Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/2010
09/30/2010WO2010110244A1 Three-dimensional semiconductor integrated circuit
09/30/2010WO2010110070A1 Method and apparatus for producing three-dimensional integrated circuit
09/30/2010WO2010109985A1 Method for manufacturing electronic component
09/30/2010WO2010109746A1 Semiconductor device and method for manufacturing same
09/30/2010WO2010108811A1 Light diode
09/30/2010WO2010108774A1 Assembly of optoelectronic components
09/30/2010WO2010108761A1 Optoelectronic semiconductor component and display device
09/30/2010WO2010089696A3 Improved packaging for led combinations
09/30/2010US20100248399 Method for manufacturing hybrid image sensors
09/30/2010US20100246626 Side-emitting led light source for backlighting applications
09/30/2010US20100246267 Systems and Methods Of Providing Programmable Voltage And Current Reference Devices
09/30/2010US20100244946 Semiconductor device and display device
09/30/2010US20100244233 Chip stack package and method of fabricating the same
09/30/2010US20100244227 Semiconductor packages and electronic systems including the same
09/30/2010US20100244219 Integrated circuit packaging system with package stacking and method of manufacture thereof
09/30/2010US20100244216 Semiconductor Device and Method of Forming No-Flow Underfill Material Around Vertical Interconnect Structure
09/30/2010US20100244102 Integrated circuit device and method for forming the same
09/30/2010US20100242270 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
09/30/2010DE102010001791A1 LED-assembly, has light emission opening unsealed by enclosing unit, and electro static discharging units formed in such manner such that discharging units made up of ceramic material form enclosing unit
09/30/2010DE102010000539A1 Halbleiteranordnung Semiconductor device
09/30/2010DE102009020127A1 Leuchtdiode Light-emitting diode
09/30/2010DE102009015313A1 Optoelektronisches Halbleiterbauteil und Anzeigeeinrichtung An optoelectronic semiconductor device and display device
09/30/2010DE102009015307A1 Anordnung optoelektronischer Bauelemente Arrangement of optoelectronic components
09/30/2010DE102009001932A1 Chipmodul und Verfahren zur Herstellung eines Chipmoduls Chip module and method of producing a chip module,
09/29/2010EP2234158A1 A three-dimensional electronics package
09/29/2010EP2234154A2 Coolant cooled type semiconductor device
09/29/2010EP2234147A2 Method of fabricating resin-sealed semiconductor devices
09/29/2010EP2234112A1 Stacked Memory Devices with Hierarchical Decoder Structure
09/29/2010EP2233820A2 Illumination device with a light source comprising several LED chips, a conical reflector and a movable lens
09/29/2010EP2233819A1 LED illumination device
09/29/2010EP2232591A2 Down-converted light emitting diode with simplified light extraction
09/29/2010EP2232553A2 An electronic device
09/29/2010CN201594551U LED packaging unit and luminous device
09/29/2010CN201594550U Light emitting diode packaging structure
09/29/2010CN201594549U Surface-mount encapsulation for three-dimensional vertical semiconductor epitaxial film
09/29/2010CN201594538U Three-dimensional assembling structure for hybrid integrated circuit
09/29/2010CN201594537U Vehicle circuit module and substrate structure thereof
09/29/2010CN1947660B System, method and module assembly for multi-tube core backlight lighting diode
09/29/2010CN1832169B Wireless chip and electronic appliance having the same
09/29/2010CN1653297B High efficiency solid-state light source and methods of use and manufacture
09/29/2010CN101847626A Light-emitting device
09/29/2010CN101847625A Modular LED
09/29/2010CN101847624A COB modularized LED encapsulation technology
09/29/2010CN101847623A Power module
09/29/2010CN101847622A Power chip with multi-stack package preformed vertical structure and manufacturing method thereof
09/29/2010CN101847621A Three-dimensional electronics package
09/29/2010CN101847620A 功率模块 Power Modules
09/29/2010CN101847619A Internal shield of infrared receiver
09/29/2010CN101847590A Method for packaging multi-laminated multi-chip on flexible circuit board and packaging chipset
09/29/2010CN101846256A Led light source
09/29/2010CN101533817B Semiconductor encapsulation structure with pins on bearing seat
09/29/2010CN101533791B Method for manufacturing luminescence module and luminescence module
09/29/2010CN101494217B Conductor frame
09/29/2010CN101414601B Semiconductor encapsulation stacking combined construct for protecting welding spot between external pins
09/29/2010CN101410976B Method for manufacturing substrate having electric component
09/29/2010CN101335264B Chip stacked structure and method of fabricating the same
09/29/2010CN101290930B Semiconductor device comprising a semiconductor chip stack and method for producing the same
09/29/2010CN101286501B Image sensor package and image pickup device applying image sensor
09/29/2010CN101276808B Semiconductor light-emitting device and its manufacture method
09/29/2010CN101253626B Circuit device and method for manufacturing same
09/29/2010CN101197402B Led
09/29/2010CN101145592B High heat dispersion light emitting diode device
09/29/2010CN101026146B Power semiconductor module and its manufacturing method
09/28/2010US7804321 Circuits and methods for testing FPGA routing switches
09/28/2010US7804171 Techniques for packaging a multiple device component
09/23/2010WO2010107705A1 Tandem photovoltaic cell and method using three glass substrate configuration
09/23/2010WO2010107417A1 Solar powered dc load system
09/23/2010WO2010106732A1 Semiconductor device
09/23/2010WO2010106599A1 Circuit module and electronic device
09/23/2010WO2010088302A3 A circuit for detecting tier-to-tier couplings in stacked integrated circuit devices
09/23/2010WO2009102485A8 Broadband light emitting device lamps for providing white light output
09/23/2010US20100239858 Film-like adhesive, adhesive sheet, and semiconductor device using same
09/23/2010US20100237485 Stack type semiconductor package apparatus
09/23/2010US20100237484 Semiconductor package
09/23/2010DE202009017866U1 Schaltungsanordnung mit einem Leistungshalbleiterbauelement und einem Verbindungspartner Circuit arrangement with a power semiconductor device and a link partner
09/23/2010DE202007019142U1 Mit Leuchtdioden ausgestattete Hinterleuchtungseinheit Equipped with LEDs backlight
09/23/2010DE112006000647B4 Verfahren zum Bilden selbst-passivierender Interconnects A method of forming self-passivating interconnects
09/23/2010DE102010000537A1 Halbleiteranordnung mit einem Abstandshalterelement A semiconductor device with a spacer element
09/23/2010CA2762531A1 Solar powered dc load system
09/22/2010EP2230689A1 Short-circuit-proof semi-conductor module
09/22/2010CN201590432U Single-color LED encapsulation structure with high light-emitting rate and projection optical engine using same
09/22/2010CN201590416U LED encapsulation structure
09/22/2010CN201590415U High stability rectifier bridge
09/22/2010CN201590414U Encapsulating structure with multiple LED chips and optical projection engine using encapsulating structure
09/22/2010CN101843181A Part built-in wiring board, and manufacturing method for the part built-in wiring board
09/22/2010CN101842896A Method for stacking serially-connected integrated circuits and multi-chip device made from same
09/22/2010CN101842887A Method for the production and contacting of electronic components by means of a substrate plate, particularly a DCB ceramic substrate plate
09/22/2010CN101840983A Light emitting device, light emitting device package and lighting system including the same
09/22/2010CN101840973A Light emitting diode encapsulating structure and manufacturing method thereof
09/22/2010CN101840917A Integrate circuit and packaging device thereof, and method and assembly for packaging a plurality of integrate circuits
09/22/2010CN101840915A Pin sharing device and method
09/22/2010CN101840914A Double side cooled power module with power overlay
09/22/2010CN101840913A Semiconductor device
09/22/2010CN101840912A Semiconductor device and manufacturing method thereof
09/22/2010CN101840911A Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
09/22/2010CN101840910A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
09/22/2010CN101840909A Integrated circuit device
09/22/2010CN101840896A Flip-chip high-heat-radiation spheroidal array encapsulation structure
09/22/2010CN101840895A High heat dissipation spherical array package structure
09/22/2010CN101840867A Method for producing an electronic module
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