| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/22/2010 | DE102009000333A1 Thermoelektrisches Halbleiterbauelement A thermoelectric semiconductor device |
| 07/21/2010 | EP2208226A1 Proximity communication package for processor, cache and memory |
| 07/21/2010 | EP2208225A1 Power semiconductor module |
| 07/21/2010 | CN201532949U Insulated gate double-pole transistor system |
| 07/21/2010 | CN201532946U Control cabinet combined thyristor air duct for cold rolling mill |
| 07/21/2010 | CN101785093A semiconductor assemblies and methods of manufacturing such assemblies |
| 07/21/2010 | CN101783380A Method for manufacturing light emitting diode package and package structure thereof |
| 07/21/2010 | CN101783341A LED light-source module with heat dissipation structure |
| 07/21/2010 | CN101783340A LED backlight integration and encapsulation structure and encapsulation method |
| 07/21/2010 | CN101783339A Electronic element module |
| 07/21/2010 | CN101783338A High-efficiency solar cell compounded by photoelectric and thermoelectric conversion |
| 07/21/2010 | CN101783337A Electronic device |
| 07/21/2010 | CN101783303A Laser bonding for stacking semiconductor substrates |
| 07/21/2010 | CN101409278B Planar display and IC chip for display |
| 07/21/2010 | CN101232064B Illuminating device |
| 07/21/2010 | CN101225934B Laminating integral crystalline silicon solar energy photovoltaic device and method of preparing the same |
| 07/21/2010 | CN101202259B Chip stack encapsulation structure, inner embedded type chip packaging structure and method of manufacture |
| 07/21/2010 | CN101118920B Submount type high voltage light emitting diode wafer having resistance |
| 07/21/2010 | CN101040386B Semiconductor device and its manufacturing method |
| 07/20/2010 | US7759979 Gate driving circuit |
| 07/20/2010 | US7759974 Pipelined unidirectional programmable interconnect in an integrated circuit |
| 07/20/2010 | US7759972 Integrated circuit architectures with heterogeneous high-speed serial interface circuitry |
| 07/20/2010 | US7759971 Single via structured IC device |
| 07/20/2010 | US7759831 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded |
| 07/20/2010 | US7759800 Microelectronics devices, having vias, and packaged microelectronic devices having vias |
| 07/20/2010 | US7759783 Integrated circuit package system employing thin profile techniques |
| 07/20/2010 | US7759781 LSI package provided with interface module |
| 07/20/2010 | US7759697 Semiconductor device |
| 07/20/2010 | US7759690 Gallium nitride-based compound semiconductor light-emitting device |
| 07/20/2010 | US7759246 Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same |
| 07/15/2010 | WO2010080068A1 Method for manufacturing a low cost three dimensional stack package and resulting structures using through silicon vias and assemblies |
| 07/15/2010 | WO2010079831A1 Method for manufacturing semiconductor package, method for encapsulating semiconductor, and solvent-borne semiconductor encapsulating epoxy resin composition |
| 07/15/2010 | WO2010079663A1 Semiconductor device, method for producing the same, millimeter-wave dielectric transmission device, method for producing the same, and millimeter-wave dielectric transmission system |
| 07/15/2010 | WO2010006988A8 Solar panel |
| 07/15/2010 | US20100179678 PV Wind Performance Enhancing Methods |
| 07/15/2010 | US20100177490 Computer modules with small thicknesses and associated methods of manufacturing |
| 07/15/2010 | US20100176464 Sensor Die Structure |
| 07/15/2010 | DE202004021711U1 Optoelektronisches Bauelement mit einer auf seine Abbildung abgestimmten Abstrahlcharakteristik The optoelectronic component having a tuned on his picture emission |
| 07/15/2010 | DE102009043441A1 Halbleitermodul Semiconductor module |
| 07/15/2010 | DE102008057831A1 Anordnung mit Leistungshalbleitermodul und Treibereinrichtung Arrangement with power semiconductor module and driver device |
| 07/15/2010 | DE102006005420B4 Stapelbares Halbleiterbauteil und Verfahren zur Herstellung desselben A stackable semiconductor device and method of manufacturing the same |
| 07/14/2010 | EP2207200A1 Stack of molded integrated circuit dies with side surface contact tracks |
| 07/14/2010 | EP2207198A2 Manufacturing method of a semiconductor device |
| 07/14/2010 | EP2206150A1 Ready-to-connect led module body |
| 07/14/2010 | EP1886343B1 Lead free solar cell contacts |
| 07/14/2010 | EP1774588B1 Assembling two substrates by molecular adhesion |
| 07/14/2010 | EP1620902B1 Light emitting mesa structures with high aspect ratio and near-parabolic sidewalls and the manufacture thereof |
| 07/14/2010 | CN201528092U Electric quantity-metering socket |
| 07/14/2010 | CN201527990U Improvement of bracket structure of light-emitting diode (LED) |
| 07/14/2010 | CN201527989U Bracket Improvement of light-emitting diode (LED) |
| 07/14/2010 | CN201527974U TSSOP8 encapsulating lead frame structure |
| 07/14/2010 | CN201527973U TSSOP6 lead frame structure |
| 07/14/2010 | CN201527971U Structure of cross-type DIP8 lead frame |
| 07/14/2010 | CN201526823U White light LED light source and street lamp applying same |
| 07/14/2010 | CN101779302A Optical element coupled to low profile side emitting led |
| 07/14/2010 | CN101777551A Polycrystalline light emitting diode |
| 07/14/2010 | CN101777550A 半导体装置 Semiconductor device |
| 07/14/2010 | CN101777549A Packaging module structure of compound semiconductor elements and production method thereof |
| 07/14/2010 | CN101777525A Luminous module group with high heat conductivity and light conductivity functions and application device |
| 07/14/2010 | CN101777504A System level packaging method of flip chip and attached passive element on support plate chip |
| 07/14/2010 | CN101315900B Packaging method for LED with high cooling efficiency and packaging structure thereof |
| 07/14/2010 | CN101075849B Multi-channel optical receiver module |
| 07/14/2010 | CN101051634B Silicon lining bottom plane LED integrated chip and producing method |
| 07/13/2010 | US7756503 High frequency module |
| 07/13/2010 | US7755396 Power network using standard cell, power gating cell, and semiconductor device using the power network |
| 07/13/2010 | US7755388 Interconnect structure enabling indirect routing in programmable logic |
| 07/13/2010 | US7755387 FPGA having a direct routing structure |
| 07/13/2010 | US7755204 Stacked die module including multiple adhesives that cure at different temperatures |
| 07/13/2010 | US7755182 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 07/13/2010 | US7755178 Base semiconductor component for a semiconductor component stack and method for the production thereof |
| 07/13/2010 | US7755095 Semiconductor light emitting device, lighting module, lighting apparatus, display element, and manufacturing method for semiconductor light emitting device |
| 07/13/2010 | US7755030 Optical device including a wiring having a reentrant cavity |
| 07/13/2010 | US7754964 Apparatus and methods for solar energy conversion using nanocoax structures |
| 07/13/2010 | US7754963 Solar power generation system having cooling mechanism |
| 07/13/2010 | US7754534 Semiconductor device and manufacturing method thereof |
| 07/13/2010 | US7754531 Method for packaging microelectronic devices |
| 07/08/2010 | WO2010077778A1 Stacked die parallel plate capacitor |
| 07/08/2010 | WO2010076435A1 Lighting system with electroluminescent diodes |
| 07/08/2010 | WO2010076187A2 Integrated electronic device with transceiving antenna and magnetic interconnection |
| 07/08/2010 | WO2010075831A1 Method for producing lamps |
| 07/08/2010 | WO2010075669A1 Self-cooling type thyristor valve |
| 07/08/2010 | WO2010054622A3 Optoelectronic semiconductor component |
| 07/08/2010 | WO2009135800A3 A method of assembling wafers by molecular bonding |
| 07/08/2010 | US20100172134 Led lamp unit |
| 07/08/2010 | US20100171212 Semiconductor package structure with protection bar |
| 07/08/2010 | US20100171210 Semiconductor device, stacked semiconductor device and interposer substrate |
| 07/08/2010 | US20100171209 Semiconductor device and method for manufacturing the same |
| 07/08/2010 | US20100171208 Semiconductor device |
| 07/08/2010 | US20100171207 Stackable semiconductor device packages |
| 07/08/2010 | US20100171203 Robust TSV structure |
| 07/08/2010 | US20100171195 Thin film silicon wafer and method for manufacturing the same |
| 07/08/2010 | US20100171097 Detection device and method for manufacturing the same |
| 07/08/2010 | DE102009042600A1 Leistungshalbleitermodul und Herstellungsverfahren für dieses The power semiconductor module, and manufacturing method for this |
| 07/08/2010 | DE102009042320A1 Anordnung mit einem Leistungshalbleiterchip Arrangement with a power semiconductor chip |
| 07/08/2010 | DE102009024421B3 Steueranschlusskontakteinrichtung für ein Leistungshalbleiterbauelement Control terminal contact device for a power semiconductor component |
| 07/08/2010 | DE102009016903A1 Lighting unit for use in e.g. video projector, has transistor, resistor and differential amplifier, which are arranged on body for influencing current intensity of current flowing through LED provided by semiconductor structure |
| 07/08/2010 | DE102009016683A1 Multichip-LED Multichip LED |
| 07/08/2010 | DE102008057833A1 Leistungshalbleitermodul mit Steuerfunktionalität und integriertem Überträger Power semiconductor module with control functionality and integrated carriers |
| 07/08/2010 | DE102007019031B4 Optoelektronische Baugruppe und Verfahren zur Herstellung einer optoelektronischen Baugruppe The optoelectronic assembly and method for producing an optoelectronic assembly |
| 07/07/2010 | EP2203937A2 Electronic circuit composed of sub-circuits and method for producing the same |