| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/04/2015 | CN204144251U 一种多面发光的led灯珠 A multi-surface emitting led lights beads |
| 02/04/2015 | CN204144250U 基于反挖槽工艺的gpp整流芯片 Trench technology-based anti-chip rectifier gpp |
| 02/04/2015 | CN204144246U 一种射频功放模块、射频模块及基站 A radio frequency power amplifier module, RF module and base station |
| 02/04/2015 | CN204143793U 一种led集成像素封装模组及其高清显示屏 One kind of led module and integrated package pixel HD display |
| 02/04/2015 | CN204143413U 感测芯片以及配置该感测芯片的电子装置 Sensing chip and the electronic device is configured the sensing chip |
| 02/04/2015 | CN104335347A 倾斜发射led阵列 Tilt launch led arrays |
| 02/04/2015 | CN104335340A 晶片堆叠的组装 Wafer stack assembly |
| 02/04/2015 | CN104335307A 开关元件单元 Switching element unit |
| 02/04/2015 | CN104332554A Led晶粒与封装结构 Led die and package structure |
| 02/04/2015 | CN104332465A 一种3d封装结构及其工艺方法 One kind of 3d package structure and process methods |
| 02/04/2015 | CN104332464A 一种功率器件与控制器件的集成工艺 An integrated process control devices and power devices |
| 02/04/2015 | CN104332463A 多芯片器件 Multi-chip device |
| 02/04/2015 | CN104332462A 一种芯片倾斜堆叠的圆片级封装单元及其封装方法 A chip tilt unit stacked wafer level packaging and packaging method |
| 02/04/2015 | CN104332461A 一种多片式高压驱动电路 A multi-chip high-voltage driver circuit |
| 02/04/2015 | CN104332452A 芯片封装模组 Chip package module |
| 02/04/2015 | CN104332444A 在3d管芯对管芯堆叠过程中管芯翘曲的解决方案 In 3d die stack of die during die warpage solution |
| 02/04/2015 | CN102931177B 基于红光芯片直封补偿的高显色led光源 Based straight red chip seal compensated high color led light |
| 02/04/2015 | CN102916106B 发光二极管 Led |
| 02/04/2015 | CN102903705B 发光二极管封装结构及其制造方法 LED package structure and manufacturing method |
| 02/04/2015 | CN102842667B 发光二极管封装结构及其制造方法 LED package structure and manufacturing method |
| 02/04/2015 | CN102779923B 一种贴片式led模组的制造方法 A method of manufacturing SMD led module |
| 02/04/2015 | CN102751275B 一种发光二极管显示屏,及其制造方法 A light emitting diode display, and a manufacturing method |
| 02/04/2015 | CN102738137B Led灯板的封装结构及其方法 Led lamp board packaging structure and method |
| 02/04/2015 | CN102496615B 基于光伏电池和温差电池的组合电池装置 Photovoltaic cells based on a combination of battery and the temperature difference between the battery means |
| 02/04/2015 | CN102142401B 层压电子器件 Laminated electronic devices |
| 02/03/2015 | US8947137 Core voltage reset systems and methods with wide noise margin |
| 02/03/2015 | US8946943 High side switch |
| 02/03/2015 | US8946909 Semiconductor package having gap-filler injection-friendly structure |
| 02/03/2015 | US8946890 Power/ground layout for chips |
| 02/03/2015 | US8946888 Package on packaging structure and methods of making same |
| 02/03/2015 | US8946884 Substrate-less interposer technology for a stacked silicon interconnect technology (SSIT) product |
| 02/03/2015 | US8946882 Semiconductor module and semiconductor device |
| 02/03/2015 | US8946870 Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die |
| 02/03/2015 | US8946786 Semiconductor device and method for manufacturing same |
| 02/03/2015 | US8946743 Light emitting apparatus |
| 02/03/2015 | US8946734 Method for packaging light emitting diodes and light emitting module having LED packages formed by the method |
| 02/03/2015 | US8946563 Module with exposed parts of copper foil and process for production thereof |
| 02/03/2015 | US8945987 Manufacture of face-down microelectronic packages |
| 02/03/2015 | US8945985 Semiconductor package and method of manufacturing the same |
| 02/03/2015 | US8944657 Light source |
| 01/29/2015 | WO2015012181A1 Power module and manufacturing method thereof |
| 01/29/2015 | WO2015010554A1 Light-emitting diode display screen |
| 01/29/2015 | WO2015010407A1 Led and display device |
| 01/29/2015 | US20150031171 Methods for forming conductive elements and vias on substrates and for forming multi-chip modules |
| 01/29/2015 | US20150028496 Semiconductor Device and Method of Forming Overlapping Semiconductor Die with Coplanar Vertical Interconnect Structure |
| 01/29/2015 | US20150028487 Chip Package with Passives |
| 01/29/2015 | US20150028473 Stack packages and methods of fabricating the same |
| 01/29/2015 | US20150028472 Stacked package and method for manufacturing the same |
| 01/29/2015 | US20150028467 Semiconductor device and method for manufacturing the same |
| 01/29/2015 | US20150028448 Chip Package with Embedded Passive Component |
| 01/29/2015 | US20150028369 Light-emitting diode device |
| 01/29/2015 | US20150028368 Light emitting module |
| 01/29/2015 | US20150028357 Package structure of an optical module |
| 01/29/2015 | DE112013002474T5 Schaltelementeinheit Switching-element assembly |
| 01/29/2015 | DE102014110552A1 Integriertes passivbauteilpackage, halbleitermodul und herstellungsverfahren Integrated passive component package, semiconductor module and the manufacturing processes |
| 01/29/2015 | DE102014109981A1 Chip-Package mit passiven Komponenten Chip package with passive components |
| 01/29/2015 | DE102014109909A1 Chipbaugruppe mit eingebetteter passiver Komponente Chip module with embedded passive component |
| 01/29/2015 | DE102014109647A1 Lichtemittierendes Modul und Beleuchtungsvorrichtung The light-emitting module and lighting device |
| 01/29/2015 | DE102013107862A1 Oberflächenmontierbares optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung zumindest eines oberflächenmontierbaren optoelektronischen Halbleiterbauteils Surface-mountable optoelectronic semiconductor device and process for the preparation of at least one surface-mountable optoelectronic semiconductor component |
| 01/29/2015 | DE102004043258B4 Halbleiteranordnung mit einem Paar von Wärmesenken und Verfahren zu deren Herstellung A semiconductor device comprising a pair of heat sinks and methods for their preparation |
| 01/28/2015 | EP2830091A1 Flexible lighting device having unobtrusive conductive layers |
| 01/28/2015 | EP2830090A1 Flexible lighting device having unobtrusive conductive layers |
| 01/28/2015 | CN204130590U 一种led晶粒与封装结构 One kind of grain and packaging structure led |
| 01/28/2015 | CN204130577U 用于汽车前照灯led 4×1芯片cob封装结构 For automotive headlamp led 4 × 1 chip package structure cob |
| 01/28/2015 | CN204130531U 一种led双杯型与封装的灯珠 A dual cup led lamp beads and package |
| 01/28/2015 | CN204130530U 一种大功率cob led光源 One kind of high power cob led light |
| 01/28/2015 | CN204130529U 一种多色led灯 A multicolor led lights |
| 01/28/2015 | CN204130528U 一种引线框架式大功率led光源模组 A lead frame power led light module |
| 01/28/2015 | CN204130527U 垂直结构发光二极管串联封装单元 Light-emitting diodes in series vertical structure package unit |
| 01/28/2015 | CN204130526U 一种封装在非金属散热器上的led光源模组 Packaged in a non-metallic heat sink led light module |
| 01/28/2015 | CN204130525U 陶瓷基板和散热衬底的大功率led集成封装结构 Ceramic substrates and heat power led integrated package substrate structure |
| 01/28/2015 | CN204130524U 一种新型单相整流桥 A new single-phase rectifier bridge |
| 01/28/2015 | CN104321870A 电功率模块设置 Electric power module settings |
| 01/28/2015 | CN104321869A 半导体功率模块和装置 Semiconductor power modules and devices |
| 01/28/2015 | CN104321868A 具有气压传感器的半导体封装 The semiconductor package having a pressure sensor |
| 01/28/2015 | CN104321867A 半导体器件 Semiconductor devices |
| 01/28/2015 | CN104321866A 半导体器件的制造方法 The method of manufacturing a semiconductor device |
| 01/28/2015 | CN104321865A 具有机械熔丝的半导体封装 Semiconductor package with mechanical fuses |
| 01/28/2015 | CN104319342A Led灯丝 Led filament |
| 01/28/2015 | CN104319273A Led光源 Led light |
| 01/28/2015 | CN104319272A 晶闸管阀段及其晶闸管散热器 Thyristor valve section and thyristor radiator |
| 01/28/2015 | CN104318946A 具有芯片识别符结构的可垂直堆叠的裸片 Vertically stacked die structure having a chip identifier |
| 01/28/2015 | CN102832210B 低阻衬底上的多表面集成器件 Multi-surface low resistance integrated devices on the substrate |
| 01/28/2015 | CN102800664B 一种用于促进植物生长的led单灯及其生产工艺 A method for promoting the growth of plants and production processes led single lamp |
| 01/28/2015 | CN102593167B 半导体装置以及功率变换装置 The semiconductor device and power converter |
| 01/27/2015 | US8941999 Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics |
| 01/27/2015 | US8941962 Snubber circuit and method of using bipolar junction transistor in snubber circuit |
| 01/27/2015 | US8941249 Low loop wire bonding |
| 01/27/2015 | US8941246 Semiconductor device and manufacturing method thereof |
| 01/27/2015 | US8941245 Semiconductor package including semiconductor chip with through opening |
| 01/27/2015 | US8941237 Semiconductor device |
| 01/27/2015 | US8941235 Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate |
| 01/27/2015 | US8941230 Semiconductor package and manufacturing method |
| 01/27/2015 | US8941228 Semiconductor module and manufacturing method thereof |
| 01/27/2015 | US8941227 Package structure and method for manufacturing same |
| 01/27/2015 | US8941225 Integrated circuit package and method for manufacturing the same |
| 01/27/2015 | US8941222 Wafer level semiconductor package and manufacturing methods thereof |
| 01/27/2015 | US8941220 Power module package and system module having the same |
| 01/27/2015 | US8941219 Etched recess package on package system |
| 01/27/2015 | US8941216 Semiconductor devices having through-vias and methods for fabricating the same |