Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2010
11/02/2010US7825327 Concentrating solar collector
11/02/2010US7824959 Wafer level stack structure for system-in-package and method thereof
11/02/2010US7824190 Connector for connecting conductors of a cable to flat conductors of a photovoltaic cell
11/02/2010US7823279 Method for using an in package power supply to supply power to an integrated circuit and to a component
10/2010
10/28/2010WO2010122889A1 Device and method for detecting insulation degradation of power module and power module system
10/28/2010WO2010122312A1 High colour quality luminaire
10/28/2010WO2010025694A9 Optoelectronic component
10/28/2010US20100271777 High density chip packages, methods of forming, and systems including same
10/28/2010US20100271071 Universal Inter-Layer Interconnect for Multi-Layer Semiconductor Stacks
10/28/2010DE112008003425T5 Halbleiterbauelement und Verfahren zum Herstellen desselben Of the same semiconductor device and method of manufacturing
10/28/2010DE102010016566A1 Halbleiterbaustein mit mehreren Chips und Substrat in einer Metallkappe A semiconductor device having a plurality of chip and substrate in a metal cap
10/28/2010DE102009018428A1 Schaltung für eine Leuchtdiodenanordnung und Leuchtdiodenmodul Circuit for a light emitting diode device and light emitting diode module
10/27/2010EP2244312A2 Yellow light emitting diode and light emitting device having the same
10/27/2010EP2244289A2 Coolant cooled type semiconductor device
10/27/2010EP2244288A1 Semiconductor element module and method for manufacturing the same
10/27/2010EP2244245A2 Light emitting device and display apparatus of light emitting devices
10/27/2010EP2158605B1 Method for producing a set of chips mechanically interconnected by means of a flexible connection
10/27/2010EP1784864B1 Electric sub-assembly
10/27/2010CN201616452U 大功率led封装外壳 Power led package housing
10/27/2010CN201616451U 发光二极管封装结构 A light emitting diode package structure
10/27/2010CN201616433U U盘结构 U disk structure
10/27/2010CN201616432U 一种led多晶片集成封装器件 One kind of led multi-chip integrated package devices
10/27/2010CN201616431U 阵列式led照明面光源 Array led lighting surface light source
10/27/2010CN1717802B Semiconductor device having a bond pad and method for its fabrication
10/27/2010CN101874302A Arrangement having at least two light-emitting semi-conductor components and method for the production of such an arrangement
10/27/2010CN101872833A LED signal lamp, PCB (Printed Circuit Board) substrate structure thereof and light source assembly
10/27/2010CN101872819A Yellow light emitting diode and light emitting device
10/27/2010CN101872817A Light-emitting diode packaging structure and manufacturing method thereof
10/27/2010CN101872816A Light-emitting diode and back light module
10/27/2010CN101872761A Optocoupler
10/27/2010CN101872760A 光电转换模块 Photoelectric conversion module
10/27/2010CN101872759A Alternated current light-emitting diode having constant current diode
10/27/2010CN101872758A 发光装置 Light-emitting device
10/27/2010CN101872757A Recess chip packaging structure and laminated packaging structure using same
10/27/2010CN101872753A Restoration of electrical and mechanical connectability to an electrical device with a face equipped with contact studs
10/27/2010CN101872750A Chip structure, stack chip packaging structure and manufacturing method of chip structure
10/27/2010CN101872749A Recess chip packaging structure and laminated packaging structure using same
10/27/2010CN101300911B Circuit module and method for manufacturing circuit module
10/27/2010CN101246877B Poly-crystal face-to-face stacking and packaging construction
10/26/2010USRE41869 Semiconductor device
10/26/2010US7823114 Method of designing wiring structure of semiconductor device and wiring structure designed accordingly
10/26/2010US7821106 Process for making contact with and housing integrated circuits
10/26/2010US7820906 Photovoltaic receiver
10/26/2010US7820469 Stress-controlled dielectric integrated circuit
10/26/2010US7820459 Methods relating to the reconstruction of semiconductor wafers for wafer level processing including forming of alignment protrusion and removal of alignment material
10/21/2010WO2010119652A1 Electronic device mounting structure and electronic device mounting method
10/21/2010WO2010119570A1 Multilayer semiconductor device and method for manufacturing multilayer semiconductor device
10/21/2010WO2010119395A1 Transparent oled device with high intensity
10/21/2010WO2010118945A1 Multi-chip sensor module and method for the production thereof
10/21/2010US20100265753 Systems, methods and devices for arbitrating die stack position in a multi-die stack device
10/21/2010US20100265751 Multi-chip packages providing reduced signal skew and related methods of operation
10/21/2010US20100264551 Three dimensional integrated circuit integration using dielectric bonding first and through via formation last
10/21/2010US20100264530 Stacked Chip Package Structure with Leadframe Having Bus Bar
10/21/2010US20100264527 Stacked Chip Package Structure with Leadframe Having Bus Bar
10/21/2010DE202010009897U1 Leitungsführung eines elektrischen Moduls Wiring an electrical module
10/21/2010DE202010007980U1 LED-Leuchtenmodul LED light module
10/21/2010DE102009017733A1 Leistungshalbleitermodul mit einer Verbindungseinrichtung und mit als Kontaktfeder ausgebildeten internen Anschlusselementen Power semiconductor module with a connection device and designed as a contact spring with internal connection elements
10/21/2010DE102009002376A1 Multichip-Sensormodul und Verfahren dessen Herstellung Multi-chip sensor module and method of manufacturing
10/21/2010CA2758515A1 Transparent oled device with high intensity
10/20/2010EP2242103A1 Chip with field-effect transistors and contact bumps for flip-chip connection
10/20/2010EP2242102A1 Device for reducing the noise emission in a power electronics system
10/20/2010EP2242101A2 Receive circuit for connectors with variable complex impedance
10/20/2010EP2242090A1 Film for semiconductor, method for manufacturing semiconductor device and semiconductor device
10/20/2010EP2241803A2 High power LED module for spot illumination
10/20/2010CN201611657U Led集成式模组的封装结构 Led Integrated package module
10/20/2010CN201611656U Led封装结构 Led package structure
10/20/2010CN201611655U 一种发光二极管 A light-emitting diode
10/20/2010CN101866995A Light-emitting diode packaging structure
10/20/2010CN101866915A Integrated circuit device and operation method thereof, memory storage device and electronic system
10/20/2010CN101866914A Semiconductor device
10/20/2010CN101866913A Chip encapsulation structure with shielding cover body
10/20/2010CN101866912A Luminous device
10/20/2010CN101866911A Structure of light-emitting diode with high color rendering index
10/20/2010CN101866910A Luminous device
10/20/2010CN101866909A Bidirectional switch module
10/20/2010CN101866908A Inductive loop formed by interconnecting silicon through holes
10/20/2010CN101866907A Receive circuit for connectors with variable complex impedance
10/20/2010CN101866906A Device for reducing the interference emission in a power electronic system
10/20/2010CN101866892A Chip layout structure and method
10/20/2010CN101533811B Structure of semiconductor chip with silicon through hole and stacking assembly thereof
10/20/2010CN101425507B LED row having heat radiating fins and production method
10/19/2010USRE41826 Semiconductor device
10/19/2010US7818704 Capacitive decoupling method and module
10/19/2010US7816754 Ball grid array package construction with raised solder ball pads
10/19/2010US7816177 Semiconductor device and method of manufacturing the same
10/19/2010US7814651 Method for fabricating a through-hole interconnection substrate
10/14/2010WO2010118350A1 Reduced susceptibility to electrostatic discharge during 3d semiconductor device bonding and assembly
10/14/2010WO2010116218A1 A method for manufacturing a radiation imaging panel comprising imaging tiles
10/14/2010WO2010115296A1 Radiation substrate for power led and power led production and manufacturing method thereof
10/14/2010WO2010115294A1 Ac led structure with overload protection
10/14/2010US20100260221 Light emitting module and thermal protection method
10/14/2010US20100259320 Semiconductor device capable of switching operation modes
10/14/2010US20100259289 Detecting Open Ground Connections in Surface Mount Connectors
10/14/2010US20100258956 Microelectronic packages and methods therefor
10/14/2010US20100258951 Assembling substrates that can form 3-d structures
10/14/2010US20100258939 Stacked microfeature devices and associated methods
10/14/2010US20100258933 Semiconductor device, method of forming the same, and electronic device
10/14/2010US20100258932 Supporting substrate before cutting, semiconductor device, and method of forming semiconductor device
10/14/2010US20100258931 Semiconductor device and method of forming the same
10/14/2010US20100258930 Stacked semiconductor package and method of manufacturing thereof
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