Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2010
10/14/2010US20100258929 Staircase shaped stacked semiconductor package
10/14/2010US20100258928 Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
10/14/2010US20100258901 Semiconductor device, ink cartridge, and electronic device
10/14/2010DE102009042399A1 Leistungshalbleitervorrichtung und Herstellungsverfahren dafür Power semiconductor device and manufacturing method thereof
10/14/2010DE102006008807B4 Anordnung mit einem Leistungshalbleitermodul und einem Kühlbauteil Arrangement with a power semiconductor module and a cooling component
10/13/2010EP2239776A2 High voltage low current surface emitting LED
10/13/2010EP2239768A1 High-performance semiconductor with a connection device and internal auxiliary connection elements designed as contact springs
10/13/2010EP2238384A1 Semiconductor package with incorporated light or temperature sensors and time multiplexing
10/13/2010CN201608182U Led灯支架 Led lamp holder
10/13/2010CN201608181U 单颗多面光源led支架 Single multi-faceted light led bracket
10/13/2010CN201608180U 多回路串并联应用芯片支架 Series-parallel multi-loop applications chip holder
10/13/2010CN201608179U 可桥接扩充多面发光芯片的导电支架 Bridgeable expand multi-faceted light emitting chip conductive frame
10/13/2010CN201608178U 整流桥组件 Rectifier bridge assembly
10/13/2010CN201608177U 发光二极管引线架结构 Light-emitting diode lead frame structure
10/13/2010CN201608176U 表面粘着型发光二极管线架结构 Surface mount light-emitting diode wire frame structure
10/13/2010CN201608175U 一种新型led光源 A new kind of led light
10/13/2010CN201608174U 一种半导体器件的系统级封装结构 System-in-package structure for a semiconductor device
10/13/2010CN1998081B Carrier for multilayer semiconductor device and method for manufacturing multilayer semiconductor device
10/13/2010CN1897272B Photodetection system
10/13/2010CN1812088B Multi-level semiconductor module and method for fabricating the same
10/13/2010CN101861646A Stack packages using reconstituted wafers
10/13/2010CN101859867A Thermoelectric element
10/13/2010CN101859862A 发光装置 Light-emitting device
10/13/2010CN101859857A LED device
10/13/2010CN101859804A Composite-type flexible silicon-based thin film solar cell
10/13/2010CN101859762A Three-dimensional semiconductor architecture
10/13/2010CN101859761A Unit pixel of image sensor having three-dimensional structure and method for manufacturing the same
10/13/2010CN101859760A Packaging structure of surface-mount device infrared receiver
10/13/2010CN101859759A White LED light source package
10/13/2010CN101859758A High voltage low current surface emitting LED
10/13/2010CN101859757A Stack light-emitting diode chip structure and manufacturing method thereof
10/13/2010CN101859756A AC type flip-chip light-emitting diode structure and preparation method thereof
10/13/2010CN101859755A Power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) package body and package method thereof
10/13/2010CN101859754A Electronic control unit and method of manufacturing the same
10/13/2010CN101859753A High-performance semiconductor with connection device and internal auxiliary connection elements designed as contact springs
10/13/2010CN101859752A Stacking package structure with chip embedded inside and die having through silicon via and method of the same
10/13/2010CN101859745A Stacked semiconductor package
10/13/2010CN101859736A Semiconductor packaging semi-finished product and semiconductor packaging process
10/13/2010CN101859716A Semiconductor device and method for fabricating the same
10/13/2010CN101859714A Manufacturing method of display device and display device
10/13/2010CN101452928B Microchip matrix light source module
10/13/2010CN101447538B Luminous element and preparation method thereof
10/13/2010CN101395715B Electronic device package, module and electronic device
10/13/2010CN101392892B Array type illuminating device with high colour rendering
10/13/2010CN101364585B Chip packaging construction and manufacturing method therefor
10/13/2010CN101359656B Image sensor package and fabrication method thereof
10/13/2010CN101261986B Electronic part encapsulation module, external cover and its making method
10/13/2010CN101226927B Chip module with power amplifier and manufacturing method thereof
10/13/2010CN101207175B Electronic cooling device, image sensor and fabrication method thereof
10/13/2010CN101192601B Illumination device with semiconductor light-emitting elements
10/13/2010CN101192544B Semiconductor component buried loading plate splicing structure and its manufacture method
10/13/2010CN101090109B Power semiconductor module with connection elements electrically insulated from one another
10/13/2010CN101009272B Cooling apparatus for memory module
10/12/2010US7812633 Apparatus and method for the arithmetic over-ride of look up table outputs in a programmable logic device
10/12/2010US7812447 Wafer level pre-packaged flip chip
10/12/2010US7812436 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
10/12/2010US7812390 Semiconductor memory device with memory cells on multiple layers
10/12/2010US7812365 Heat dissipation member, semiconductor apparatus and semiconductor light emitting apparatus
10/12/2010US7812311 Method and apparatus for two-dimensional spectroscopy
10/12/2010US7811505 Method for fast filling of templates for imprint lithography using on template dispense
10/12/2010US7810703 Wire bonding method
10/07/2010WO2010112383A1 Method for producing a plurality of optoelectronic semiconductor components and optoelectronic semiconductor component
10/07/2010WO2010111986A1 Method for producing an optoelectronic component, optoelectronic component, and component arrangement having a plurality of optoelectronic components
10/07/2010WO2010111825A1 Electronic package and method of fabrication thereof
10/07/2010US20100252935 Semiconductor device and method for fabricating the same
10/07/2010DE102009040444A1 Leistungsmodul Power module
10/07/2010DE102009029281A1 Module, particularly sensor module, is provided with component and connecting element, where component is connected to another component in electrically conductive manner
10/06/2010EP2237328A1 Method for producing a plurality of optoelectronic semiconductor components and optoelectronic semiconductor component
10/06/2010EP2237326A2 Light-emitting device and display device including the same
10/06/2010EP2235756A1 Reflective secondary optics and semiconductor assembly and method for the production thereof
10/06/2010EP1647051B1 Semiconductor power module with strip conductors which are detached from a substrate as external connections
10/06/2010CN201601149U 一种led封装结构 One kind of led package structure
10/06/2010CN201601131U 带散热装置的led光源 Led light with heat sink
10/06/2010CN201601130U 灯条式led芯片封装结构 Light bar style led chip package structure
10/06/2010CN201601129U 用于倒装芯片和贴装无源元件的带金属球焊盘的载板芯片 For flip-chip passive components and mounting pads with metal ball carrier board chip
10/06/2010CN201601128U 在载板芯片上倒装芯片的系统及封装结构 On-chip system and carrier board flip-chip package structure
10/06/2010CN201601125U 厚膜集成电路封装件 Thick film integrated circuit packages
10/06/2010CN201601124U 用于倒装芯片和贴装无源元件的带金属凸块焊盘的载板芯片 For flip chip and mount passive components with metal bump chip carrier board pads
10/06/2010CN201601123U 带金属凸块焊盘的载板芯片 Chip carrier board with metal bump pad
10/06/2010CN1917203B Power semiconductor module with wiring element
10/06/2010CN1812087B Battery protection ic chip
10/06/2010CN101855723A Power semiconductor module
10/06/2010CN101853914A High-power LED white lighting source structure
10/06/2010CN101853847A Combined semiconductor rectifying device and the electric power converter using the same
10/06/2010CN101853846A Semiconductor module and camera module mounting said semiconductor module
10/06/2010CN101853845A Multichip stacking encapsulation
10/06/2010CN101853842A Package structure for chip and method for forming the same
10/06/2010CN101853828A Chip with convex block and packaging structure of chip with convex block
10/06/2010CN101853826A Connection member and printed circuit board unit
10/06/2010CN101852369A Ultrathin LED backlight module
10/06/2010CN101315926B Semiconductor device and method of manufacturing the same
10/06/2010CN101188235B Layered integrated circuit memory
10/06/2010CN101138088B Structure and method for mounting bare chip
10/05/2010US7808280 Semiconductor device
10/05/2010US7808112 Wafer level pre-packaged flip chip system
10/05/2010US7808102 Multi-die DC-DC boost power converter with efficient packaging
10/05/2010US7808092 Semiconductor device with a plurality of ground planes
10/05/2010US7807918 Modular shade system
10/05/2010US7807503 Die-wafer package and method of fabricating same
10/05/2010US7805834 Method for fabricating three-dimensional all organic interconnect structures