Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2010
11/17/2010CN101630677B High-frequency quick-recovery diode
11/17/2010CN101567322B Encapsulating structure and encapsulating method of chip
11/17/2010CN101523597B Electronic circuit device and method for manufacturing the same
11/17/2010CN101364549B Making method for white light LED
11/17/2010CN101336477B Chip stage integrated radio frequency passive device, manufacturing method thereof and system comprising the same
11/17/2010CN101330068B Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
11/17/2010CN101261981B Warm color light source
11/17/2010CN101257014B LED white source with improved color rendering
11/16/2010US7836420 Integrated circuit system with assist feature
11/16/2010US7834463 Stack package having pattern die redistribution
11/16/2010US7834434 LED illumination system
11/16/2010US7834344 Nanometric structure and corresponding manufacturing method
11/16/2010US7834265 Photovoltaic insulating glazing
11/16/2010US7834160 preparing a buffer containing a protein (ferritin), zinc ion, and ammonia, adding hydrogen peroxide to the buffer so that the concentration of hydrogen peroxide is 60 mM or greater and 150 mM or less; source of nanoparticles of zinc oxide
11/16/2010US7833836 Stack MCP and manufacturing method thereof
11/16/2010US7833835 Multi-layer fin wiring interposer fabrication process
11/11/2010WO2010129903A1 Panelized backside processing for thin semiconductors
11/11/2010WO2010129412A1 Re-emitting semiconductor construction with enhanced extraction efficiency
11/11/2010WO2010129083A1 Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits
11/11/2010WO2010102910A3 Led module with improved light output
11/11/2010US20100283158 Structure and method for forming a capacitively coupled chip-to-chip signaling interface
11/11/2010US20100283151 Techniques for packaging multiple device components
11/11/2010DE202010008235U1 LED-Lampenanordnung LED lamp assembly
11/11/2010DE202009007810U1 Anordnung zur Lichtabgabe mit Leuchtelementen und damit gekoppeltem Kühlsystem Arrangement to emit light with light elements and thus coupled cooling system
11/11/2010DE202004021772U1 Waferverbindung unter Verwendung von Reaktivfolien zum massiv parallelen Häusen mikro-elektromechanischer Systeme Wafer bonding using reactive foils for massively parallel housings micro-electro-mechanical systems
11/11/2010DE19950026B4 Leistungshalbleitermodul The power semiconductor module
11/11/2010DE10293997B4 Leistungshalbleitermodul The power semiconductor module
11/11/2010DE102008017569B4 Verfahren zur Herstellung eines organischen Substrats mit eingebetteten Aktivchips A process for producing an organic substrate with embedded active chips
11/11/2010DE102004061099B4 Verfahren zur Herstellung eines Leistungshalbleitermoduls mit ESD-Schutzbeschaltung Method for producing a power semiconductor module with ESD protection circuit
11/11/2010DE102004059353B4 Halbleiter-Leistungsmodul Semiconductor power module
11/11/2010DE10048377B4 Halbleiter-Leistungsmodul mit elektrisch isolierender Wärmesenke und Verfahren zu seiner Herstellung Semiconductor power module having an electrically insulating heat sink and method for its preparation
11/10/2010EP2249382A1 Circuit board module and electronic apparatus
11/10/2010EP2249381A1 Semiconductor chip and semiconductor device
11/10/2010EP2248194A2 Light emitting apparatus and display apparatus using the same
11/10/2010EP2248169A2 Circuit for preventing self-heating of metal-insulator-transition (mit) device and method of fabricating integrated-device for the same circuit
11/10/2010EP2151148B1 Method for producing a circuit board having a cavity for the integration of components
11/10/2010EP2132789B1 Optoelectronical component emitting electromagnetic radiation and method for producing an optoelectronical component
11/10/2010CN201629346U Surface mounting type LED
11/10/2010CN201629335U Semiconductor light emitting diode secondary package element
11/10/2010CN201629334U LED fluorescent lamp module
11/10/2010CN201629333U LED device for emitting ultraviolet light
11/10/2010CN201629332U Multi-chip LED package radiating structure
11/10/2010CN201629331U High-voltage AC packaged LED
11/10/2010CN1964039B 功率半导体模块 Power semiconductor module
11/10/2010CN1835227B 半导体封装 The semiconductor package
11/10/2010CN101884254A Electronic apparatus produced using lead-free bonding material for soldering
11/10/2010CN101884104A Photosensitive adhesive
11/10/2010CN101882662A 发光二极管封装件 Light emitting diode package
11/10/2010CN101882615A Nano particle light distribution LED
11/10/2010CN101882614A Packaging structure of alternating current light-emitting diode
11/10/2010CN101882606A Heat-dissipation semiconductor encapsulation structure and manufacturing method thereof
11/10/2010CN101881419A LED light source using optical device with transparent base material
11/10/2010CN101546756B LED package structure with multifunctional integral chip and package method thereof
11/10/2010CN101443904B Base for power module
11/10/2010CN101436603B Imaging die set
11/10/2010CN101378624B Module structure integrating perimeter circuit and manufacturing method thereof
11/10/2010CN101373763B Led
11/10/2010CN101188247B An organic electric luminescent display and its making method
11/10/2010CN101064301B Semiconductor light-emitting equipment
11/09/2010US7829991 Stackable ceramic FBGA for high thermal applications
11/09/2010US7829975 Multichip semiconductor device, chip therefor and method of formation thereof
11/09/2010US7829971 Semiconductor apparatus
11/09/2010US7829781 Photovoltaic module architecture
11/04/2010WO2010126759A1 Hand held electronic device and method of performing a dual sided gesture
11/04/2010WO2010125935A1 Power module
11/04/2010WO2010125814A1 Device mounting structure and device mounting method
11/04/2010WO2010124967A1 Composite electronic circuit assembly
11/04/2010US20100278212 Circuit arrangement and imaging pyrometer for generating light- and temperature-dependent signals
11/04/2010US20100277232 Hybrid microscale-nanoscale neuromorphic integrated circuit
11/04/2010US20100277231 filtering on current mode daisy chain inputs
11/04/2010US20100276806 Plastic package and method of fabricating the same
11/04/2010US20100276801 Semiconductor device and method to manufacture thereof
11/04/2010DE202010011443U1 Beleuchtungsmodul mit guter Farbwiedergabeeigenschaft Lighting module with good color rendering property
11/04/2010DE102009019446A1 MEMS Mikrofon MEMS microphone
11/04/2010DE102009019412A1 Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren A process for producing a circuit board with LEDs and printed circuit board and reflector surface, prepared by the method
11/03/2010EP2246911A2 Light emitting device package
11/03/2010EP1888688B1 Thermally conductive polyamide-based components used in light emitting diode reflector applications
11/03/2010CN201623180U Low-thermal resistance LED
11/03/2010CN201623176U High-power LED structure
11/03/2010CN201623160U Multiaspect shining tricolor LED
11/03/2010CN201623159U Ultra-fast switch-recovering module
11/03/2010CN201621637U Packaging module for multiple LEDs
11/03/2010CN1953222B Light-emitting element with at least one light-emitting crystal
11/03/2010CN1583465B Light source device of vehicle head lamp and vehicle head lamp
11/03/2010CN101878544A Chip assembly, connecting assembly, led and method for producing a chip assembly
11/03/2010CN101878528A Electronic circuit composed of sub-circuits and method for producing the same
11/03/2010CN101877350A Integrated chip unit
11/03/2010CN101877349A Semiconductor module and portable device
11/03/2010CN101877348A Embedded chip package with chips stacked in an interconnecting laminate
11/03/2010CN101877347A Flexible and thin image sensing module with electromagnetic interference prevention and circuit board module
11/03/2010CN101877342A Circuit arrangement and design method
11/03/2010CN101436632B LED chip component with heat-dissipating substrate and preparation method thereof
11/03/2010CN101416307B Cooler
11/03/2010CN101359623B Semiconductor device and method of manufacturing the same
11/03/2010CN101345223B Semiconductor devices, semiconductor modules and methods for cooling semiconductor devices
11/03/2010CN101217141B IC package and method of manufacturing the same
11/03/2010CN101088140B Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
11/02/2010US7825688 Programmable microcontroller architecture(mixed analog/digital)
11/02/2010US7825385 Device for detecting electromagnetic radiation and ionizing radiation having an isotropic transfer layer
11/02/2010US7825379 Thermal-type infrared image sensing device and method of producing the same
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