Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/2010
09/22/2010CN101047052B Varistor and light-emitting apparatus
09/21/2010USRE41721 Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes
09/21/2010US7801396 Optoelectric composite substrate and method of manufacturing the same
09/21/2010US7800405 Passgate structures for use in low-voltage applications
09/21/2010US7800404 Field programmable application specific integrated circuit with programmable logic array and method of designing and programming the programmable logic array
09/21/2010US7800213 Power semiconductor circuit with busbar system
09/21/2010US7800174 Power semiconductor switching-device and semiconductor power module using the device
09/21/2010US7799610 Method of fabricating a stacked die having a recess in a die BGA package
09/16/2010WO2010104125A1 Method of producing semiconductor chip stack, and semiconductor device
09/16/2010WO2010103875A1 Electric circuit apparatus
09/16/2010WO2010103865A1 Semiconductor module
09/16/2010WO2010102911A2 Led module for modified lamps and modified led lamp
09/16/2010WO2010102910A2 Led module with improved light output
09/16/2010WO2010102654A1 Power semiconductor module having layered insulating side walls
09/16/2010US20100233857 Fabrication method of semiconductor integrated circuit device
09/16/2010US20100231716 Vehicle-Mountable Imaging Systems and Methods
09/16/2010US20100231286 Thermal Sensors For Stacked Dies
09/16/2010US20100230806 Semiconductor Device and Method of Forming Three-Dimensional Vertically Oriented Integrated Capacitors
09/16/2010US20100230795 Stacked microelectronic assemblies having vias extending through bond pads
09/16/2010US20100230792 Premolded Substrates with Apertures for Semiconductor Die Packages with Stacked Dice, Said Packages, and Methods of Making the Same
09/16/2010DE202010009574U1 Ringförmige Kapselung Annular enclosure
09/16/2010DE202009013278U1 Gehäustes LED-Modul mit integrierter Elektronik A housed LED module with integrated electronics
09/16/2010DE10317580B4 Elektrische Wechselrichtervorrichtung mit einem Flüssigkeitskanal sowie Elektrofahrzeug mit einer derartigen Wechselrichtervorrichtung Electric inverter device having a liquid channel and electric vehicle with such inverter device
09/16/2010DE102009013112A1 Verfahren zur Herstellung einer Vielzahl von mikrooptoelektronischen Bauelementen und mikrooptoelektronisches Bauelement A process for the production of a variety of micro-optoelectronic components and micro-optoelectronic component
09/16/2010DE102009013085A1 Method for arranging and connecting electronic component on substrate, involves producing electrical contact of electronic component following from front end of substrate on front-side metallization or openings
09/16/2010DE102009001461A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly
09/16/2010DE102008057831B4 Anordnung mit Leistungshalbleitermodul und Treibereinrichtung Arrangement with power semiconductor module and driver device
09/15/2010EP2228844A2 Light emitting apparatus, and method for manufacturing the same, and lighting system
09/15/2010EP2228841A1 LED module with improved light output
09/15/2010EP2228824A1 Embedded chip package with chips stacked in an interconnecting laminate
09/15/2010EP2228822A2 Flexible Packaging for Chip-on-Chip and Package-on-Package Technologies
09/15/2010EP2227826A2 Substrate for an led submount, and led submount
09/15/2010CN201584435U White light-emitting diode structure
09/15/2010CN201584416U High-tension high-power operational amplifier
09/15/2010CN201584415U Optical signal transducer
09/15/2010CN201584414U Photoelectric coupler with semiconductors stuck on surfaces of four channels
09/15/2010CN201584413U Heat dissipation device of lighting and heating component
09/15/2010CN201584412U Jumper automatic loader
09/15/2010CN201584411U Power chip with stacking package preformed vertical structure
09/15/2010CN201584410U Section bar provided with a plurality of LED die sets
09/15/2010CN201584409U Structure of bearing seat for light emitting diode (LED) chips
09/15/2010CN201584408U Power module
09/15/2010CN201584402U Alignment apparatus for optical element, and sealing cover system provided with alignment apparatus
09/15/2010CN1981388B 发光装置 Light-emitting device
09/15/2010CN101836294A Multilayer semiconductor device
09/15/2010CN101836293A Mounting structure
09/15/2010CN101834266A White light emitting device and light source module for liquid crystal display backlight using the same
09/15/2010CN101834258A Package for mounting light emitting element, light emitting device, backlight, and liquid crystal display device
09/15/2010CN101834244A Light emitting device, light emitting device package and lighting system including the same
09/15/2010CN101834177A SOC (System On a Chip) chip device
09/15/2010CN101834176A Half-bridge drive circuit chip
09/15/2010CN101834175A LED lighting COB (Chip on Board) packaging structure and bubble sphere
09/15/2010CN101834174A Packaging designs for LEDs
09/15/2010CN101834173A Light-emitting diode
09/15/2010CN101834172A Alternating current (AC) light-emitting diode (LED) device
09/15/2010CN101834171A Integrated circuit package comprising a magnetic capacitor
09/15/2010CN101834163A Semiconductor flip-chip bonding packaging heat radiation improved structure
09/15/2010CN101834145A Method for manufacturing novel integrated circuit semiconductor apparatus and finished product thereof
09/15/2010CN101471336B 半导体装置 Semiconductor device
09/15/2010CN101431067B Packaging structure for multi-chip stack
09/15/2010CN101315921B Chip stack packaging structure and method of producing the same
09/15/2010CN101271883B Production method of circuit substrates and inductor wire
09/15/2010CN101257007B Semiconductor device having time sequence structure
09/15/2010CN101212866B Module
09/15/2010CN101000130B High power LED combined cup lamp
09/14/2010USRE41685 Light source with non-white and phosphor-based white LED devices, and LCD assembly
09/14/2010US7796400 Modular integrated circuit chip carrier
09/14/2010US7795987 Methods of achieving linear capacitance in symmetrical and asymmetrical EMI filters with TVS
09/14/2010US7795912 Circuit comprising a matrix of programmable logic cells
09/14/2010US7795911 Programmable gate array, switch box and logic unit for such an array
09/14/2010US7795910 Field-programmable gate array using charge-based nonvolatile memory
09/14/2010US7795728 Electronic component
09/14/2010US7795717 Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component
09/14/2010US7795657 Semiconductor memory device including a source and a drain of a memory cell transistor formed between electrodes and a method of fabrication the same
09/14/2010US7795626 Flip chip type LED lighting device manufacturing method
09/10/2010WO2010101163A1 Substrate with built-in functional element, and electronic device using the substrate
09/10/2010WO2010100705A1 Semiconductor device and method for manufacturing same
09/10/2010WO2010099647A1 Light emitting device package for temperature detection
09/09/2010US20100226108 Printed circuit board and method of manufacturing printed circuit board
09/09/2010US20100224990 Semiconductor package having an internal cooling system
09/09/2010US20100224979 Stacked integrated circuit package system and method for manufacturing thereof
09/09/2010US20100224977 Semiconductor device and method for fabricating the same
09/09/2010DE102009044641A1 Einrichtung mit einem Halbleiterchip und Metallfolie Device having a semiconductor chip and metal foil
09/09/2010DE102007001191B4 Halbleitervorrichtung mit einem Widerstand zum Abgleichen der Stromverteilung A semiconductor device with a resistor for adjusting the current distribution
09/09/2010DE102005056892B4 Elektronikmodul für eine Systemplatine mit Durchgangslöchern und Verfahren zur Herstellung und Kühlung eines derartigen Elektronikmoduls Electronic module for a system board with through holes and methods for producing and cooling of such electronic module
09/08/2010EP2226841A1 Interposer and manufacturing method of the interposer
09/08/2010EP2225785A2 Chip assembly, connecting assembly, led and method for producing a chip assembly
09/08/2010EP2225783A2 Semiconductor light emitting device
09/08/2010CN201576682U High-voltage high-power operational amplifier
09/08/2010CN201576681U LED packaging structure with lateral surface emitting light
09/08/2010CN201576680U Electrode support extended heat radiation type array LED diode
09/08/2010CN201576679U Flash memory chip stacking structure
09/08/2010CN201576678U Surface coarsened LED
09/08/2010CN201576674U Chip layout structure
09/08/2010CN1985370B Electronic device comprising an ESD device
09/08/2010CN101828136A Side-emitting led light source for backlighting applications
09/08/2010CN101826593A Wiring board contributable to reduction in thickness of light emitting apparatus and having high versatility
09/08/2010CN101826589A Light emitting device
09/08/2010CN101826519A LED integrated light source board, special mould and manufacture method
09/08/2010CN101826518A White light-emitting diode (LED) and color temperature-adjusting method thereof
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