Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2010
08/24/2010US7781672 Photovoltaic module architecture
08/24/2010US7781669 Photovoltaic cell
08/24/2010US7781668 Substrate for thin-film solar cell, method for producing the same, and thin-film solar cell employing it
08/24/2010US7781262 Method for producing semiconductor device and semiconductor device
08/24/2010US7781240 Integrated circuit device
08/19/2010WO2010092106A1 Lighting module and method for producing a lighting module
08/19/2010US20100210076 Memory circuit arrangement and method for the production thereof
08/19/2010US20100207666 Comparator circuit
08/19/2010US20100207665 Comparator circuit
08/19/2010US20100207277 Semiconductor component having a stack of semiconductor chips and method for producing the same
08/19/2010US20100207275 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
08/19/2010US20100207267 Integrated Circuit Package
08/19/2010DE10308313B4 Halbleiterdiode, elektronisches Bauteil, Spannungszwischenkreisumrichter und Steuerverfahren Semiconductor diode, electronic component, voltage source inverter and control method
08/19/2010DE102010000269A1 Halbleiter-Bauelement Semiconductor component
08/19/2010DE102009042390A1 Leistungshalbleitermodul und Verfahren zu dessen Herstellung The power semiconductor module and method for its production
08/19/2010DE102009008947A1 Verfahren zur Herstellung einer LED-Leuchte A method for producing a LED-lamp
08/19/2010DE102009007498A1 Optoelektronisches Leuchtmodul Optoelectronic light module
08/19/2010DE102009007203A1 LED module for illuminating e.g. road, has LEDs provided on LED carrier, and base supporting plate made of metal and exhibiting plastic deformability, which is larger than plastic deformability of cooling body
08/19/2010DE102009006629A1 Elektrooptisches Halbleitermodul und Halbleitermodulschaltung An electro-optical semiconductor module and the semiconductor module circuit
08/19/2010DE102008026347B4 Leistungselektronische Anordnung mit einem Substrat und einem Grundkörper Power electronic device comprising a substrate and a base body
08/18/2010EP2218118A1 Arrangement comprising at least one optoelectronic semiconductor component
08/18/2010EP2218103A1 Multi-chip module and proximity communication between chips in the module
08/18/2010EP2218102A2 Method for making an electrically conducting mechanical interconnection member
08/18/2010EP2053646B1 Method for vertical interconnection inside 3D electronic modules using vias
08/18/2010CN201556620U Bilateral different-voltage regulator diode
08/18/2010CN201556619U LED radiating module
08/18/2010CN201556618U High-power LED luminous element
08/18/2010CN201556617U LED structure
08/18/2010CN201555083U Multi-chip high-power LED lamp and a radiator structure
08/18/2010CN1953174B Module with embedded electronic components
08/18/2010CN101809773A Arrangement comprising an optoelectronic component
08/18/2010CN101809741A Arrangement comprising at least one semiconductor component, in particular a power semiconductor component for the power control of high currents
08/18/2010CN101809740A Structure with electronic component mounted therein and method for manufacturing such structure
08/18/2010CN101809739A Reconstituted wafer stack packaging with after-applied pad extensions
08/18/2010CN101809738A Memory device interface methods, apparatus, and systems
08/18/2010CN101809737A stacked microelectronic devices and methods for manufaturing staked microelectronic devices
08/18/2010CN101807855A Single die output power stage using trench-gate low-side and ldmos high-side mosfets, structure and method
08/18/2010CN101807662A Thermoelectric element, manufacturing method thereof, chip stack structure and chip encapsulating structure
08/18/2010CN101807656A Lighting emitting device package
08/18/2010CN101807654A Light-emitting apparatus and method for manufacturing same
08/18/2010CN101807651A Light emitting device package
08/18/2010CN101807569A Light emitting device package
08/18/2010CN101807568A New multichip LED encapsulation structure and processing method thereof
08/18/2010CN101807567A Assembling method of luminescent assembly and assembling structure thereof
08/18/2010CN101807566A Compound crystal type light-emitting diode assembly and manufacturing method thereof
08/18/2010CN101807565A Semiconductor assembly
08/18/2010CN101807564A Semi-conductor module
08/18/2010CN101807533A Semiconductor die package and method for making the same
08/18/2010CN101807530A Preparation method of high-voltage silicon stack based on non-equivalent voltage-sharing configuration
08/18/2010CN101807435A Electric fuse circuit and electronic component
08/18/2010CN101533886B A luminous module encapsulation method
08/18/2010CN101393908B Encapsulation construction of multi-chip stack
08/17/2010US7777519 Permutable switching network with enhanced multicasting signals routing for interconnection fabric
08/17/2010US7777235 Light emitting diodes with improved light collimation
08/17/2010US7777234 Light-receiving element and photonic semiconductor device provided therewith
08/17/2010US7777186 Pixel interconnect insulators and methods thereof
08/17/2010US7777128 Photovoltaic module architecture
08/17/2010US7776652 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
08/17/2010US7774998 Ventilated photovoltaic module frame
08/12/2010WO2010089696A2 Improved packaging for led combinations
08/12/2010US20100200998 Semiconductor integrated circuit device
08/12/2010US20100200976 Semiconductor device and semiconductor memory device
08/12/2010US20100200975 Semiconductor device and method of manufacturing the same, and electronic apparatus
08/12/2010US20100200966 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
08/12/2010DE102009007504A1 Anzeigevorrichtung, Betriebsverfahren und Beleuchtungsvorrichtung Display device, operating procedures and lighting device
08/12/2010DE102009007430A1 Leuchtmodul Light module
08/11/2010EP2216814A2 Power semiconductor device and manufacturing method therefor
08/11/2010EP2216813A2 Integrated circuit package comprising a magnetic capacitor
08/11/2010EP2216801A2 An electrical device having a power source with a magnetic capacitor as an energy storage device
08/11/2010EP2215657A1 Arrangement having at least two light-emitting semi-conductor components and method for the production of such an arrangement
08/11/2010EP2215655A1 Wafer level packaging using flip chip mounting
08/11/2010CN201549528U High temperature resistant led element
08/11/2010CN201549509U Focusing infrared receiver with internal reflective cup
08/11/2010CN201549508U Encapsulation module for multi-chip light emitting diode
08/11/2010CN201549507U LED integrated and encapsulated by multiple chips
08/11/2010CN201549506U Cutting channel structure of surface-mount LED packaging substrate
08/11/2010CN201549505U Glass passivation packaging transient voltage suppression diode structure
08/11/2010CN201549504U Integrated triode
08/11/2010CN201549503U Semiconductor voltage-stabilizing and rectifying hybrid device
08/11/2010CN201549502U Thyristor valve body suitable for high-pressure solid-state composite switch devices
08/11/2010CN201549501U LED ultraviolet light module
08/11/2010CN201549500U All-metal heat conducting double-sided radiating LED substrate
08/11/2010CN201549499U Encapsulating structure of ceramic-based high-power red, green and blue LED
08/11/2010CN201549498U Encapsulation structure of side-luminescence LED
08/11/2010CN201549488U Metal substrate, radiating component and semiconductor device provided with radiating component
08/11/2010CN101803020A Laminated mounting structure and method for manufacturing laminated mounting structure
08/11/2010CN101803019A Integrated circuit stack and its thermal management
08/11/2010CN101802993A Semiconductor device and wire bonding method
08/11/2010CN101800219A Luminescent element
08/11/2010CN101800218A Coaxial laser integrating optical transmit-receive function
08/11/2010CN101800217A 半导体模块 Semiconductor Modules
08/11/2010CN101800216A Electronic module with emi protection
08/11/2010CN101800215A Wireless communication module package structure
08/11/2010CN101800214A Construction method of anti-electromagnetic interference electronic module
08/11/2010CN101800183A Combined semiconductor apparatus with thin semiconductor films
08/11/2010CN101799125A Heat-to-electricity power-saving LED lighting equipment
08/11/2010CN101409272B Ring-shaped surface adherence type conductor holder
08/11/2010CN101071839B 发光装置 Light-emitting device
08/10/2010US7772881 Method and apparatus for in-system programmability
08/10/2010US7772684 Electronic device and production method thereof
1 ... 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 ... 409