Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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10/14/2010 | US20100258929 Staircase shaped stacked semiconductor package |
10/14/2010 | US20100258928 Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof |
10/14/2010 | US20100258901 Semiconductor device, ink cartridge, and electronic device |
10/14/2010 | DE102009042399A1 Leistungshalbleitervorrichtung und Herstellungsverfahren dafür Power semiconductor device and manufacturing method thereof |
10/14/2010 | DE102006008807B4 Anordnung mit einem Leistungshalbleitermodul und einem Kühlbauteil Arrangement with a power semiconductor module and a cooling component |
10/13/2010 | EP2239776A2 High voltage low current surface emitting LED |
10/13/2010 | EP2239768A1 High-performance semiconductor with a connection device and internal auxiliary connection elements designed as contact springs |
10/13/2010 | EP2238384A1 Semiconductor package with incorporated light or temperature sensors and time multiplexing |
10/13/2010 | CN201608182U Led灯支架 Led lamp holder |
10/13/2010 | CN201608181U 单颗多面光源led支架 Single multi-faceted light led bracket |
10/13/2010 | CN201608180U 多回路串并联应用芯片支架 Series-parallel multi-loop applications chip holder |
10/13/2010 | CN201608179U 可桥接扩充多面发光芯片的导电支架 Bridgeable expand multi-faceted light emitting chip conductive frame |
10/13/2010 | CN201608178U 整流桥组件 Rectifier bridge assembly |
10/13/2010 | CN201608177U 发光二极管引线架结构 Light-emitting diode lead frame structure |
10/13/2010 | CN201608176U 表面粘着型发光二极管线架结构 Surface mount light-emitting diode wire frame structure |
10/13/2010 | CN201608175U 一种新型led光源 A new kind of led light |
10/13/2010 | CN201608174U 一种半导体器件的系统级封装结构 System-in-package structure for a semiconductor device |
10/13/2010 | CN1998081B Carrier for multilayer semiconductor device and method for manufacturing multilayer semiconductor device |
10/13/2010 | CN1897272B Photodetection system |
10/13/2010 | CN1812088B Multi-level semiconductor module and method for fabricating the same |
10/13/2010 | CN101861646A Stack packages using reconstituted wafers |
10/13/2010 | CN101859867A Thermoelectric element |
10/13/2010 | CN101859862A 发光装置 Light-emitting device |
10/13/2010 | CN101859857A LED device |
10/13/2010 | CN101859804A Composite-type flexible silicon-based thin film solar cell |
10/13/2010 | CN101859762A Three-dimensional semiconductor architecture |
10/13/2010 | CN101859761A Unit pixel of image sensor having three-dimensional structure and method for manufacturing the same |
10/13/2010 | CN101859760A Packaging structure of surface-mount device infrared receiver |
10/13/2010 | CN101859759A White LED light source package |
10/13/2010 | CN101859758A High voltage low current surface emitting LED |
10/13/2010 | CN101859757A Stack light-emitting diode chip structure and manufacturing method thereof |
10/13/2010 | CN101859756A AC type flip-chip light-emitting diode structure and preparation method thereof |
10/13/2010 | CN101859755A Power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) package body and package method thereof |
10/13/2010 | CN101859754A Electronic control unit and method of manufacturing the same |
10/13/2010 | CN101859753A High-performance semiconductor with connection device and internal auxiliary connection elements designed as contact springs |
10/13/2010 | CN101859752A Stacking package structure with chip embedded inside and die having through silicon via and method of the same |
10/13/2010 | CN101859745A Stacked semiconductor package |
10/13/2010 | CN101859736A Semiconductor packaging semi-finished product and semiconductor packaging process |
10/13/2010 | CN101859716A Semiconductor device and method for fabricating the same |
10/13/2010 | CN101859714A Manufacturing method of display device and display device |
10/13/2010 | CN101452928B Microchip matrix light source module |
10/13/2010 | CN101447538B Luminous element and preparation method thereof |
10/13/2010 | CN101395715B Electronic device package, module and electronic device |
10/13/2010 | CN101392892B Array type illuminating device with high colour rendering |
10/13/2010 | CN101364585B Chip packaging construction and manufacturing method therefor |
10/13/2010 | CN101359656B Image sensor package and fabrication method thereof |
10/13/2010 | CN101261986B Electronic part encapsulation module, external cover and its making method |
10/13/2010 | CN101226927B Chip module with power amplifier and manufacturing method thereof |
10/13/2010 | CN101207175B Electronic cooling device, image sensor and fabrication method thereof |
10/13/2010 | CN101192601B Illumination device with semiconductor light-emitting elements |
10/13/2010 | CN101192544B Semiconductor component buried loading plate splicing structure and its manufacture method |
10/13/2010 | CN101090109B Power semiconductor module with connection elements electrically insulated from one another |
10/13/2010 | CN101009272B Cooling apparatus for memory module |
10/12/2010 | US7812633 Apparatus and method for the arithmetic over-ride of look up table outputs in a programmable logic device |
10/12/2010 | US7812447 Wafer level pre-packaged flip chip |
10/12/2010 | US7812436 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
10/12/2010 | US7812390 Semiconductor memory device with memory cells on multiple layers |
10/12/2010 | US7812365 Heat dissipation member, semiconductor apparatus and semiconductor light emitting apparatus |
10/12/2010 | US7812311 Method and apparatus for two-dimensional spectroscopy |
10/12/2010 | US7811505 Method for fast filling of templates for imprint lithography using on template dispense |
10/12/2010 | US7810703 Wire bonding method |
10/07/2010 | WO2010112383A1 Method for producing a plurality of optoelectronic semiconductor components and optoelectronic semiconductor component |
10/07/2010 | WO2010111986A1 Method for producing an optoelectronic component, optoelectronic component, and component arrangement having a plurality of optoelectronic components |
10/07/2010 | WO2010111825A1 Electronic package and method of fabrication thereof |
10/07/2010 | US20100252935 Semiconductor device and method for fabricating the same |
10/07/2010 | DE102009040444A1 Leistungsmodul Power module |
10/07/2010 | DE102009029281A1 Module, particularly sensor module, is provided with component and connecting element, where component is connected to another component in electrically conductive manner |
10/06/2010 | EP2237328A1 Method for producing a plurality of optoelectronic semiconductor components and optoelectronic semiconductor component |
10/06/2010 | EP2237326A2 Light-emitting device and display device including the same |
10/06/2010 | EP2235756A1 Reflective secondary optics and semiconductor assembly and method for the production thereof |
10/06/2010 | EP1647051B1 Semiconductor power module with strip conductors which are detached from a substrate as external connections |
10/06/2010 | CN201601149U 一种led封装结构 One kind of led package structure |
10/06/2010 | CN201601131U 带散热装置的led光源 Led light with heat sink |
10/06/2010 | CN201601130U 灯条式led芯片封装结构 Light bar style led chip package structure |
10/06/2010 | CN201601129U 用于倒装芯片和贴装无源元件的带金属球焊盘的载板芯片 For flip-chip passive components and mounting pads with metal ball carrier board chip |
10/06/2010 | CN201601128U 在载板芯片上倒装芯片的系统及封装结构 On-chip system and carrier board flip-chip package structure |
10/06/2010 | CN201601125U 厚膜集成电路封装件 Thick film integrated circuit packages |
10/06/2010 | CN201601124U 用于倒装芯片和贴装无源元件的带金属凸块焊盘的载板芯片 For flip chip and mount passive components with metal bump chip carrier board pads |
10/06/2010 | CN201601123U 带金属凸块焊盘的载板芯片 Chip carrier board with metal bump pad |
10/06/2010 | CN1917203B Power semiconductor module with wiring element |
10/06/2010 | CN1812087B Battery protection ic chip |
10/06/2010 | CN101855723A Power semiconductor module |
10/06/2010 | CN101853914A High-power LED white lighting source structure |
10/06/2010 | CN101853847A Combined semiconductor rectifying device and the electric power converter using the same |
10/06/2010 | CN101853846A Semiconductor module and camera module mounting said semiconductor module |
10/06/2010 | CN101853845A Multichip stacking encapsulation |
10/06/2010 | CN101853842A Package structure for chip and method for forming the same |
10/06/2010 | CN101853828A Chip with convex block and packaging structure of chip with convex block |
10/06/2010 | CN101853826A Connection member and printed circuit board unit |
10/06/2010 | CN101852369A Ultrathin LED backlight module |
10/06/2010 | CN101315926B Semiconductor device and method of manufacturing the same |
10/06/2010 | CN101188235B Layered integrated circuit memory |
10/06/2010 | CN101138088B Structure and method for mounting bare chip |
10/05/2010 | US7808280 Semiconductor device |
10/05/2010 | US7808112 Wafer level pre-packaged flip chip system |
10/05/2010 | US7808102 Multi-die DC-DC boost power converter with efficient packaging |
10/05/2010 | US7808092 Semiconductor device with a plurality of ground planes |
10/05/2010 | US7807918 Modular shade system |
10/05/2010 | US7807503 Die-wafer package and method of fabricating same |
10/05/2010 | US7805834 Method for fabricating three-dimensional all organic interconnect structures |