Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
06/2010
06/24/2010DE102008064073A1 Verfahren zur Herstellung einer Mehrzahl von LED-Beleuchtungsvorrichtungen und LED-Beleuchtungsvorrichtung A method of manufacturing a plurality of LED illumination devices and LED lighting device
06/24/2010DE102008059468A1 Optoelektronische Lampe Optoelectronic lamp
06/23/2010EP2198456A2 Integrated circuit stack and its thermal management
06/23/2010CN201514956U LED encapsulation structure with concave cup
06/23/2010CN201514954U Encapsulation of semiconductor light-emitting diode with roughing surface
06/23/2010CN201514944U LED with internal fixedly welding structure
06/23/2010CN201514943U Silicon stack with structural improvement
06/23/2010CN201514942U Combination device of combined thermally-conductive circuit board and heat-generating power diode
06/23/2010CN201514941U Hybrid integrated circuit with controllable working temperature
06/23/2010CN201514938U 封装载体 Package Carrier
06/23/2010CN1993826B LED light system
06/23/2010CN1619812B Stacked semiconductor device
06/23/2010CN1568546B Semiconductor device and method of manufacturing the same
06/23/2010CN101755337A 半导体模块 Semiconductor Modules
06/23/2010CN101755336A Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
06/23/2010CN101755335A Device having electronic component mounted therein and method for manufacturing such device
06/23/2010CN101755329A Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device
06/23/2010CN101752489A Electronic component mounting module and electrical apparatus
06/23/2010CN101752359A Light emitting diode with radiating assembly and light emitting diode lamp
06/23/2010CN101752358A Compact semiconductor package with integrated bypass capacitor and method
06/23/2010CN101752357A Leadless package housing
06/23/2010CN101752356A Cooling apparatus for semiconductor chips
06/23/2010CN101752355A Light-emitting device
06/23/2010CN101752354A Packaging substrate structure for LED and production method thereof
06/23/2010CN101752353A Packaging structure of multi-chip semiconductor
06/23/2010CN101752352A Light emitting diode package and production method thereof
06/23/2010CN101752351A Programmable array module
06/23/2010CN101752329A Top-side cooled semiconductor package with stacked interconnection plates and method
06/23/2010CN101752324A Mounting structure
06/23/2010CN101752277A System-in-a-package method and structure thereof
06/23/2010CN101752275A Packaging method and packaging structure of light emitting diode (LED) module
06/23/2010CN101752269A Integrated circuit structure and its forming method
06/23/2010CN101752246A Semiconductor wafer, semiconductor chip, and method and apparatus for processing wafer
06/23/2010CN101751829A Ultra-thin light-emitting diode (LED) display
06/23/2010CN101452918B Carrier plate module having built-in phase lock loop, integration type system, and manufacturing method thereof
06/23/2010CN101414604B Light-emitting diode
06/23/2010CN101371358B Package for a light emitting diode with integrated electrostatic discharge protection
06/23/2010CN101364586B Construction for packaging substrate
06/23/2010CN101305463B Microstrip spacer for stacked chip scale packages, methods of making same, methods of operating same, and systems containing same
06/23/2010CN101295693B 半导体器件 Semiconductor devices
06/23/2010CN101290927B Circuit arrangement having a free-wheel diode
06/23/2010CN101236963B Semiconductor device and packaging structure therefor
06/23/2010CN101211904B Bidirectional switch module
06/23/2010CN101211899B Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same
06/23/2010CN101197355B Electronic device and method for producing the same, LBD display unit and method for producing the same
06/23/2010CN101151741B Flexible led array
06/23/2010CN101114638B Stack type semiconductor packaging structure containing flexible circuit board
06/22/2010US7742313 Stacked microfeature devices
06/22/2010US7741710 Module with multiple power amplifiers and power sensors
06/22/2010US7741155 Method of manufacturing semiconducting device with stacked dice
06/22/2010CA2540122C Electric toothbrush comprising an electrically powered element
06/17/2010WO2010068785A1 Parallel plane memory and processor coupling in a 3-d micro-architectural system
06/17/2010WO2010068490A1 Die-to-die power consumption optimization
06/17/2010WO2010066482A1 Power converter module having a cooled busbar
06/17/2010WO2007127712A3 Light emitting diodes with improved light collimation
06/17/2010US20100148859 Methods for Manufacturing RFID Tags and Structures Formed Therefrom
06/17/2010US20100148372 Integrated circuit package having reduced interconnects
06/17/2010US20100148349 Semiconductor Package Having Support Chip And Fabrication Method Thereof
06/17/2010US20100148342 Stacked semiconductor module
06/17/2010US20100148341 Semiconductor device and method for manufacturing the same
06/17/2010US20100148336 Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereof
06/17/2010US20100148335 Semiconductor package, method of manufacturing same, semiconductor device and electronic device
06/17/2010US20100148334 Intergrated circuit package support system
06/17/2010US20100148331 Semiconductor devices including semiconductor dice in laterally offset stacked arrangement
06/17/2010US20100148172 Semiconductor device
06/17/2010US20100146780 Method for packaging circuits and packaged circuits
06/17/2010DE202009000236U1 Gehäustes LED-Modul A housed LED module
06/17/2010DE102008054735A1 Leadless-Gehäusepackung Leadless package housing
06/17/2010DE102008054575A1 Electronic module has crystalline semiconductor substrate with integrated circuit and discrete component is electrically connected with integrated circuit
06/16/2010EP2197054A2 Light emitting device and display
06/16/2010EP2197045A1 Light emitting device
06/16/2010EP2195843A1 Programmable rom using two bonded strata and method of operation
06/16/2010EP2195842A1 Multi-chip systems with optical bypass
06/16/2010EP2195841A2 Memory device interface methods, apparatus, and systems
06/16/2010EP2195840A1 Interconnect in a multi-element package
06/16/2010EP2195832A1 Method for the production and contacting of electronic components by means of a substrate plate, particularly a dcb ceramic substrate plate
06/16/2010EP2195831A2 Semiconductor assemblies and methods of manufacturing such assemblies
06/16/2010EP2008303B1 Elastically deformable integrated-circuit device
06/16/2010EP1548850B1 White light emitting device
06/16/2010CN201508854U high-power led bracket
06/16/2010CN201508853U Semiconductor bearing structure
06/16/2010CN201508837U Vehicle rectifier diode
06/16/2010CN201508836U Power module with control terminal led out through spring
06/16/2010CN201508835U Novel insulated gate bipolar transistor module with direct copper-clad base plate
06/16/2010CN201508834U Double flat pin-free encapsulating part
06/16/2010CN201508833U Base plate for an insulation gate bipolar transistor module
06/16/2010CN1998092B Photoelectric conversion element array, its integrated device, their packaging structure, and optical information processor
06/16/2010CN1998077B Semiconductor device manufacturing method and semiconductor device
06/16/2010CN1921106B Opto-electronic package, and methods and systems for making and using same
06/16/2010CN1917142B Semiconductor device manufacturing apparatus
06/16/2010CN1913151B Light-emitting diode module for flash and auto-focus application
06/16/2010CN1853451B Method for manufacturing an electronic module
06/16/2010CN1685508B Electronic module having canopy-type carriers
06/16/2010CN1555064B Nonvolatile semiconductor memory device
06/16/2010CN101740688A Packaging body of light source
06/16/2010CN101740678A Solid state light-emitting element and light source module
06/16/2010CN101740675A Circuit board of light-emitting diode
06/16/2010CN101740561A Organic electroluminescent display device and method and apparatus of manufacturing the same
06/16/2010CN101740560A Light-emitting apparatus, backlight apparatus, and display apparatus
06/16/2010CN101740559A White-light emitting diode
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