| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/08/2010 | CN101826517A Light emitting device |
| 09/08/2010 | CN101826516A Side light-emitting type light-emitting assembly encapsulating structure and manufacturing method thereof |
| 09/08/2010 | CN101826515A Semiconductor integrated circuit device |
| 09/08/2010 | CN101826492A Chip-suspension-type packaging heat dissipation improved structure of semiconductor |
| 09/08/2010 | CN101383343B Wireless communication device |
| 09/08/2010 | CN101232011B Stack type chip packaging structure and manufacturing method thereof |
| 09/08/2010 | CN101154654B Semiconductor device, semiconductor integrated circuit and bump resistance measurement method |
| 09/07/2010 | US7791210 Semiconductor package having discrete non-active electrical components incorporated into the package |
| 09/07/2010 | US7791206 Semiconductor device and method of manufacturing the same |
| 09/07/2010 | US7791170 Method of making a deep junction for electrical crosstalk reduction of an image sensor |
| 09/07/2010 | US7791092 Multiple component solid state white light |
| 09/07/2010 | US7791088 Electro-optical device with connecting conductive film provided opposite to an end of an interlayer conductive film with insulating sidewall, the conductive film electrically connecting a pixel electrode to a lower electrode and method for making the same |
| 09/07/2010 | US7791025 Apparatus and method for analyzing relative outward flow characterizations of fabricated features |
| 09/02/2010 | WO2010099047A1 Photovoltaic devices including controlled copper uptake |
| 09/02/2010 | WO2010098501A1 Semiconductor device and method of producing same |
| 09/02/2010 | WO2010098028A1 Heat generation element cooling structure, heat generation element cooling device, electronic device provided with cooling device, and cooling device producing method |
| 09/02/2010 | US20100221872 Reversible leadless package and methods of making and using same |
| 09/02/2010 | US20100219736 Method and apparatus for using light emitting diodes |
| 09/02/2010 | US20100219523 Stackable integrated circuit package system |
| 09/02/2010 | DE202007019100U1 LED-Modul, LED-Leuchtmittel und LED-Leuchte für die energieeffiziente Wiedergabe von weißem Licht LED module, LED bulbs and LED light for the energy-efficient reproduction of white light |
| 09/02/2010 | DE102009010214A1 Discrete resistor component for use in power module, has plate formed of resistive volume material, where two contact areas are respectively provided on sides of plate and resistive volume material differs from materials of respective areas |
| 09/02/2010 | DE102009010179A1 Lighting module i.e. LED module, for use in e.g. vehicle headlight, has circuit carrier comprising continuous circuit carrier recesses and light source, and reflector wall partially reflecting circuit carrier recesses |
| 09/02/2010 | DE102009009609A1 Printed circuit board for connecting electrical or electronic components, comprises current source and one light-emitting diode as electronic component which is connected with current source on printed circuit board |
| 09/02/2010 | DE102009005092A1 Vorrichtung zur optischen Navigation und dessen Verwendung Device for optical navigation and its use |
| 09/01/2010 | EP2224486A2 Quad flat non-leaded chip package structure |
| 09/01/2010 | EP2224485A2 Light emitting diode package |
| 09/01/2010 | EP2224484A1 Semiconductor module |
| 09/01/2010 | EP2224483A1 Photosensitive adhesive |
| 09/01/2010 | EP2224467A2 High power AllnGaN based multi-chip light emitting diode |
| 09/01/2010 | EP2224466A2 High power AllnGaN based multi-chip light emitting diode |
| 09/01/2010 | EP2223337A2 Optoelectronic component and production method for an optoelectronic component |
| 09/01/2010 | EP2223336A1 Led chip with discharge protection |
| 09/01/2010 | EP2223300A1 Data storage and stackable configurations |
| 09/01/2010 | EP2163145B1 Electronic module and method for producing an electronic module |
| 09/01/2010 | EP1952439B1 Semiconductor device comprising a housing containing a triggering unit |
| 09/01/2010 | CN201570518U Eight-pin paster type LED bracket |
| 09/01/2010 | CN201570515U Luminous diode |
| 09/01/2010 | CN201570498U Single-arm bridge type automobile rectifying diode |
| 09/01/2010 | CN201570497U Light transmission device of semiconductor |
| 09/01/2010 | CN201568811U White light LED backlight |
| 09/01/2010 | CN101819970A Welded IGBT and solderless diode-based series structure module |
| 09/01/2010 | CN101819969A Optical coupler |
| 09/01/2010 | CN101819968A Light-emitting diode (LED) packaging |
| 09/01/2010 | CN101819967A Led module and led light source apparatus |
| 09/01/2010 | CN101819966A Light emitting devices |
| 09/01/2010 | CN101819965A Semiconductor device |
| 09/01/2010 | CN101819964A Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board |
| 09/01/2010 | CN101819963A Semiconductor photoelectric element and square flat pin-free photoelectric element |
| 09/01/2010 | CN101436583B Stacking type packaging piece |
| 09/01/2010 | CN101266966B Multi-core encapsulation module and its making method |
| 09/01/2010 | CN101257009B LED encapsulation body and encapsulation method thereof |
| 08/31/2010 | USRE41596 System and method for integrating a digital core with a switch mode power supply |
| 08/31/2010 | US7786749 Programmable integrated circuit having built in test circuit |
| 08/31/2010 | US7786594 Wafer level stack structure for system-in-package and method thereof |
| 08/26/2010 | WO2010095205A1 Semiconductor sensor device, method of manufacturing semiconductor sensor device, package, method of manufacturing package, module, method of manufacturing module, and electronic device |
| 08/26/2010 | WO2010095201A1 Semiconductor device and method for manufacturing semiconductor device |
| 08/26/2010 | WO2010076187A3 Integrated electronic device with transceiving antenna and magnetic interconnection |
| 08/26/2010 | US20100214750 Electronics module comprising an embedded microcircuit |
| 08/26/2010 | US20100213596 Stack package |
| 08/26/2010 | US20100213594 Semiconductor device and a manufacturing method of the same |
| 08/26/2010 | US20100213593 Stacked semiconductor package |
| 08/26/2010 | DE102010000407A1 Halbleiter-Package mit einem aus Metallschichten bestehenden Band The semiconductor package with an existing metal layers band |
| 08/26/2010 | DE102010000400A1 Array von Halbleiterbauelementen Array of semiconductor devices |
| 08/26/2010 | DE102009009483A1 Lighting device manufacturing method, involves placing LED chips adjacent to each other on upper side of connection carrier, and structuring film between or on radiation exit surfaces after placing film on radiation exit surfaces |
| 08/26/2010 | DE102009009316A1 Fotodetektor-Halbleiterbauelement, Fotoemitter-Halbleiterbauelement, optoelektronisches Übertragungssystem und Verfahren zum Übertragen eines elektrischen Signals Photodetector semiconductor device, photoemitter semiconductor device, an optoelectronic transmission system and method for transmitting an electric signal |
| 08/26/2010 | DE102009009288A1 Starrflexible Trägerplatte Flex-rigid support plate |
| 08/26/2010 | DE102009008845A1 Leuchtmodul und Verfahren zum Herstellen eines Leuchtmoduls Light-emitting module and method of manufacturing a light-emitting module |
| 08/26/2010 | DE102009000888A1 Halbleiteranordnung Semiconductor device |
| 08/26/2010 | DE102007010876B4 Verfahren zur Herstellung eines Halbleitermoduls A process for producing a semiconductor module |
| 08/25/2010 | EP2221871A1 Light emitting device |
| 08/25/2010 | EP2221870A2 Power semiconductor module and fabrication method thereof |
| 08/25/2010 | EP2221866A2 Stacking apparatus and method for stacking integrated circuit elements |
| 08/25/2010 | EP2221865A2 Stacking apparatus and method for stacking integrated circuit elements |
| 08/25/2010 | EP2220682A2 Formation of a hybrid integrated circuit device |
| 08/25/2010 | EP2220681A1 Method for stacking serially-connected integrated circuits and multi-chip device made from same |
| 08/25/2010 | CN201562693U Four-point LED bracket and LED light source manufacturing by using four-point LED bracket |
| 08/25/2010 | CN201562692U LED paster type encapsulation with roughened surface |
| 08/25/2010 | CN201562680U Multi-chip component structure |
| 08/25/2010 | CN201562679U Surface mounting LED |
| 08/25/2010 | CN201562419U Seamless display screen adapted to silicon substrate LED |
| 08/25/2010 | CN1905181B Semiconductor packages for surface mounting and method of producing same |
| 08/25/2010 | CN101814697A Light-emitting device and method of manufacturing the same |
| 08/25/2010 | CN101814573A Packaging assembly of smd light emitting diodes and manufacturing method thereof |
| 08/25/2010 | CN101814570A Light emitting device package and method for fabricating the same |
| 08/25/2010 | CN101814489A Light emitting diode packaging structure with functional chip and packaging method thereof |
| 08/25/2010 | CN101814488A LED packaging structure and loader structure |
| 08/25/2010 | CN101814487A Multi-chip LED light source module group and manufacture method thereof |
| 08/25/2010 | CN101814486A LED and LED lamp |
| 08/25/2010 | CN101814484A Chip package and manufacturing method thereof |
| 08/25/2010 | CN101814466A Thermally enhanced semiconductor package |
| 08/25/2010 | CN101813296A LED light source using filter with dual-function of stopping ultraviolet rays and infrared rays |
| 08/25/2010 | CN101812298A Phosphors and light emitting device |
| 08/25/2010 | CN101303982B Method for making component of surface adhesion type diode support and structure thereof |
| 08/25/2010 | CN101271887B Semiconductor light emitting device |
| 08/24/2010 | USRE41561 Method for sharing configuration data for high logic density on chip |
| 08/24/2010 | US7782088 Sharing adaptive dispersion compensation engine among programmable logic device serial interface channels |
| 08/24/2010 | US7781882 Low voltage drop and high thermal performance ball grid array package |
| 08/24/2010 | US7781880 Semiconductor package |
| 08/24/2010 | US7781875 Techniques for packaging multiple device components |
| 08/24/2010 | US7781734 Electronic sensor with integrated thermal regulation |