Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2010
12/01/2010CN101901791A Die set for multi-packaging assembly and method for making the die set and the multi- packaging assembly
12/01/2010CN101901772A Method of manufacturing electronic device and electronic device
12/01/2010CN101901638A Stacked busbar assembly with integrated cooling device
12/01/2010CN101521195B Three-friction stepper for juxtaposedly pushing double piezoelectrics and scanning probe microscope thereof
12/01/2010CN101404275B Circuit device
12/01/2010CN101226929B Semiconductor package structure and manufacturing method thereof
12/01/2010CN101179102B LED lamp and producing process
12/01/2010CN101131983B Connector and light transmitting receiving module
11/2010
11/30/2010US7844935 Wiring design system of semiconductor integrated circuit, semiconductor integrated circuit, and wiring design program
11/30/2010US7843700 Semiconductor device
11/30/2010US7843259 Field effect transistor circuit and method of operation of field effect transistor circuit for reducing thermal runaway
11/30/2010US7843227 Semiconductor integrated circuit
11/30/2010US7843053 Stack package made of chip scale packages
11/30/2010US7842555 Integrated transistor module and method of fabricating same
11/30/2010US7842157 upper and lower substrates are bonded via organic solvent between; microarrays
11/30/2010CA2520824C Self light - emitting device
11/25/2010WO2010134230A1 Semiconductor device and method for manufacturing same
11/25/2010WO2010134180A1 Method for bonding high heat conductive insulating resin
11/25/2010US20100295607 System and method to reduce noise in a substrate
11/25/2010US20100295186 Semiconductor module for stacking and stacked semiconductor module
11/25/2010US20100295163 Stacked semiconductor package assembly
11/25/2010DE112005003671B4 Baugruppe mit einem Mikroprozessor und einem Cache der Ebene L4 und Verfahren zur Herstellung der Baugruppe und System aufweisend die Baugruppe Assembly with a microprocessor and a cache of the level L4, and process for preparing the assembly and the assembly system comprising
11/25/2010DE102010001668A1 Leistungstransistorbaugruppe mit integrierter Sammelschiene Power transistor module with integrated busbar
11/24/2010EP2254152A2 Solid state switch arrangement
11/24/2010EP2254151A2 Power conversion apparatus
11/24/2010EP2254150A1 Method and system for chip to chip communication utilizing selectable directional antennas
11/24/2010EP2254147A1 Resin varnish for semiconductor element bonding film formation, semiconductor element bonding film, and semiconductor device
11/24/2010EP2253026A1 Led light engine kernel and method of making the kernel
11/24/2010EP2253025A1 Broadband light emitting device lamps for providing white light output
11/24/2010EP2252998A1 Methods for making a stack of memory circuits and for addressing a memory circuit, and corresponding stack and device
11/24/2010CN201655852U LED backlight light bar encapsulated by adopting surface mount technology
11/24/2010CN201655806U Radio-frequency laterally diffused metal oxide semiconductor field-effect transistor
11/24/2010CN201655805U Half bridge drive circuit chip
11/24/2010CN201655804U LED circuit boards fixedly connected by speed hump with cable tray
11/24/2010CN201655803U Novel multi-chip LED package structure
11/24/2010CN201655802U Sealing structure for light emitting diode
11/24/2010CN201655801U Novel power semiconductor
11/24/2010CN201655800U Novel flexible circuit board of LED lighting array
11/24/2010CN201655799U Thin type bridge rectifier with pin structure
11/24/2010CN201655798U Radiator of multi-chip combined LED (Light-emitting diode)
11/24/2010CN201655797U Bipolar luminous LED
11/24/2010CN201655796U Packaging structure of light emitting diode
11/24/2010CN201655795U Thin bridge rectifier applied for circuit boards
11/24/2010CN201655794U Packaging structure of step-down piezoelectric ceramic transformers
11/24/2010CN101897043A Arrangement comprising at least one optoelectronic semiconductor component
11/24/2010CN101897023A An electronic device
11/24/2010CN101897022A 半导体模块 Semiconductor Modules
11/24/2010CN101894903A 光电转换装置 The photoelectric conversion device
11/24/2010CN101894901A Package for multiple light emitting diodes
11/24/2010CN101894892A LED wafer package and manufacturing method thereof
11/24/2010CN101894891A LED wafer package and lighting device using same
11/24/2010CN101894834A Bridge drive circuit chip
11/24/2010CN101894833A LED module and LED lighting device
11/24/2010CN101894832A Light-emitting diode (LED) structure for generating white light
11/24/2010CN101894831A Ultraviolet-infrared dual band detector and manufacturing method thereof
11/24/2010CN101894830A Stack type package structure and manufacturing method thereof
11/24/2010CN101894829A Stacked encapsulating structure
11/24/2010CN101894819A Substrate structure
11/24/2010CN101894817A Semiconductor module for stacking and stacked semiconductor module
11/24/2010CN101893209A Method and device for packaging high-power modular LED light source
11/24/2010CN101281900B Systematism package with structure for preventing ball pad from pollution as well as manufacturing method thereof
11/23/2010US7839209 Tunnel field effect transistor
11/23/2010US7839169 Programmable logic device with embedded switch fabric
11/23/2010US7839167 Interconnection and input/output resources for programmable logic integrated circuit devices
11/23/2010US7839166 Configurable IC with logic resources with offset connections
11/23/2010US7838841 Measuring momentum for charged particle tomography
11/18/2010WO2010132724A1 System-in packages
11/18/2010WO2010131679A1 Semiconductor device
11/18/2010WO2010131578A1 Semiconductor device with built-in optical signal input and output device and electronic device equipped with same
11/18/2010WO2010068490A8 Die-to-die power consumption optimization
11/18/2010US20100290221 Multiple component solid state white light
11/18/2010US20100289156 Semiconductor device
11/18/2010US20100289131 Semiconductor Device and Method of Forming Overlapping Semiconductor Die with Coplanar Vertical Interconnect Structure
11/18/2010DE202010008326U1 LED-Anordnung LED array
11/18/2010DE102010002319A1 Energiemodulanordnung Power module assembly
11/18/2010DE102009029044B3 Power semiconductor module, has series circuit comprising resistors that are connected in parallel to thyristors and diodes, where diodes and resistors are integrated in semiconductor chips that are connected with each other
11/18/2010DE102009002993A1 Leistungshalbleitermodul mit beabstandeten Schaltungsträgern Power semiconductor module having spaced circuit boards
11/17/2010EP2251182A2 Method for bonding plastic micro chip
11/17/2010EP2250681A2 Light emitting module and display device having the same
11/17/2010EP2250672A1 Semiconductor stack assembly having reduced thermal spreading resistance and methods of making same
11/17/2010CN201638816U LED integrated light source plate and special-purpose die
11/17/2010CN201638815U Circular LED light source module for lighting
11/17/2010CN201638814U LED (Light-Emitting Diode) light source module
11/17/2010CN201638813U Novel LED lamp tube module
11/17/2010CN201638812U Novel high-power LED packaging structure
11/17/2010CN201638811U Encapsulation structure for large-power LED
11/17/2010CN201636570U Optical fiber light source generator
11/17/2010CN1853272B Electronic package having a folded flexible substrate and method of manufacturing the same
11/17/2010CN1750277B Light emitting diode grain structure with AC loop
11/17/2010CN101889345A Substrate for an led submount, and led submount
11/17/2010CN101887891A Electronic apparatus, high-voltage power source and printed circuit board
11/17/2010CN101887890A Lighting module, backlight unit, and display device
11/17/2010CN101887889A LED integrated circuit module and LED display module
11/17/2010CN101887888A Power semiconductor module including substrates spaced from each other
11/17/2010CN101887887A 3d integration structure and method using bonded metal planes
11/17/2010CN101887886A Multi-die package and manufacturing method thereof
11/17/2010CN101887885A Stacking structure of semiconductor packages
11/17/2010CN101887876A Semiconductor package, lead frame, and wiring board with the same
11/17/2010CN101886761A LED light source module
11/17/2010CN101886759A Light emitting device using alternating current and manufacturing method thereof
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