission type organic electroluminescent device and method of fabricating the same
06/09/2010CN101728375A Packaging structure for interdigital back electrode monocrystalline silicon solar cell in condensation application
06/09/2010CN101728374A Dual panel type organic electroluminescent display device and method of fabricating the same
06/09/2010CN101728373A Thermoelectric module package and manufacturing method therefor
06/09/2010CN101728372A Semiconductor device including semiconductor chip mounted on lead frame
06/09/2010CN101728371A Integrated circuit structure
06/09/2010CN101728370A Encapsulation modular structure of compound semiconductor elements and manufacturing method thereof
06/09/2010CN101728369A Method for packing surface-mountable integrated circuit
06/09/2010CN101728368A Semiconductor assembly packaging structure with a plurality of grains and packaging method thereof
06/09/2010CN101728367A Image sensing module for reducing whole thickness and preventing electromagnetic interference
06/09/2010CN101728366A Encapsulating module of photoelectric element and manufacturing method thereof
06/09/2010CN101728364A 芯片封装体及制作方法 Chip package and method of making
06/09/2010CN101728353A Packaging structure and method for shroud plate
06/09/2010CN101728280A Encapsulation structure of light-emitting diode and preparation method thereof
06/09/2010CN101471330B Semiconductor encapsulation structure
06/09/2010CN101388385B Semiconductor device
06/09/2010CN101378086B Solar cell receiver having an insulated bypass diode
06/09/2010CN101369560B Packed electronic element
06/09/2010CN101355040B Stacking structure for multiple chips and manufacturing method thereof
06/09/2010CN101330078B High on-state voltage LED integrated chip with electrostatic protection and manufacturing method thereof
06/09/2010CN101330067B Self-aligning wafer or chip structure and self-aligning stacking structure and manufacturing method thereof
06/09/2010CN101325193B Encapsulation body of LED
06/09/2010CN101277388B Solid-state imaging device and electronic device including same
06/09/2010CN101271885B Image sensor encapsulation and image taking device using the same
06/09/2010CN101257011B Low profile flip chip power module and method of making
06/09/2010CN101232777B Printed circuit board
06/09/2010CN101232775B Printed circuit board and method for producing the printed circuit board
06/09/2010CN101202299B Organic light emitting diode display device and method of manufacturing the same
06/09/2010CN101197361B Power module and method of manufacturing the same
06/09/2010CN101183675B Method and system for wafer-stage package of chip having a number of pieces
06/09/2010CN101123247B LED encapsulation structure
06/09/2010CN101118901B Stack type chip packaging structure and manufacture process
06/09/2010CN101083256B Semiconductor device
06/09/2010CN101064289B Power inverter
06/09/2010CN101048868B Method for manufacturing semiconductor device having three-dimensional multilayer structure
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