| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/10/2010 | US7772484 Photovoltaic module architecture |
| 08/10/2010 | US7772039 Procedure for arranging chips of a first substrate on a second substrate |
| 08/05/2010 | WO2010088302A2 A circuit for detecting tier-to-tier couplings in stacked integrated circuit devices |
| 08/05/2010 | WO2010087407A1 Semiconductor device and power supply circuit |
| 08/05/2010 | WO2010087336A1 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, and three-dimensional structure, on the surface of which wiring is provided and fabrication method thereof |
| 08/05/2010 | WO2010087213A1 Correction position detecting apparatus, correction position detecting method and bonding apparatus |
| 08/05/2010 | US20100197079 Semiconductor device including semiconductor elements mounted on base plate |
| 08/05/2010 | US20100194470 Integrated Circuit Package |
| 08/05/2010 | US20100193962 Semiconductor device |
| 08/05/2010 | US20100193931 Package-on-Package Using Through-Hole Via Die on Saw Streets |
| 08/05/2010 | US20100193930 Multi-chip semiconductor devices having conductive vias and methods of forming the same |
| 08/05/2010 | US20100193928 Semiconductor device |
| 08/05/2010 | US20100193803 Stacked Micro Optocouplers and Methods of Making the Same |
| 08/05/2010 | DE102005007355B4 Optisches Schnappeinpasselement zur optischen Kopplung zwischen einer Lichtquelle und einem Zielelement unter Verwendung von Oberflächenbefestigungstechnologie Optical Schnappeinpasselement for optical coupling between a light source and a target element using surface mount technology |
| 08/05/2010 | DE102004015305B4 Solarzelleneinheit mit Solarzellenmodul, Modulrahmen und Ableitkanal sowie Verfahren zum Montieren mehrerer Solarzelleneinheiten Solar cell unit with solar cell module, the module frame and discharge channel and method for mounting a plurality of solar cell units |
| 08/04/2010 | EP2214205A2 Electro-optic semiconductor module and semiconductor module circuit |
| 08/04/2010 | EP2214204A1 Mounting structure |
| 08/04/2010 | EP2214202A2 Metal-ceramic circuit board |
| 08/04/2010 | EP2213404A1 Solder material, process for producing the solder material, joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module |
| 08/04/2010 | EP2212239A1 Method of component assembly on a substrate |
| 08/04/2010 | CN201540906U LED heat conducting and radiating encapsulation structure |
| 08/04/2010 | CN201540903U Light emitting diode |
| 08/04/2010 | CN201540892U OLED device with double-sided display function |
| 08/04/2010 | CN201540891U White light LED |
| 08/04/2010 | CN201539737U LED lamp |
| 08/04/2010 | CN101796638A Semiconductor component and method for producing a semiconductor component |
| 08/04/2010 | CN101795064A Power phase module based on IEGT |
| 08/04/2010 | CN101794855A Light Emitting Semiconductor Device And Method Of Manufacture Thereof |
| 08/04/2010 | CN101794852A Lighting emitting device package and fabrication method thereof |
| 08/04/2010 | CN101794848A Method of transferring a device and method of manufacturing a display apparatus |
| 08/04/2010 | CN101794771A SIP (Session Initiation Protocol) chip and SOC (System On Chip) thereof |
| 08/04/2010 | CN101794768A Light emitting diode package and projecting device |
| 08/04/2010 | CN101794767A Mechanical press mounting structure of group large-power flat-plate power electronic device |
| 08/04/2010 | CN101794766A Heat exchange unit |
| 08/04/2010 | CN101794765A Semiconductor device and method of manufacturing the semiconductor device |
| 08/04/2010 | CN101794764A Light emitting module with high heat-conducting and light-conducting functions and application device thereof |
| 08/04/2010 | CN101794763A Electric connection method of multi-chip integrated LED |
| 08/04/2010 | CN101794762A Light source module and lighting device |
| 08/04/2010 | CN101794760A High current semiconductor power soic package |
| 08/04/2010 | CN101794759A Lead frame and method of manufacturing semiconductor device |
| 08/04/2010 | CN101794738A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 08/04/2010 | CN101794717A Stacked integrated chips and methods of fabrication thereof |
| 08/04/2010 | CN101286506B Multi-chip encapsulation structure having single chip support base |
| 08/04/2010 | CN101222025B Novel packaging device of organic EL device and its packaging method |
| 08/03/2010 | US7769190 Audio signal processing circuit and a display device incorporating the same |
| 08/03/2010 | US7768795 Electronic circuit device, electronic device using the same, and method for manufacturing the same |
| 08/03/2010 | US7768790 Electronic circuit |
| 08/03/2010 | US7768754 Ceramic substrate for light emitting diode where the substrate incorporates ESD protection |
| 08/03/2010 | US7768139 Power semiconductor module |
| 08/03/2010 | US7768029 LED lamp |
| 08/03/2010 | US7767903 System and method for thermal to electric conversion |
| 07/29/2010 | WO2010084550A1 Semiconductor module and control method of same |
| 07/29/2010 | WO2010083912A1 3d chip-stack with fuse-type through silicon via |
| 07/29/2010 | US20100188823 Method for Manufacturing an Electronic Module |
| 07/29/2010 | US20100188315 Electronic mirror and method for displaying image using the same |
| 07/29/2010 | US20100188144 Semiconductor integrated circuit, method for driving semiconductor integrated circuit, method for driving electronic apparatus, display device, and electronic apparatus |
| 07/29/2010 | US20100187690 Semiconductor device |
| 07/29/2010 | US20100186231 Method for producing a metal-ceramic substrate for electric circuits on modules |
| 07/29/2010 | DE202010004870U1 LED-Matrix LED matrix |
| 07/29/2010 | DE102009044486A1 Halbleiter-Bauelement Semiconductor component |
| 07/29/2010 | DE102009023899A1 Halbleiterbauelement, welches eine Ausgangskapazität aufgrund von parasitärer Kapazität reduziert A semiconductor device which reduces an output capacitance due to parasitic capacitance |
| 07/29/2010 | DE102009005907A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device |
| 07/29/2010 | DE102008026216B4 Elektronische Schaltung Electronic circuit |
| 07/29/2010 | DE102004057499B4 Ein Verfahren und eine Vorrichtung zum Erzeugen von unverfärbtem, weissem Licht unter Verwendung von gebrochen weissen Lichtemittierungsdioden A method and apparatus for generating unstained white light using off-white Lichtemittierungsdioden |
| 07/29/2010 | DE102004036982B4 Leistungshalbleitermodulsystem mit einem in einen Baugruppenträger einsteckbaren und mit einem Gehäuse des Baugruppenträgers verrastbaren Leistungshalbleitermodul Power semiconductor module system can be latched with an insertable in a rack and a housing of the rack power semiconductor module |
| 07/28/2010 | EP2211385A2 Light emitting diode package |
| 07/28/2010 | EP2211384A2 Power semiconductor module in pressure contact with active cooling arrangement |
| 07/28/2010 | EP1774589B1 Assembling two substrates by molecular adhesion, one of the two supporting an electrically conductive film |
| 07/28/2010 | CN201536114U 发光二极管的封装结构 A light emitting diode package structure |
| 07/28/2010 | CN201535450U 一种适合照明的大功率led灯 One suitable lighting power led lights |
| 07/28/2010 | CN101790788A Interconnect in a multi-element package |
| 07/28/2010 | CN101789424A LED circuit board fixedly connected by overbridge board |
| 07/28/2010 | CN101789423A U disk structure and packaging method thereof |
| 07/28/2010 | CN101789422A Light-emitting diode (LED) module |
| 07/28/2010 | CN101789421A Semiconductor device |
| 07/28/2010 | CN101789420A System-in-a-package (SIP) structure of semiconductor device and manufacturing method thereof |
| 07/28/2010 | CN101789419A Cube semiconductor package |
| 07/28/2010 | CN101789416A Semiconductor package body structure with guard bars |
| 07/28/2010 | CN101789036A Programmable transistor array design methodology |
| 07/28/2010 | CN101788110A Light-emitting diode (LED) illumination module and encapsulation method |
| 07/28/2010 | CN101373762B 功率半导体模块 Power semiconductor module |
| 07/28/2010 | CN101345231B Semiconductor chip, method of fabricating the same and stack package having the same |
| 07/27/2010 | US7764530 Memory circuit arrangement and method for the production thereof |
| 07/27/2010 | US7763985 Flip-chip type semiconductor device |
| 07/27/2010 | US7763963 Stacked package semiconductor module having packages stacked in a cavity in the module substrate |
| 07/27/2010 | US7763948 Flexible and elastic dielectric integrated circuit |
| 07/27/2010 | US7763896 Light emitting diode with auxiliary electric component |
| 07/27/2010 | US7763794 Heterojunction photovoltaic cell |
| 07/27/2010 | US7763497 Structure and method for forming a capacitively coupled chip-to-chip signaling interface |
| 07/27/2010 | US7763139 Device transferring method, and device arraying method |
| 07/22/2010 | WO2010083092A1 Method of forming trench capacitors and via connections by a chemical-mechanical polishing process for wafer-to-wafer bonding |
| 07/22/2010 | WO2010083001A1 Computer modules with printed circuit board having an aperture in which a semiconductor die is inserted and associated methods of manufacturing |
| 07/22/2010 | WO2010081603A1 Semiconductor circuit having interlayer connections and method for producing vertically integrated circuits |
| 07/22/2010 | US20100182744 Thermal spacer for stacked die package thermal management |
| 07/22/2010 | US20100182047 Dynamic Logic Circuit Including Dynamic Standard Cell Library |
| 07/22/2010 | US20100181661 Semiconductor device |
| 07/22/2010 | US20100181660 Multi-Chip Semiconductor Package |
| 07/22/2010 | US20100181638 Method of forming an isolation structure |
| 07/22/2010 | DE102009055648A1 Leistungshalbleitermodul The power semiconductor module |
| 07/22/2010 | DE102009000352A1 Sensor device has housing, sensor chip and evaluation chip, where housing has inner chamber, in which sensor chip and evaluation chip are arranged, and sensor chip is arranged on bottom area of housing |