Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
07/2010
07/07/2010EP1512176B1 Die connected with integrated circuit component
07/07/2010CN201523329U Direct-plug type double diode small current rectification module
07/07/2010CN201523010U High-voltage high-power series thyristor self-cooling heat pipe radiator panel
07/07/2010CN201523009U Lead frame
07/07/2010CN201523008U Semiconductor multichip packaging and stacking structure
07/07/2010CN201523006U Electrical component packaging structure and circuit board thereof
07/07/2010CN201521834U Three-in-one full-color piranha LED lamp
07/07/2010CN1622326B Offset-bonded, multi-chip semiconductor device
07/07/2010CN101772841A Packaged integrated circuit devices with through-body conductive vias, and methods of making same
07/07/2010CN101771127A LED light-emitting module with liquid metal heat dispersion heat sink
07/07/2010CN101771031A Photoelectric element-packaging structure with electrostatic protection function
07/07/2010CN101771030A Light-emitting module with high heat conduction and light guide functions and devices applying same
07/07/2010CN101771029A Light-emitting module with high heat conduction and light guide functions and devices applying same
07/07/2010CN101771028A White-light LED chip and manufacturing method thereof
07/07/2010CN101771027A High-power LED module assembly and manufacturing method thereof
07/07/2010CN101771026A Multi-die building block for stacked-die package
07/07/2010CN101771025A Light emitting diode
07/07/2010CN101771024A Light-emitting diode (LED) and packaging method thereof
07/07/2010CN101771019A Dies, stacked structures, and systems
07/07/2010CN101771011A 半导体装置 Semiconductor device
07/07/2010CN101770995A Chip module structure assembly
07/07/2010CN101770993A Leadless packaging structure of semiconductor device
07/07/2010CN101770959A Rigid-flex module and manufacturing method
07/07/2010CN101770958A Protective thin film coating in chip packaging
07/07/2010CN101499468B LED device
07/07/2010CN101425513B Light emitting module having heat radiation function, reflection cover and assembling method thereof
07/07/2010CN101339972B Backlight module and LED thereof
07/07/2010CN101080120B Lighting device and its making method
07/06/2010US7750676 Embedded system and control method therefor
07/06/2010US7750674 Low-power transceiver architectures for programmable logic integrated circuit devices
07/06/2010US7750461 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
07/06/2010US7750300 Thermo-optic system employing self reference
07/06/2010US7750233 Thin film solar cell and manufacturing method thereof
07/06/2010US7750232 electrical resistance; short circuit current density and conversion efficiency; photoelectric cells
07/06/2010US7749807 Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies
07/06/2010US7749795 Solar cell and method and apparatus for manufacturing solar cell
07/06/2010US7748070 Electric toothbrush comprising an electrically powered element
07/01/2010WO2010075331A1 Embedded through silicon stack 3-d die in a package substrate
07/01/2010WO2010073520A1 Solid-state imaging device and manufacturing method therefor
07/01/2010WO2009148543A3 Light source with near field mixing
07/01/2010US20100164614 Structure and System of Mixing Poly Pitch Cell Design under Default Poly Pitch Design Rules
07/01/2010US20100164613 Semiconductor device reducing leakage current of transistor
07/01/2010US20100164547 Base cell for engineering change order (eco) implementation
07/01/2010US20100164124 Method and apparatus for multi-chip packaging
07/01/2010US20100164094 Multi-Chip Package Memory Device
07/01/2010US20100164091 System-in-package packaging for minimizing bond wire contamination and yield loss
07/01/2010US20100164087 Semiconductor device having a stacked chip structure
07/01/2010US20100164086 Semiconductor device and manufacturing method thereof
07/01/2010US20100164084 Semiconductor device and semiconductor package including the same
07/01/2010US20100163913 Lamp and method of producing a lamp
07/01/2010DE102009055882A1 Leistungshalbleitervorrichtung Power semiconductor device
07/01/2010DE102009051342A1 Mikroelektronisches Gehäuse und Verfahren zum Anordnen in einem Gehäuse Microelectronic package and method for arranging in a housing
07/01/2010DE102009050744A1 Halbleitervorrichtung und Herstellungsverfahren A semiconductor device and manufacturing method
07/01/2010DE102009048856A1 Halbleiter-Leuchtvorrichtung und Verfahren zur Herstellung einer solchen Semiconductor light-emitting device and method for producing such
07/01/2010DE102009047202A1 Detektor Detector
07/01/2010DE102009044712A1 Halbleiter-Bauelement Semiconductor component
07/01/2010DE102008063863A1 Elektronisches Bauteil mit aufgenommenem elektronischen Bauelement Electronic component with ingested electronic component
07/01/2010DE102008059214A1 Information display e.g. street sign, for representing e.g. number, has non-transparent electrode comprising light elements, which are laterally distributed, so that elements are formed as background of pattern with solar cell
07/01/2010DE102008057832B4 Leistungshalbleitermodul mit vorgespannter Hilfskontaktfeder Power semiconductor module with auxiliary pre-stressed contact spring
07/01/2010DE102008054932A1 Power semiconductor module has base plate, which has assembly surface facing module interior, where power semiconductor circuit is provided with power semiconductor chip on assembly surface
07/01/2010DE102008054923A1 Power semiconductor module, has circuit carrier provided with power semiconductor chip that is arranged in housing, and capacitor with body integrated into sidewall of housing, where circuit carrier is designed as ceramic plate
07/01/2010DE102007034252B4 Modul und Verfahren zu seiner Herstellung Module and method for its preparation
07/01/2010DE102004042186B4 Optoelektronisches Bauelement Optoelectronic component
07/01/2010DE10026460B4 Anschlussverfahren für Leuchtdioden Connection method for LEDs
06/2010
06/30/2010EP2202793A2 Semiconductor device
06/30/2010EP2202792A2 Semiconductor device
06/30/2010EP2202789A1 Stack of molded integrated circuit dies with side surface contact tracks
06/30/2010EP2201602A1 Alignment features for proximity communication
06/30/2010EP2201599A2 Reconfigurable connections for stacked semiconductor devices
06/30/2010CN201518318U White light LED
06/30/2010CN201518316U Electronic module and encapsulation structure thereof
06/30/2010CN101765964A Power conversion device and method for manufacturing the same
06/30/2010CN101764129A Power module without solder terminal
06/30/2010CN101764128A Inductor in semiconductor device packaging structure
06/30/2010CN101764127A Semiconductor package without outer pins and stacked structure thereof
06/30/2010CN101764126A Multi-chip semiconductor package structure without outer leads and lead frame thereof
06/30/2010CN101764117A Line structure of packaging carrier plate and multi-chip packaging body
06/30/2010CN101764073A Manufacturing process for a quad flat non-leaded chip package structure
06/30/2010CN101764072A Manufacturing process for a quad flat non-leaded chip package structure
06/30/2010CN101764066A Manufacturing process for a quad flat non-leaded chip package structure
06/29/2010US7745952 Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink
06/29/2010US7745943 Microelectonic packages and methods therefor
06/29/2010US7745919 Semiconductor device including a plurality of semiconductor chips and a plurality of through-line groups
06/29/2010US7745795 Radiation detector, radiation detector element, and radiation imaging apparatus
06/29/2010US7745722 System for mounting a solar module on a roof or the like and method of installing
06/29/2010US7745257 High power MCM package with improved planarity and heat dissipation
06/24/2010WO2010069399A1 A voltage source converter
06/24/2010US20100157555 Process to Allow Electrical and Mechanical Connection of an Electrical Device with a Face Equipped with Contact Pads
06/24/2010US20100155929 Chip-Stacked Package Structure
06/24/2010US20100155922 Semiconductor Device and Method of Forming Recessed Conductive Vias in Saw Streets
06/24/2010US20100155921 Semiconductor apparatus
06/24/2010US20100155920 Stacked semiconductor package, semiconductor package module and method of manufacturing the stacked semiconductor package
06/24/2010US20100155919 High-density multifunctional PoP-type multi-chip package structure
06/24/2010US20100155912 Apparatus for shielding integrated circuit devices
06/24/2010US20100155855 Band Edge Engineered Vt Offset Device
06/24/2010US20100155783 Standard Cell Architecture and Methods with Variable Design Rules
06/24/2010DE202010000350U1 LED-Kühlanordnung LED cooling arrangement
06/24/2010DE19752408B4 Leistungsmodul mit einem oder mehreren Halbleiter-Leistungsbauelementen Power module with one or more semiconductor power devices
06/24/2010DE102009044639A1 Bauelement mit einem Halbleiterchip Component having a semiconductor chip
06/24/2010DE102009044485A1 Leistungs-Halbleitereinrichtung Power semiconductor device
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